公开(公告)号：US09553041B1

公开(公告)日：2017-01-24

申请号：US15162424

申请日：2016-05-23

申请人： Amkor Technology, Inc.

发明人： Michael G. Kelly ,  Ronald Patrick Huemoeller ,  Won Chul Do ,  David Jon Hiner

IPC分类号： H01L23/29 ,  H01L23/498 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L27/108

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/50 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3675 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L27/108 ,  H01L2221/68381 ,  H01L2224/13147 ,  H01L2224/29011 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75704 ,  H01L2224/75744 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. Methods and systems for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die.

摘要翻译： 公开了具有管芯到插入件晶片第一接合的半导体器件封装的方法和系统，并且可以包括将包括电子器件的多个半导体管芯结合到插入器晶片，以及在管芯和插入器晶片之间施加底部填充材料。 公开了具有管芯到基板的第一接合的半导体器件封装的方法和系统，并且可以包括将第一半导体管芯接合到封装基板，在第一半导体管芯和封装基板之间施加底部填充材料， 或更多的额外管芯到第一半导体管芯。 公开了具有管芯到管芯第一接合的半导体器件封装的方法和系统，并且可以包括将包括电子器件的一个或多个半导体管芯接合到插入器管芯。

公开(公告)号：US09508563B2

公开(公告)日：2016-11-29

申请号：US13548029

申请日：2012-07-12

申请人： Woon-Seong Kwon ,  Suresh Ramalingam

发明人： Woon-Seong Kwon ,  Suresh Ramalingam

IPC分类号： H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/4853 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75744 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/75987 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00014

摘要： A method for flip chip stacking includes forming a cavity wafer comprising a plurality of cavities and a pair of corner guides, placing a through-silicon-via (TSV) interposer with solder bumps coupled to a surface of the TSV interposer on the cavity wafer, such that the solder bumps are situated in the plurality of cavities and the TSV interposer is situated between the pair of corner guides, placing an integrated circuit (IC) die on another surface of the TSV interposer, such that the IC die, the TSV interposer, and the solder bumps form a stacked interposer unit, removing the stacked interposer unit from the cavity wafer, and bonding the solder bumps of the stacked interposer unit to an organic substrate such that the stacked interposer unit and the organic substrate form a flip chip.

摘要翻译： 一种用于倒装芯片堆叠的方法包括：形成包括多个空腔的空腔晶片和一对角引导件，将具有耦合到腔晶片上的TSV插入器表面的焊料凸块放置穿通硅通孔（TSV）插入器， 使得焊料凸块位于多个空腔中，并且TSV插入件位于一对拐角引导件之间，将集成电路（IC）管芯放置在TSV插入器的另一表面上，使得IC管芯，TSV插入器 并且焊料凸起形成堆叠的插入单元，从空腔晶片去除堆叠的中介层单元，并且将堆叠的插入单元的焊料凸块接合到有机基板，使得堆叠的插入单元和有机基板形成倒装芯片。

公开(公告)号：US20160079200A1

公开(公告)日：2016-03-17

申请号：US14636168

申请日：2015-03-02

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Naoyuki KOMUTA

IPC分类号： H01L23/00 ,  B23K37/04 ,  B23K3/04 ,  B23K1/00 ,  B23K3/08

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K3/0478 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/81048 ,  H01L2224/8115 ,  H01L2224/8116 ,  H01L2224/8117 ,  H01L2224/8118 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014

摘要： A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.

摘要翻译： 一种半导体器件的制造装置，包括：台，构造成面向台的头单元，构造成使头单元朝向和远离台移动的驱动单元，构造成加热头单元的加热单元，以及控制单元 被配置为当所述加热单元加热所述头单元时，控制所述驱动单元将所述头单元移动离开所述台。

公开(公告)号：US20150357226A1

公开(公告)日：2015-12-10

申请号：US14298692

申请日：2014-06-06

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ping-Yin Liu ,  Yen-Chang Chu ,  Xin-Hua Huang ,  Lan-Lin Chao ,  Yeur-Luen Tu ,  Ru-Liang Lee

IPC分类号： H01L21/683 ,  H01L21/67 ,  B23B31/30 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L21/67092 ,  B23B31/305 ,  B23B31/307 ,  H01L21/6838 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/7501 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/80013 ,  H01L2224/8013 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/94 ,  H01L2225/06593 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/3511 ,  Y10T156/14 ,  H01L2224/80 ,  H01L2224/80001

摘要： A system for and a method of bonding a first wafer to a second wafer are provided. A second wafer chuck has a second surface, a profile of the second surface being adjustable by a profile control layer. The first wafer is placed on a first surface of a first wafer chuck, and the second wafer is placed on the second surface of the second wafer chuck. The first wafer and the second wafer are warped prior to bonding to form a first warped wafer and a second warped wafer, respectively. The first warped wafer is bonded to the second warped wafer.

