公开(公告)号：US20120267796A1

公开(公告)日：2012-10-25

申请号：US13306099

申请日：2011-11-29

申请人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L23/50

CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1047 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/15151 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15172 ,  H01L2924/15182 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.

摘要翻译： 微电子组件可以包括具有第一和第二表面的基板和在其间延伸的孔，该基板具有端子。 组件还可以包括具有面向衬底的第一表面的前表面的第一微电子元件，具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面的第二微电子元件，第一和第二引线电 将相应的第一和第二微电子元件的触点连接到端子，以及第三引线将第一和第二微电子元件的触点电互连。 第一微电子元件的触点可以在靠近其边缘的前表面暴露。 第二微电子元件的触点可以设置在其前表面的中心区域中。 第一，第二和第三引线可以具有与孔对准的部分。

公开(公告)号：US08254155B1

公开(公告)日：2012-08-28

申请号：US13354747

申请日：2012-01-20

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： G11C5/06 ,  H01L23/02

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly can include first and second microelectronic packages mounted to opposed surfaces of a circuit panel. Each package can include a substrate having first, second, and third apertures extending therethrough, first, second, and third microelectronic elements each having a surface facing the first surface of the substrate and a plurality of contacts aligned with at least one of the apertures, a plurality of terminals exposed at the second surface in a central region thereof, and leads connected between the contacts of each microelectronic element and the terminals. The apertures of each substrate can have first, second, and third axes extending in directions of their lengths. The first and second axes can be parallel to one another. The third axis can be transverse to the first and second axes. The terminals of each package can be configured to carry all of the address signals transferred to the respective package.

摘要翻译： 微电子组件可以包括安装到电路板的相对表面的第一和第二微电子封装。 每个封装可以包括具有延伸穿过其中的第一，第二和第三孔的衬底，每个具有面向衬底的第一表面的表面的第一，第二和第三微电子元件以及与至少一个孔对准的多个触点， 在其中央区域的第二表面处露出的多个端子，以及连接在每个微电子元件的触点和端子之间的引线。 每个基板的孔可以具有在其长度方向上延伸的第一，第二和第三轴。 第一和第二轴线可以彼此平行。 第三轴线可以横向于第一和第二轴线。 每个封装的端子可以配置为承载传送到相应封装的所有地址信号。

公开(公告)号：US08222725B2

公开(公告)日：2012-07-17

申请号：US12883811

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/00013

摘要： A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.

摘要翻译： 微电子组件包括互连元件，元件触点，第一和第二金属层，导电元件以及第一和第二微电子器件。 第一金属层可以延伸超出第一微电子器件的至少一个边缘。 导电元件可以分别延伸超过第一金属层的至少一个边缘。 第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面，使得可以为导电元件实现期望的阻抗。 导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。 第二金属层可以连接到参考电位源。

公开(公告)号：US09123713B2

公开(公告)日：2015-09-01

申请号：US13989314

申请日：2011-11-21

申请人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

发明人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L23/495 ,  H01L23/13 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/13 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49052 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/20751 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic structure includes a first row of contacts (14) and a second row of contacts (24) offset from the first row, so that the first and second rows cooperatively define pairs of contacts. These pairs of contacts include first pairs (30a) and second pairs (30b) arranged in alternating sequence in the row direction. The first pairs are provided with low connectors (32a), whereas the second pairs are provided with high connectors (32b). The high connectors and low connectors have sections vertically offset from one another to reduce mutual impedance between adjacent connectors.

摘要翻译： 微电子结构包括第一排触点（14）和从第一行偏移的第二行触点（24），使得第一和第二行协作地限定成对的触点。 这些触点对包括沿行方向交替排列的第一对（30a）和第二对（30b）。 第一对设置有低连接器（32a），而第二对具有高连接器（32b）。 高连接器和低连接器具有彼此垂直偏移的部分，以减少相邻连接器之间的相互阻抗。

公开(公告)号：US08928153B2

公开(公告)日：2015-01-06

申请号：US13306099

申请日：2011-11-29

申请人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L23/48 ,  H01L25/16 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1047 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/15151 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15172 ,  H01L2924/15182 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.

