公开(公告)号：US07554795B2

公开(公告)日：2009-06-30

申请号：US11597880

申请日：2005-06-03

申请人： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

发明人： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC分类号： H01G9/15

CPC分类号： H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

摘要： An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.

摘要翻译： 电子部件具有元件，设置在元件上的一对端子部分和覆盖端子部分和元件的一部分的外部覆盖材料。 电子部件被构造成使得倾斜部分设置在外包覆材料的底表面和侧表面的角部上，并且端子部分从外部覆盖材料的倾斜部分和底表面相交的角部突出 。

公开(公告)号：US07466021B2

公开(公告)日：2008-12-16

申请号：US11381357

申请日：2006-05-02

申请人： Joseph Charles Fjelstad

发明人： Joseph Charles Fjelstad

IPC分类号： H01L23/04

CPC分类号： G11C5/04 ,  B82Y10/00 ,  G01R31/2822 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K1/0243 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

摘要翻译： 公开了具有楼梯阶层并且没有电镀通孔的IC封装结构。 这样的结构可以被制造成分立的封装或者条带，例如可能有利于与存储器件一起使用，其中关键或高速信号可以沿着多芯片条封装的长度布线，而不必使信号上升， 随着信号在设备之间传输，从其上安装组件的互连基板下降到IC封装端接和返回。

公开(公告)号：US20080026602A1

公开(公告)日：2008-01-31

申请号：US11868085

申请日：2007-10-05

申请人： Alan Wang ,  Kevin Olson

发明人： Alan Wang ,  Kevin Olson

IPC分类号： H01R12/00

CPC分类号： H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

摘要翻译： 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体保形地沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20080024960A1

公开(公告)日：2008-01-31

申请号：US11597880

申请日：2005-06-03

申请人： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

发明人： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC分类号： B29C45/14 ,  H05K7/00

CPC分类号： H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

摘要： The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

摘要翻译： 本发明的目的是提供一种以低成本制造工艺制造的电子部件，同时实现耐冲击性，耐久性，抗弯曲性，安装可靠性等的改善，而不需要微调等。本发明是 具有元件2的电子部件1，设置在元件2上的一对端子部4和覆盖端子部4的一部分和元件2的外部覆盖材料5， 倾斜部分10设置在底面9的角部和外部覆盖材料5的侧面的方式，端子部4从外部覆盖材料的倾斜部10和底面9的角部突出 相交。

公开(公告)号：US07291037B2

公开(公告)日：2007-11-06

申请号：US11476849

申请日：2006-06-29

申请人： Ching-Cheng Tsai

发明人： Ching-Cheng Tsai

IPC分类号： H01R12/24

CPC分类号： H05K1/118 ,  H01R12/592 ,  H05K1/117 ,  H05K2201/09154 ,  H05K2203/0346 ,  Y10S439/951

摘要： A flexible circuit board is provided, comprising a flexible substrate having an upper surface and a lower surface and a plurality of electrically conductive pads overlaid on an upper surface of the flexible substrate. Front ends of the electrically conductive pads do not reach a front edge of the flexible substrate and are separated from the front edge of the flexible substrate by a distance.

摘要翻译： 提供一种柔性电路板，包括具有上表面和下表面的柔性基板和覆盖在柔性基板的上表面上的多个导电焊盘。 导电焊盘的前端没有到达柔性基板的前边缘并且与柔性基板的前边缘分开一段距离。

公开(公告)号：US20070012788A1

公开(公告)日：2007-01-18

申请号：US11181741

申请日：2005-07-15

申请人： Chien-Yuan Chen

发明人： Chien-Yuan Chen

IPC分类号： G06K19/06

CPC分类号： H05K3/0052 ,  H05K3/0032 ,  H05K3/284 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1316

摘要： A manufacturing process for encapsulation and cutting memory cards, embodying a full-wafer circuit board substrate, whereon is distributed a plurality of sets of a number of chip modules assembled from passive component members, flash memory modules and control chips. A mold is then used to carry out full-wafer compression molding to seal the chip modules and passive component members onto the circuit board substrate, thereby forming a plurality of sets of memory cards having complete electric functionality. Grooves are formed between neighboring memory cards when carrying out the compression molding process, which enable direct chamfering of edges and corners of each of the memory cards after cutting, thereby eliminating the need for further finishing.

摘要翻译： 一种用于封装和切割存储卡的制造方法，体现了全晶片电路板基板，其中分布有多组由无源元件，闪存模块和控制芯片组装的芯片模块。 然后使用模具进行全晶片压缩成型以将芯片模块和无源组件构件密封到电路板基板上，从而形成具有完整电功能的多组存储卡。 在执行压缩成型工艺时，在相邻的存储卡之间形成槽，这能够在切割之后直接倒角每个存储卡的边缘和拐角，从而不需要进一步精加工。

公开(公告)号：US07153143B2

公开(公告)日：2006-12-26

申请号：US11292082

申请日：2005-12-02

申请人： Thomas Muench

发明人： Thomas Muench

IPC分类号： H01R12/00

CPC分类号： H01L24/05 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/113 ,  H05K1/117 ,  H05K1/185 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2203/049 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

公开(公告)号：US20060244150A1

公开(公告)日：2006-11-02

申请号：US11381357

申请日：2006-05-02

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L23/48

CPC分类号： G11C5/04 ,  B82Y10/00 ,  G01R31/2822 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K1/0243 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

公开(公告)号：US07112098B2

公开(公告)日：2006-09-26

申请号：US10759304

申请日：2004-01-20

申请人： Tsutomu Matsuo ,  Masakazu Nagata

发明人： Tsutomu Matsuo ,  Masakazu Nagata

IPC分类号： H01R24/00

CPC分类号： H05K1/117 ,  H01R12/722 ,  H05K1/144 ,  H05K2201/09154 ,  H05K2201/2027

摘要： A transmission board (10) comprises a frame body (30) and a surface board (20) supported by the frame body (30) and having a transmission circuit. The frame body (30) has plugging edges (33, 34) that project from the edges of the surface board (20) for guiding the terminals of mating connectors to connection pads on the surface board (20). The plugging edges have guiding slopes 33A and 33B, and 34A and 34B. At least the plugging edges of the frame body (30) are made of a metal or resin molding.

摘要翻译： 传输板（10）包括框体（30）和由框体（30）支撑并具有传输电路的表面板（20）。 框体（30）具有从表面板（20）的边缘突出的插入边缘（33,34），用于将配合连接器的端子引导到表面板（20）上的连接焊盘。 堵塞边缘具有引导斜面33A和33B以及34A和34B。框体（30）的至少堵塞边缘由金属或树脂模塑制成。

公开(公告)号：US06879040B2

公开(公告)日：2005-04-12

申请号：US10649005

申请日：2003-08-26

申请人： Kee Yean Ng ,  Gurbir Singh

发明人： Kee Yean Ng ,  Gurbir Singh

IPC分类号： H01C1/14 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L33/486 ,  H01C1/14 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

摘要翻译： 可表面安装的电子设备包括具有用于安装设备的第一表面的主体。 第一表面在其中具有凹部。 电触头设置在第一表面。 电触点包括形成所述凹部的至少一个内表面的至少一部分的第一部分。