公开(公告)号：US20050270160A1

公开(公告)日：2005-12-08

申请号：US10860071

申请日：2004-06-04

申请人： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

发明人： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

IPC分类号： G06K17/00 ,  G06K19/077 ,  G06Q10/00 ,  G08B1/08

CPC分类号： G06K19/07749 ,  G06K2017/0045 ,  G06Q10/087

摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).

摘要翻译： 用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。 该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个 的货物被运输和跟踪。 或者，该装置可以通过其他方式（例如，粘合剂）附接。 托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量 ，类型等）。

公开(公告)号：US20050224251A1

公开(公告)日：2005-10-13

申请号：US10920235

申请日：2004-08-18

申请人： Irving Memis ,  Kostas Papathomas

发明人： Irving Memis ,  Kostas Papathomas

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/14 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC分类号： H01L23/145 ,  H01L21/48 ,  H01L21/50 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/0209 ,  H01L2924/00

摘要： A circuitized substrate comprising a first layer comprised of a dielectric material including a low moisture absorptive polymer resin in combination with a nodular fluoropolymer web encased within the resin, the resulting dielectric layer formed from this combination not including continuous or semi-continuous fibers as part thereof. The substrate further includes at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate are also provided, as is an information handling system (e.g., computer) incorporating the circuitized substrate of the invention as part thereof.

摘要翻译： 电路化基板，包括由介电材料组成的第一层，该电介质材料包括与包含在树脂内的结节状含氟聚合物纤维网结合的低吸水性聚合物树脂，由该组合形成的所得电介质层不包括连续或半连续纤维作为其一部分 。 衬底还包括位于电介质第一层上的至少一个电路化层。 还提供电气组件和制造基板的方法，如本发明的电路化基板作为其一部分的信息处理系统（例如，计算机）。

公开(公告)号：US06900392B2

公开(公告)日：2005-05-31

申请号：US10933260

申请日：2004-09-03

申请人： James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich

发明人： James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich

IPC分类号： H05K3/32 ,  H05K3/46 ,  H05K1/03

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

公开(公告)号：US20050039950A1

公开(公告)日：2005-02-24

申请号：US10955741

申请日：2004-09-30

申请人： Benson Chan ,  John Lauffer

发明人： Benson Chan ,  John Lauffer

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K7/06

CPC分类号： H01L23/5383 ,  H01L23/3128 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuitized substrate including a plurality of conductive and dielectric layers and also a plurality of conductive thru-holes therein for passing high speed signals, e.g., from one component to another mounted on the substrate. The substrate utilizes a signal routing pattern which uses the maximum length of each of the thru-holes wherever possible to thereby substantially eliminate signal loss (noise) due to thru-hole “stub” resonance. A multilayered circuitized substrate assembly using more than one circuitized substrate, an electrical assembly using a circuitized substrate and one or more electrical components, a method of making the circuitized substrate and an information handling system incorporating one or more circuitized substrate assemblies and attached components are also provided.

摘要翻译： 电路化基板，其包括多个导电和电介质层，并且还包括多个导电通孔，用于使高速信号例如从安装在基板上的一个部件传递到另一个部件。 衬底利用信号路由图案，其中尽可能地使用每个通孔的最大长度，从而基本上消除由于通孔“短线”共振引起的信号损失（噪声）。 使用多于一个电路化基板的多层电路化基板组件，使用电路化基板和一个或多个电气部件的电气组件，制造电路化基板的方法和结合有一个或多个电路化基板组件和附接部件的信息处理系统也是 提供。

公开(公告)号：US20050005438A1

公开(公告)日：2005-01-13

申请号：US10616932

申请日：2003-07-11

申请人： John Durkot

发明人： John Durkot

IPC分类号： G01R23/04 ,  G01R31/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K3/4638 ,  G01R31/2813 ,  H05K1/0268 ,  H05K3/0047 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/162 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method for testing opening patterns in an active area of a PCB wherein two arrays of test patterns of apertured pads are analyzed following drilling therethrough in accordance with a specified manner. Specifically, the outer patterns are first tested and if failure results in one or more of said patterns, an inner array of patterns closer to the active area are then tested and, significantly, only the respective test pattern nearest the associated array of openings is used to determine whether said array of openings meets the designated spacing criteria.

摘要翻译： 一种用于测试PCB有源区域中的开口图案的方法，其中根据指定的方式在钻孔之后分析孔径焊盘的测试图案的两个阵列。 具体地，首先测试外部图案，并且如果失败导致所述图案中的一个或多个，则然后测试更接近有源区域的图案的内部阵列，并且显着地仅使用最接近相关联的开口阵列的各个测试图案 以确定所述开口阵列是否满足指定的间隔标准。

公开(公告)号：US20040231888A1

公开(公告)日：2004-11-25

申请号：US10811817

申请日：2004-03-30

申请人： Endicott Interconnect Technologies, Inc.

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K001/00

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.

公开(公告)号：US20040183212A1

公开(公告)日：2004-09-23

申请号：US10423877

申请日：2003-04-28

申请人： Endicott Interconnect technologies, Inc.

发明人： David Alcoe

IPC分类号： H01L023/48 ,  H01L029/40

CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/16195 ,  H05K1/113 ,  H05K1/114 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3426 ,  H05K3/4602 ,  H05K2201/09454 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T29/49149 ,  H01L2224/0401

摘要： An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile pressure of about 1.4 grams per square mil or greater.

摘要翻译： 一种利用其的电子封装和信息处理系统，其中封装衬底包括耦合到外部焊盘的内部导电层，并且具有足够大的尺寸以足以基本上防止衬垫经受拉伸时的焊盘的开裂，分离等 约1.4克/平方密度或更大的压力。

公开(公告)号：US20040177998A1

公开(公告)日：2004-09-16

申请号：US10811915

申请日：2004-03-30

申请人： Endicott Interconnect Technologies, Inc.

发明人： James W. Fuller JR. ,  John M. Lauffer ,  Voya R. Markovich

IPC分类号： H05K001/11 ,  H01R012/04 ,  H05K003/30

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

公开(公告)号：US20040163964A1

公开(公告)日：2004-08-26

申请号：US10370529

申请日：2003-02-24

申请人： Endicott Interconnect Technologies, Inc.

发明人： Frank D. Egitto ,  Voya P. Markovich ,  Thomas R. Miller

IPC分类号： C25D005/02

CPC分类号： H05K3/4644 ,  H05K1/112 ,  H05K3/423 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/0733

摘要： A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like. The structure, including such a chip and circuit board is ideally suited for use within an information handling system.

摘要翻译： 一种制造电路化基板的方法，其中共用层在诸如用于将芯片耦合到印刷电路板等的层叠插入件的多层部件中形成多个基本上垂直排列的导电开口。 包括这种芯片和电路板的结构非常适合在信息处理系统中使用。

公开(公告)号：US20040118596A1

公开(公告)日：2004-06-24

申请号：US10322527

申请日：2002-12-19

申请人： Endicott Interconnect Technologies, Inc.

发明人： James W. Fuller JR. ,  John M. Lauffer ,  Voya R. Markovich

IPC分类号： H05K001/11

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

摘要翻译： 电路化基板组件及其制造方法，其中所述组件包括结合在一起的各个电路化基板。 基板各自包括至少一个开口，其中仅一个开口在接合之前基本上填充有导电浆料。 一旦粘合，糊料也部分地位于另一个开口内，以提供与其的有效电连接。