公开(公告)号：US08890304B2

公开(公告)日：2014-11-18

申请号：US13155719

申请日：2011-06-08

申请人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/04 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/03 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24225 ,  H01L2224/245 ,  H01L2224/29008 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82104 ,  H01L2224/8284 ,  H01L2224/83053 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces have at least portions extending along the front face away from the contacts, at least some of which also extend along the first surface of the dielectric material. Contacts are connected with the traces, at least some of which are disposed at the first surface of the dielectric material. The substrate has first and second opposed surfaces and an edge extending therebetween, the first surface facing the front face of the microelectronic unit, and the second surface having a plurality of terminals thereon configured for electrical connection with at least one external component. Masses of conductive matrix material join the terminals with the redistribution contacts.

摘要翻译： 微电子封装包括微电子单元和衬底。 微电子单元包括具有在正面上的触点的微电子元件。 电介质材料具有与微电子元件的前表面基本齐平的第一表面。 导电迹线具有至少部分，其沿前表面延伸远离触点，其中至少一些部分还沿电介质材料的第一表面延伸。 触头与迹线连接，其中至少一些设置在电介质材料的第一表面。 衬底具有第一和第二相对表面和在其间延伸的边缘，第一表面面向微电子单元的前表面，并且第二表面具有多个端子，其构造成用于与至少一个外部部件电连接。 导电基体材料的质量与再分布接触端子连接。

公开(公告)号：US08841765B2

公开(公告)日：2014-09-23

申请号：US13092376

申请日：2011-04-22

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia

IPC分类号： H01L23/34

CPC分类号： H01L25/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/20645 ,  H05K3/303 ,  H05K2201/10159 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly can include a substrate having first and second surfaces, at least two logic chips overlying the first surface, and a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting a rear surface of each logic chip. The substrate can have conductive structure thereon and terminals exposed at the second surface for connection with a component. Signal contacts of each logic chip can be directly electrically connected to signal contacts of the other logic chips through the conductive structure of the substrate for transfer of signals between the logic chips. The logic chips can be adapted to simultaneously execute a set of instructions of a given thread of a process. The contacts of the memory chip can be directly electrically connected to the signal contacts of at least one of the logic chips through the conductive structure of the substrate.

摘要翻译： 微电子组件可以包括具有第一表面和第二表面的衬底，覆盖在第一表面上的至少两个逻辑芯片，以及存储芯片，其具有在其上的触点的前表面，存储芯片的前表面面对每个逻辑芯片的后表面 。 衬底可以具有导电结构，并且端子在第二表面处暴露以与部件连接。 每个逻辑芯片的信号触点可以通过衬底的导电结构直接电连接到其他逻辑芯片的信号触点，用于在逻辑芯片之间传输信号。 逻辑芯片可以适于同时执行一个给定的进程线程的一组指令。 存储器芯片的触点可以通过衬底的导电结构直接电连接到至少一个逻辑芯片的信号触点。

公开(公告)号：US08736066B2

公开(公告)日：2014-05-27

申请号：US13051424

申请日：2011-03-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

摘要： A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the microelectronic element having active semiconductor devices therein. A first opening extends from an exposed surface of the first element towards the surface attached to the microelectronic element, and a second opening extends from the first opening to a first one of the conductive pads, wherein where the first and second openings meet, interior surfaces of the first and second openings extend at different angles relative to the major surface of the microelectronic element. A conductive element extends within the first and second openings and contacts the at least one conductive pad.

摘要翻译： 提供了一种微电子组件，其包括基本上由半导体或无机电介质材料中的至少一种构成的第一元件，该介电材料具有面向并附着到微电子元件的主表面的表面，在该电子元件的主表面处暴露多个导电焊盘，该微电子元件具有 其中有源半导体器件。 第一开口从第一元件的暴露表面延伸到附接到微电子元件的表面，并且第二开口从第一开口延伸到第一导电焊盘中，其中第一和第二开口相交，其中内表面 第一和第二开口相对于微电子元件的主表面以不同的角度延伸。 导电元件在第一和第二开口内延伸并接触至少一个导电垫。

公开(公告)号：US08685793B2

公开(公告)日：2014-04-01

申请号：US12883421

申请日：2010-09-16

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/522

CPC分类号： H01L24/80 ,  H01L21/6835 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/0231 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/2401 ,  H01L2224/2405 ,  H01L2224/24146 ,  H01L2224/244 ,  H01L2224/2512 ,  H01L2224/32225 ,  H01L2224/82005 ,  H01L2224/821 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2225/06544 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can be formed by juxtaposing a first electrically conductive element overlying a major surface of a first semiconductor element with an electrically conductive pad exposed at a front surface of a second semiconductor element. An opening can be formed extending through the conductive pad of the second semiconductor element and exposing a surface of the first conductive element. The opening may alternatively be formed extending through the first conductive element. A second electrically conductive element can be formed extending at least within the opening and electrically contacting the conductive pad and the first conductive element. A third semiconductor element can be positioned in a similar manner with respect to the second semiconductor element.