摘要翻译： 微电子组件可以包括具有第一和第二表面的基板和在其间延伸的孔，该基板具有端子。 组件还可以包括具有面向衬底的第一表面的前表面的第一微电子元件，具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面的第二微电子元件，第一和第二引线电 将相应的第一和第二微电子元件的触点连接到端子，以及第三引线将第一和第二微电子元件的触点电互连。 第一微电子元件的触点可以在靠近其边缘的前表面暴露。 第二微电子元件的触点可以设置在其前表面的中心区域中。 第一，第二和第三引线可以具有与孔对准的部分。

公开(公告)号：US08786083B2

公开(公告)日：2014-07-22

申请号：US12883821

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/52

CPC分类号： H01L23/64 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/43

摘要： A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

摘要翻译： 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

公开(公告)号：US08659143B2

公开(公告)日：2014-02-25

申请号：US13440299

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/52 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H01L23/04 ,  H05K7/00 ,  H05K1/18 ,  H01L21/82

CPC分类号： H01L25/0657 ,  G06F1/18 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/525 ,  H01L23/5385 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

摘要： A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semiconductor chips. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location. The central region may have a width not more than 3.5 times a minimum pitch between adjacent terminal columns. The axial plane can intersect the central region.

摘要翻译： 微电子封装可以包括衬底和微电子元件，微电子元件具有面向衬底的第一表面的后表面，正面和沿第一方向延伸的元件触点列。 微电子元件可以包括堆叠的电互连半导体芯片。 微电子元件的边缘可以限定在垂直于后表面的第一方向和第三方向上延伸的轴向平面。 封装可以包括在基板的第二表面处沿第一方向延伸的端子列。 终端可以包括暴露在第二表面的中心区域中的第一终端，并且被配置为携带可用于封装内的电路的地址信息，以确定可寻址的存储器位置。 中心区域可以具有不超过相邻端柱之间最小间距的3.5倍的宽度。 轴向平面可以与中心区域相交。

公开(公告)号：US08659141B2

公开(公告)日：2014-02-25

申请号：US13440280

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/52 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H01L23/04 ,  H05K7/00 ,  H05K1/18 ,  H01L21/82

CPC分类号： H01L25/0657 ,  G11C5/04 ,  G11C5/063 ,  G11C5/066 ,  G11C8/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85

摘要： A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子组件可以包括与电路板连接的微电子封装。 封装具有微电子元件，其具有背向封装的衬底的前表面，并且通过在前表面上方延伸的导电结构与衬底电连接。 提供在第一和第二并联栅格中或第一和第二单独列中的第一端子可被配置为承载可用于从存储器存储阵列的所有可寻址的存储器位置中确定可寻址存储器位置的地址信息。 第一网格中的第一终端可以具有作为第二网格中的第一终端的信号分配的镜像的信号分配。

公开(公告)号：US08629545B2

公开(公告)日：2014-01-14

申请号：US13439354

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/02

CPC分类号： H01L23/49838 ,  G11C5/04 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/4824 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/108 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06156 ,  H01L2224/06164 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81805 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system or microelectronic assembly can include one or more microelectronic packages each having a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.

摘要翻译： 系统或微电子组件可以包括一个或多个微电子封装，每个微电子封装均具有衬底和微电子元件，微电子元件具有面和在其上的一个或多个触点列，其面对并连接到衬底的表面上的对应触点。 轴向平面可以沿着第一方向的线与面相交，并且相对于元件触点的列居中。 封装端子的列可以沿第一方向延伸。 可以将第二表面的中心区域中的第一端子配置为携带可用于确定微电子元件内的可寻址存储器位置的地址信息。 中心区域可以具有不大于封装端子列之间的最小间距的三倍和五倍的宽度。 轴向平面可以与中心区域相交。

公开(公告)号：US08466564B2

公开(公告)日：2013-06-18

申请号：US13278506

申请日：2011-10-21

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/48 ,  H01L29/40

CPC分类号： H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements.

摘要翻译： 微电子组件包括具有至少一个孔的电介质元件和其上的导电元件，其中包括在电介质元件的第二表面处暴露的端子; 第一微电子元件，其具有后表面和面向介电元件的前表面，所述第一微电子元件具有在其前表面处暴露的多个触点; 第二微电子元件，其具有背表面和面向第一微电子元件的后表面的前表面，第二微电子元件具有暴露在前表面处并突出超过第一微电子元件的边缘的多个触点; 以及连接到电介质元件并且至少部分地定位在第一和第二孔之间的导电平面，导电平面与第一或第二微电子元件中的至少一个的一个或多个触点电连接。