公开(公告)号：US09865832B2

公开(公告)日：2018-01-09

申请号：US14798298

申请日：2015-07-13

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L27/15 ,  H01L27/12 ,  H01L51/50 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683 ,  G09G3/3208

CPC classification number: H01L51/50 ,  G09G3/006 ,  G09G3/3208 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/32 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/156 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/97 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/053 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US09865577B2

公开(公告)日：2018-01-09

申请号：US15438587

申请日：2017-02-21

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: H01L33/50 ,  H01L25/16 ,  H01L25/075 ,  H01L27/32 ,  H01L51/52 ,  H01L33/52 ,  H01L33/58 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L25/167 ,  G02F1/133603 ,  G02F1/133617 ,  G02F2001/133614 ,  G09F9/00 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/322 ,  H01L27/3246 ,  H01L33/38 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L51/5281 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.

公开(公告)号：US09831383B2

公开(公告)日：2017-11-28

申请号：US14071106

申请日：2013-11-04

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

IPC: H01L29/18 ,  H01L33/08 ,  H01L23/00 ,  H01L33/00 ,  H01L33/40 ,  H01L21/67 ,  H01L27/15

CPC classification number: H01L33/08 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/405 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/95145 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

公开(公告)号：US09828244B2

公开(公告)日：2017-11-28

申请号：US14502994

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H01H59/00 ,  H01L41/113 ,  B81C99/00

CPC classification number: B81C99/002 ,  H01H59/0009 ,  H01L41/113

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

公开(公告)号：US20170125392A1

公开(公告)日：2017-05-04

申请号：US15405060

申请日：2017-01-12

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/60 ,  H01L33/54 ,  H01L33/06 ,  H01L33/00 ,  H01L33/56 ,  H01L33/44 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20170125391A1

公开(公告)日：2017-05-04

申请号：US15405042

申请日：2017-01-12

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L33/54 ,  H01L27/12 ,  H01L33/06 ,  H01L33/62 ,  H01L25/00 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US09582036B2

公开(公告)日：2017-02-28

申请号：US15157235

申请日：2016-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  G06F1/16 ,  G06F3/041 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了包括显示模块的显示模块和系统应用。 显示模块可以包括前表面，后表面和前表面上的显示区域的显示基板。 多个互连件从前表面延伸到后表面。 一组发光二极管（LED）在显示区域中并与多个互连电连接，一个或多个驱动电路位于显示基板的背面。 示例性的系统应用包括可穿戴的，可滚动的和可折叠的显示器。

公开(公告)号：US20160163765A1

公开(公告)日：2016-06-09

申请号：US14563772

申请日：2014-12-08

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L27/15 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/44 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/24 ,  H01L2251/5338 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y02E10/549 ,  Y02P70/521

Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 μm or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.

Abstract translation: 描述了适合的电子设备和用于形成这种设备的方法。 适应电子器件的实施例可以包括厚度为50μm或更小的硅衬底。 电耦合到控制器芯片的LED阵列可以形成在硅衬底的表面上。 在一个实施例中，顶部钝化层形成在LED阵列上，一个或多个控制器芯片和硅衬底的顶表面上。 实施例还包括形成在硅衬底的底表面上的底部钝化层。

公开(公告)号：US12243955B2

公开(公告)日：2025-03-04

申请号：US16399853

申请日：2019-04-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/06 ,  F21V7/00 ,  H01L27/15 ,  H01L29/06 ,  H01L33/00 ,  H01L33/04 ,  H01L33/28 ,  H01L33/30 ,  H01L25/075 ,  H01L33/20

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：US20240136345A1

公开(公告)日：2024-04-25

申请号：US18494109

申请日：2023-10-24

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.