公开(公告)号：US08610264B2

公开(公告)日：2013-12-17

申请号：US12962806

申请日：2010-12-08

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02123 ,  H01L2224/0215 ,  H01L2224/0311 ,  H01L2224/0332 ,  H01L2224/03466 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05186 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/06

摘要： A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element can include a joining portion overlying the recess and extending from an anchor portion supported by the substrate. The joining portion can be at least partially exposed at the major surface for connection to a component external to the microelectronic unit.

公开(公告)号：US08513817B2

公开(公告)日：2013-08-20

申请号：US13346201

申请日：2012-01-09

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

IPC分类号： H01L23/52

CPC分类号： H01L25/0655 ,  G11C5/04 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01076 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. The front surfaces of the microelectronic elements can be arranged in a single plane parallel to the first surface. Each microelectronic element can have a column of contacts exposed at the front surface and arranged along respective first, second, third, and fourth axes. The first and third axes can be parallel to one another. The second and fourth axes can be transverse to the first and third axes. The microelectronic package can also include electrical connections extending from at least some of the contacts of each microelectronic element to at least some of the terminals.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，第一，第二，第三和第四微电子元件以及在第二表面处暴露的多个端子。 每个微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 微电子元件的前表面可以布置在平行于第一表面的单个平面中。 每个微电子元件可以具有在前表面处暴露并且沿着相应的第一，第二，第三和第四轴线布置的触点列。 第一和第三轴线可以彼此平行。 第二和第四轴线可以横向于第一和第三轴线。 微电子封装还可以包括从每个微电子元件的至少一些触点延伸到至少一些端子的电连接。

公开(公告)号：US20120313253A1

公开(公告)日：2012-12-13

申请号：US13155719

申请日：2011-06-08

申请人： Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg ,  Hiroaki Sato ,  Kiyoaki Hashimoto

发明人： Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg ,  Hiroaki Sato ,  Kiyoaki Hashimoto

IPC分类号： H01L23/522 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/03 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24225 ,  H01L2224/245 ,  H01L2224/29008 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82104 ,  H01L2224/8284 ,  H01L2224/83053 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces have at least portions extending along the front face away from the contacts, at least some of which also extend along the first surface of the dielectric material. Contacts are connected with the traces, at least some of which are disposed at the first surface of the dielectric material. The substrate has first and second opposed surfaces and an edge extending therebetween, the first surface facing the front face of the microelectronic unit, and the second surface having a plurality of terminals thereon configured for electrical connection with at least one external component. Masses of conductive matrix material join the terminals with the redistribution contacts.

摘要翻译： 微电子封装包括微电子单元和衬底。 微电子单元包括具有在正面上的触点的微电子元件。 电介质材料具有与微电子元件的前表面基本齐平的第一表面。 导电迹线具有沿着前表面远离触点延伸的至少部分，其中至少一些部分还沿电介质材料的第一表面延伸。 触头与迹线连接，其中至少一些设置在电介质材料的第一表面。 衬底具有第一和第二相对表面和在其间延伸的边缘，第一表面面向微电子单元的前表面，并且第二表面具有多个端子，其构造成用于与至少一个外部部件电连接。 导电基体材料的质量与再分布接触端子连接。

公开(公告)号：US20120199926A1

公开(公告)日：2012-08-09

申请号：US13114243

申请日：2011-05-24

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L31/18 ,  H01L27/146

CPC分类号： H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US20120199925A1

公开(公告)日：2012-08-09

申请号：US13111258

申请日：2011-05-19

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14609 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/1464 ,  H01L27/14645

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域具有覆盖第一和第二光感测元件中的至少一个的开口，该半导体区域在第一光感测元件和后表面之间具有第一厚度，在第二光感测元件与后表面之间具有第二厚度。 光吸收材料覆盖至少一个感光元件之内的开口内的半导体区域，使得第一和第二光感测元件接收基本上相同强度的光。

公开(公告)号：US20120146210A1

公开(公告)日：2012-06-14

申请号：US12962806

申请日：2010-12-08

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L25/065 ,  H01L21/98 ,  H01L21/60 ,  H01L27/06

CPC分类号： H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02123 ,  H01L2224/0215 ,  H01L2224/0311 ,  H01L2224/0332 ,  H01L2224/03466 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05186 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/06

摘要： A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element can include a joining portion overlying the recess and extending from an anchor portion supported by the substrate. The joining portion can be at least partially exposed at the major surface for connection to a component external to the microelectronic unit.

摘要翻译： 微电子组件包括衬底和导电元件。 衬底可以具有小于10ppm /℃的CTE，具有不延伸穿过衬底的凹部的主表面和设置在凹部内的弹性模量小于10GPa的材料。 导电元件可以包括覆盖凹部并从由衬底支撑的锚定部分延伸的接合部分。 连接部分可以在主表面处至少部分地暴露以连接到微电子单元外部的部件。