摘要翻译： 提供了将第一晶片接合到第二晶片的系统和方法。 第二晶片卡盘具有第二表面，第二表面的轮廓可由轮廓控制层调节。 将第一晶片放置在第一晶片卡盘的第一表面上，并且将第二晶片放置在第二晶片卡盘的第二表面上。 第一晶片和第二晶片在接合之前变形，分别形成第一翘曲晶片和第二翘曲晶片。 第一个翘曲的晶片与第二个翘曲晶片接合。

公开(公告)号：US20150303082A1

公开(公告)日：2015-10-22

申请号：US14374244

申请日：2012-03-16

申请人： Markus WIMPLINGER ,  Alfred SIGL

发明人： Markus WIMPLINGER ,  Alfred SIGL

IPC分类号： H01L21/67 ,  H01L23/00 ,  H01L21/687

CPC分类号： H01L21/67144 ,  H01L21/68771 ,  H01L21/68778 ,  H01L24/75 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75316 ,  H01L2224/75317 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/757 ,  H01L2224/75704 ,  H01L2224/75724 ,  H01L2224/75744 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/9205 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/351 ,  H01L2924/00

摘要： This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B).

摘要翻译： 本发明涉及将多个芯片接合到基板上的压力传递装置。 压力传递装置包括用于将与键合方向（B）作用的接合力施加到芯片的压力体。 压力体具有第一压力侧和相对的第二压力侧，两者均定向成横向于接合方向（B）。 提供固定装置以附接到压力传递装置的周边，用于将压力传递装置固定在粘合方向（B）上的保持体上。 提供滑动层，用于使压力体横向于接合方向（B）滑动。

公开(公告)号：US09130011B2

公开(公告)日：2015-09-08

申请号：US13071640

申请日：2011-03-25

申请人： Taehyun Kim ,  Dongsoo Lee ,  Seok Goh ,  Kyoungbok Cho

发明人： Taehyun Kim ,  Dongsoo Lee ,  Seok Goh ,  Kyoungbok Cho

IPC分类号： H01L21/67 ,  H05K13/04 ,  H01L23/00 ,  H01L21/683 ,  H05K1/02

CPC分类号： H01L24/75 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68336 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/7565 ,  H01L2224/75651 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75801 ,  H01L2224/75821 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/014 ,  H05K1/0269 ,  H05K13/046 ,  Y10T29/53178

摘要： An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.

摘要翻译： 一种用于安装半导体器件的装置包括安装部件和装载部件。 安装部件被配置为将半导体器件安装到电路板上。 装载部件邻近安装部件设置，并且构造成将半导体器件和电路板提供给安装部件。

公开(公告)号：US20150222071A1

公开(公告)日：2015-08-06

申请号：US14422512

申请日：2013-08-16

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Yoshihiro Mimura ,  Ryuji Hamada ,  Akira Kameda

IPC分类号： H01R43/048 ,  H05K3/30

CPC分类号： H01R43/048 ,  G02F1/1303 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32014 ,  H01L2224/32105 ,  H01L2224/32225 ,  H01L2224/75301 ,  H01L2224/756 ,  H01L2224/75621 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/75804 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H05K3/301 ,  H05K3/323 ,  H05K2203/0278 ,  Y10T29/4914 ,  Y10T29/53174 ,  H01L2924/00012 ,  H01L2924/00014

摘要： While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

摘要翻译： 当将基板放置在设置在中央基板转印单元中的基板放置台上时，将基板转印到元件加载操作单元，在通过元件加载操作单元执行用于加载基板上的元件的操作之后，中央 基板转印单元移动到第一部件压接操作单元的侧面，从而将保持在基板放置台上的基板传送到第一部件压接操作单元，并且通过第一部件压接操作将部件压接到基板 单元。

