公开(公告)号：US20130316501A1

公开(公告)日：2013-11-28

申请号：US13955720

申请日：2013-07-31

申请人： Tessera, Inc.

发明人： Kenneth Allen Honer ,  Philip Damberg

IPC分类号： H01L21/768 ,  H01L21/56

CPC分类号： H01L21/768 ,  H01L21/56 ,  H01L23/055 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.

摘要翻译： 一种微电子封装，包括具有顶表面和底表面的电介质层，所述电介质层具有在底表面处露出的端子; 金属壁结合到电介质层并从电介质层的顶表面向上突出并围绕顶表面的区域; 金属盖结合到壁上并在顶表面的区域上延伸，使得盖，壁和介电层协作地限定封闭空间; 以及设置在所述空间内并电连接到所述端子的微电子元件。

公开(公告)号：US08587126B2

公开(公告)日：2013-11-19

申请号：US13051414

申请日：2011-03-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

摘要翻译： 提供了一种微电子组件，其中分别暴露在第一和第二微电子元件的前表面处的第一和第二导电焊盘并置，每个微电子元件体现有源半导体器件。 导电元件可以在从第一微电子元件的后表面延伸到其前表面的第一开口内延伸，在从第一开口朝向第一微电子元件的前表面延伸的第二开口内，并且在第三开口 延伸穿过第一和第二垫中的至少一个以接触第一和第二垫。 第一和第二开口的内表面可分别相对于第一微电子元件的前表面在第一和第二方向上延伸，以限定大致的角度。

公开(公告)号：US20130299958A1

公开(公告)日：2013-11-14

申请号：US13989314

申请日：2011-11-21

申请人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

发明人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/13 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49052 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/20751 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic structure includes a first row of contacts (14) and a second row of contacts (24) offset from the first row, so that the first and second rows cooperatively define pairs of contacts. These pairs of contacts include first pairs (30a) and second pairs (30b) arranged in alternating sequence in the row direction. The first pairs are provided with low connectors (32a), whereas the second pairs are provided with high connectors (32b). The high connectors and low connectors have sections vertically offset from one another to reduce mutual impedance between adjacent connectors.

摘要翻译： 微电子结构包括第一排触点（14）和从第一行偏移的第二行触点（24），使得第一和第二行协作地限定成对的触点。 这些触点对包括沿行方向交替排列的第一对（30a）和第二对（30b）。 第一对设置有低连接器（32a），而第二对具有高连接器（32b）。 高连接器和低连接器具有彼此垂直偏移的部分，以减少相邻连接器之间的相互阻抗。

公开(公告)号：US08558386B2

公开(公告)日：2013-10-15

申请号：US12587714

申请日：2009-10-13

申请人： Joseph Fjelstad ,  Konstantine Karavakis

发明人： Joseph Fjelstad ,  Konstantine Karavakis

IPC分类号： H01L29/40

CPC分类号： H01L21/78 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/498 ,  H01L24/05 ,  H01L24/13 ,  H01L24/20 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05552

摘要： A method of making a semiconductor chip package is provided in which a compliant layer is provided over a contact bearing face of a semiconductor chip. The compliant layer can have a bottom surface adjacent to the chip face, a top surface facing away from the bottom surface, and at least one sloping surface between the top and bottom surfaces. The compliant layer can be disposed remote in a lateral direction along the contact bearing face from at least one contact adjacent to the sloping surface. Bond ribbons can be formed atop the compliant layer, wherein each bond ribbon electrically connects one of the contacts to an associated conductive terminal at the top surface of the compliant layer. The compliant layer can provide stress relief to the bond ribbons, such as during handling and affixing the assembly to an external substrate. A bond ribbon can include a strip extending along the sloping surface of the compliant layer, the strip having a substantially constant thickness in a direction extending away from the sloping surface.

摘要翻译： 提供一种制造半导体芯片封装的方法，其中柔性层设置在半导体芯片的接触支承面上方。 柔性层可以具有邻近芯片表面的底表面，背离底表面的顶表面以及顶表面和底表面之间的至少一个倾斜表面。 柔性层可以沿着邻近倾斜表面的至少一个接触件沿接触支承面在横向方向上远处设置。 结合带可以形成在顺应层上方，其中每个结合带将触点中的一个电连接到顺应层的顶表面处的相关联的导电端子。 顺应层可以对结合带提供应力消除，例如在处理和将组件固定到外部基板上时。 粘结带可以包括沿柔性层的倾斜表面延伸的条带，该带在远离倾斜表面的方向上具有基本上恒定的厚度。

公开(公告)号：US08553420B2

公开(公告)日：2013-10-08

申请号：US12907522

申请日：2010-10-19

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H05K7/00 ,  H05K1/11 ,  H05K1/14

CPC分类号： H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

摘要翻译： 微电子组件包括具有相对面对的第一和第二表面的介电元件和在表面之间延伸的一个或多个孔，该介电元件还在其上具有导电元件; 第一微电子元件，其具有背面和面向电介质元件的第一表面的前表面，第一微电子元件具有第一边缘和暴露在其前表面的多个触点; 第二微电子元件，包括具有背面和面向第一微电子元件的后表面的前表面，第二微电子元件的前表面的突出部分延伸超过第一微电子元件的第一边缘，突出部分为 与介电元件的第一表面间隔开，第二微电子元件具有在前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件或第二微电子元件中的至少一个的散热器。

公开(公告)号：US08551815B2

公开(公告)日：2013-10-08

申请号：US12671993

申请日：2008-08-01

申请人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

发明人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/00 ,  H01L21/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

摘要翻译： 提供堆叠的微电子单元，其具有远离顶表面的顶表面和底表面以及其中的多个垂直堆叠的微电子元件，包括至少一个微电子元件，其具有与顶表面相邻的前表面和朝向后表面 朝向底面。 每个微电子元件具有从前面的触点延伸超过微电子元件的边缘的迹线。 电介质层接触微电子元件的边缘并且位于至少一个微电子元件的后表面的下方。 引线连接到沿着介电层延伸的迹线。 在顶表面暴露的单元触点连接到引线。

公开(公告)号：US08531020B2

公开(公告)日：2013-09-10

申请号：US12938094

申请日：2010-11-02

申请人： Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

发明人： Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

IPC分类号： H01L23/02

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/78 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.

摘要翻译： 多个微电子组件是通过用设置在基板之间的微电子元件切断包括上基板和下基板的在线单元制成的。 在另一个实施例中，引线框架连接到基板，使得引线从该基板突出。 引线框架连接到具有设置在基板之间的一个或多个微电子元件的另一基板。

公开(公告)号：US08513799B2

公开(公告)日：2013-08-20

申请号：US12384868

申请日：2009-04-09

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

摘要： A microelectronic unit can include a support structure including a dielectric having oppositely-directed first and second surfaces. A plurality of substantially rigid posts can protrude parallel to one another in a direction beyond the first surface of the support structure. Each post may have a top surface remote from the support structure, and the top surfaces can be substantially coplanar with one another. A microelectronic device having a surface with bond pads can overlie the second surface of the support structure with the bond pad-bearing surface of the microelectronic device facing toward the support structure. Connections can electrically connect the posts with the bond pads.

公开(公告)号：US08502340B2

公开(公告)日：2013-08-06

申请号：US12964049

申请日：2010-12-09

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia

IPC分类号： H01L21/02

CPC分类号： H01L28/91 ,  H01L23/481 ,  H01L28/40 ,  H01L28/60 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A component includes a substrate and a capacitor formed in contact with the substrate. The substrate can consist essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C. The substrate can have a surface and an opening extending downwardly therefrom. The capacitor can include at least first and second pairs of electrically conductive plates and first and second electrodes. The first and second pairs of plates can be connectable with respective first and second electric potentials. The first and second pairs of plates can extend along an inner surface of the opening, each of the plates being separated from at least one adjacent plate by a dielectric layer. The first and second electrodes can be exposed at the surface of the substrate and can be coupled to the respective first and second pairs of plates.

摘要翻译： 组件包括基板和形成为与基板接触的电容器。 基底可以由具有小于10ppm /℃的热膨胀系数的材料组成。基底可以具有从其向下延伸的表面和开口。 电容器可以包括至少第一和第二对导电板以及第一和第二电极。 第一和第二对板可以与相应的第一和第二电位连接。 第一和第二对板可以沿着开口的内表面延伸，每个板通过电介质层与至少一个相邻的板分离。 第一和第二电极可以暴露在基板的表面，并且可以耦合到相应的第一和第二对板。

公开(公告)号：US08488294B2

公开(公告)日：2013-07-16

申请号：US12427048

申请日：2009-04-21

申请人： Matthew Schwiebert ,  Kenneth Honer ,  Nels Jewell-Larsen

发明人： Matthew Schwiebert ,  Kenneth Honer ,  Nels Jewell-Larsen

IPC分类号： H01T18/02 ,  H05F3/06

CPC分类号： B03C3/49 ,  B03C3/41 ,  B03C2201/04 ,  B03C2201/10 ,  B03C2201/14

摘要： An electrohydrodynamic fluid accelerator apparatus includes a corona electrode having an axial shape and configured to receive a first voltage. The electrohydrodynamic fluid accelerator apparatus includes a collector electrode disposed coaxially around the at least one corona electrode and configured to receive a second voltage. Application of the first and second voltages on the corona electrode and the collector electrode, respectively, causes fluid proximate to the corona electrode to ionize and travel in a first direction between the corona electrode and the collector electrode, thereby causing other fluid molecules to travel in a second direction to generate a fluid stream. In at least one embodiment of the invention, the ionized fluid proximate to the emitter electrode travels in a radial direction from the corona electrode to the collector electrode, causing the other fluid molecules to travel in an axial direction to thereby generate the fluid stream.

摘要翻译： 电动液体流体加速装置包括具有轴向形状并构造为接收第一电压的电晕电极。 电动液体流体加速装置包括集电极电极，其围绕至少一个电晕电极同轴设置，并且被配置为接收第二电压。 分别在电晕电极和集电极上施加第一和第二电压使得靠近电晕电极的流体在电晕电极和集电极之间沿第一方向电离并行进，从而使其它流体分子在 产生流体流的第二方向。 在本发明的至少一个实施例中，靠近发射极的离子化流体从电晕电极向集电极行进，使其它流体分子在轴向方向上行进从而产生流体流。