公开(公告)号：US09040349B2

公开(公告)日：2015-05-26

申请号：US13678046

申请日：2012-11-15

申请人： Michael G. Kelly ,  Ronald Patrick Huemoeller ,  Won Chul Do ,  David Jon Hiner

发明人： Michael G. Kelly ,  Ronald Patrick Huemoeller ,  Won Chul Do ,  David Jon Hiner

IPC分类号： H01L21/50

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/50 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3675 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L27/108 ,  H01L2221/68381 ,  H01L2224/13147 ,  H01L2224/29011 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75704 ,  H01L2224/75744 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. A mold material may be applied to encapsulate the die. The interposer wafer may be thinned to expose through-silicon-vias (TSVs) and metal contacts may be applied to the exposed TSVs. The interposer wafer may be singulated to generate assemblies comprising the semiconductor die and an interposer die. The die may be placed on the interposer wafer utilizing an adhesive film. The interposer wafer may be singulated utilizing one or more of: a laser cutting process, reactive ion etching, a sawing technique, and a plasma etching process. The die may be bonded to the interposer wafer utilizing a mass reflow or a thermal compression process.

摘要翻译： 公开了具有管芯到插入件晶片第一接合的半导体器件封装的方法和系统，并且可以包括将包括电子器件的多个半导体管芯结合到插入器晶片，以及在管芯和插入器晶片之间施加底部填充材料。 可以应用模具材料来封装模具。 内插器晶片可以被薄化以暴露通过硅通孔（TSV），并且可以将金属触点施加到暴露的TSV。 内插器晶片可以被单个化以产生包括半导体管芯和插入器管芯的组件。 可以使用粘合剂膜将管芯放置在插入件晶片上。 可以使用激光切割工艺，反应离子蚀刻，锯切技术和等离子体蚀刻工艺中的一种或多种来切割插入器晶片。 可以使用质量回流或热压缩工艺将管芯结合到插入件晶片。

公开(公告)号：US09012262B2

公开(公告)日：2015-04-21

申请号：US14004660

申请日：2012-04-17

申请人： Farrier Michael George ,  Roumbanis John Bernard

发明人： Farrier Michael George ,  Roumbanis John Bernard

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L31/0232 ,  H01L31/18 ,  H01L23/00

CPC分类号： H01L31/0232 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/14661 ,  H01L27/1469 ,  H01L31/186 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/4823 ,  H01L2224/4824 ,  H01L2224/49176 ,  H01L2224/75744 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A method of making a tiled array of semiconductor dies includes aligning and flattening. One end of each semiconductor die has attached thereto a respective printed circuit board. The aligning aligns the semiconductor dies into the tiled array in such a way that the semiconductor dies rest on a vacuum plate and the one end of each die extends beyond an edge of the vacuum plate. The flattening flattens the semiconductor dies against the vacuum plate with a vacuum after the semiconductor dies are aligned.

摘要翻译： 制作半导体晶片的平铺阵列的方法包括对齐和平坦化。 每个半导体管芯的一端连接有相应的印刷电路板。 该对准将半导体管芯排列成平铺阵列，使得半导体管芯沉积在真空板上，并且每个管芯的一端延伸超过真空板的边缘。 在半导体管芯对准之后，扁平化使半导体管芯与真空板平齐。

公开(公告)号：US20150083786A1

公开(公告)日：2015-03-26

申请号：US14497424

申请日：2014-09-26

申请人： NIKON CORPORATION

发明人： Kazuya OKAMOTO ,  Isao SUGAYA ,  Naohiko KURATA ,  Masashi OKADA ,  Hajime MITSUISHI

IPC分类号： H01L23/00 ,  B23K37/04 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L24/75 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/68 ,  H01L22/12 ,  H01L22/20 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/758 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81047 ,  H01L2224/8109 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/8115 ,  H01L2224/8116 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

摘要翻译： 一种将第一基板和第二基板结合在一起的基板接合装置，包括将第一基板和第二基板连接在一起的接合部分，彼此对准以便堆叠; 检测部，其在由所述接合部接合之前，检测所述第一基板和所述第二基板中的至少一个上的不均匀状态; 以及确定部，其确定由所述检测部检测到的所述不均匀状态是否满足预定条件，其中如果由所述确定部确定所述接合部不接合所述第一基板和所述第二基板，所述不均匀状态不满足 预定条件。