公开(公告)号：US08845910B2

公开(公告)日：2014-09-30

申请号：US13836410

申请日：2013-03-15

申请人： Taisei Plas Co., Ltd.

发明人： Masanori Naritomi ,  Naoki Andoh

IPC分类号： C03C15/00 ,  H01B13/00 ,  B44C1/22 ,  C23C22/83 ,  B32B27/04 ,  C23F1/36 ,  B32B43/00 ,  C09J163/00 ,  B32B7/12 ,  B32B38/08 ,  B32B15/08 ,  H05K1/05 ,  H05K3/38

CPC分类号： B32B43/00 ,  B32B5/024 ,  B32B5/08 ,  B32B5/147 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/38 ,  B32B38/08 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/306 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2605/00 ,  B32B2605/18 ,  C09J163/00 ,  C23C22/83 ,  C23F1/36 ,  H05K1/056 ,  H05K3/383 ,  H05K3/385 ,  H05K3/386 ,  H05K2203/0315 ,  Y10T428/24322 ,  Y10T428/24355 ,  Y10T428/265 ,  Y10T428/31522 ,  Y10T428/31529

摘要： The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

摘要翻译： 本发明的目的是将铝合金部件与FRP预浸料坯强力连接。 通过对铝合金进行适当的液体处理以形成具有大的微米级不规则性的表面并且具有几十纳米的周期的微细凹凸而获得的目的，从而从表面消除钠离子的存在，另外 已经发现形成比天然氧化物层厚的氧化铝的表面膜具有与环氧基粘合剂强大的粘合强度。 通过同时固化在基体中使用相同的环氧基粘合剂的FRP预浸料，产生了以前所未有的大小结合强度的FRP和铝合金的整体复合材料或结构。

公开(公告)号：US08745863B2

公开(公告)日：2014-06-10

申请号：US13169674

申请日：2011-06-27

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H01K3/10

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate.

摘要翻译： 制造多层印刷电路板的方法包括以下步骤（A）和（B）。 （A）提供穿透开口，其形成为通孔，并且每个具有用于芯基板的小直径，以及（B）提供形成为具有用于芯基板的大直径的通孔的穿透开口。

公开(公告)号：US20120132092A1

公开(公告)日：2012-05-31

申请号：US13063466

申请日：2009-09-07

申请人： John David Adamson ,  Peter Andrew Reath Bennett ,  Richard Arthur Hutchinson ,  Rodney Martin Potts

发明人： John David Adamson ,  Peter Andrew Reath Bennett ,  Richard Arthur Hutchinson ,  Rodney Martin Potts

IPC分类号： B41F31/00 ,  B41N1/00

CPC分类号： B41C1/1041 ,  B41M1/06 ,  B41N1/006 ,  B41N1/083 ,  G03F7/0043 ,  H05K3/1275 ,  H05K3/385 ,  H05K2203/0315

摘要： A printing form precursor comprises a printing surface which comprises an inorganic metal compound, the printing surface being hydrophobic and capable of being made hydrophilic by energy but capable of becoming hydrophobic again, for reuse, if desired. An associated method of printing includes steps of subjecting the printing surface imagewise to energy so as to locally increase its hydrophilicity sufficient to make the surface differentiated in its acceptance of an oxophilic a printing ink; applying the ink to the printing surface and printing from the printing surface; causing or allowing the printing surface to undergo a reduction in hydrophilicity sufficient again to make the printing surface uniform in its acceptance of a printing ink; and,if wished, repeating these steps on multiple occasions. Thus the invention achieves the goal of providing a printing form precursor which does not need a chemical developer, and which can be used multiple times, to print different images.

摘要翻译： 印刷版前体包括印刷表面，其包含无机金属化合物，印刷表面是疏水性的，并且能够通过能量制成亲水性，但是能够再次变得疏水，如果需要可再利用。 相关联的印刷方法包括以下步骤：使印刷表面成像地进行能量，以便局部增加其亲水性，足以使表面在接受亲油性印刷油墨时分化; 将油墨施加到印刷表面并从印刷表面印刷; 导致或允许印刷表面再次充分地进行亲水性的降低，以使印刷表面在其接受印刷油墨方面均匀; 如果愿意多次重复这些步骤。 因此，本发明实现了提供不需要化学显影剂并且可以多次使用的印刷形式前体来打印不同图像的目标。

公开(公告)号：US08132320B2

公开(公告)日：2012-03-13

申请号：US12433436

申请日：2009-04-30

申请人： Chien-Hao Wang

发明人： Chien-Hao Wang

IPC分类号： H05K3/02 ,  H05K3/10 ,  H05K1/00 ,  H01R43/00

CPC分类号： H05K1/183 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/108 ,  H05K3/243 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2203/0315 ,  H05K2203/049 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/48237 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board process is provided. In the circuit board process, a first substrate and a second substrate are stacked to form a cavity for accommodating chips. The top of the cavity is covered by a third metal layer that serves as a mask. The first substrate has a base, a first metal layer, a second metal layer, and at least a first conductive structure, and the first metal layer is patterned to form a first circuit layer having a number of first pads. The second substrate, at least an insulation layer and a third metal layer are laminated to the first substrate with a common opening in-between, and the third metal layer covers the common opening. A third circuit layer having a number of third pads is formed on the second substrate. The first pads and the third pads are not on a same plane for wire bonding.

摘要翻译： 提供电路板工艺。 在电路板工艺中，堆叠第一衬底和第二衬底，以形成容纳芯片的空腔。 腔的顶部被用作掩模的第三金属层覆盖。 第一衬底具有基底，第一金属层，第二金属层和至少第一导电结构，并且第一金属层被图案化以形成具有多个第一焊盘的第一电路层。 第二基板，至少绝缘层和第三金属层被层压到第一基板上，中间具有公共开口，并且第三金属层覆盖公共开口。 具有多个第三焊盘的第三电路层形成在第二衬底上。 第一焊盘和第三焊盘不在用于引线接合的同一平面上。

公开(公告)号：US08052882B2

公开(公告)日：2011-11-08

申请号：US12425668

申请日：2009-04-17

申请人： Hitoshi Kondo

发明人： Hitoshi Kondo

IPC分类号： B44C1/22

CPC分类号： H05K3/108 ,  H01L2924/0002 ,  H05K3/383 ,  H05K3/385 ,  H05K3/4644 ,  H05K2203/0315 ,  H05K2203/0392 ,  H01L2924/00

摘要： A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a copper plating layer in the opening portion by an electroplating, removing the plating resist, wet-etching the seed layer using the copper plating layer as a mask to obtain the wiring layer, roughening a surface of the wiring layer by a blackening process, and forming an insulating layer on the wiring layer, wherein a surface of the copper plating layer is soft-etched simultaneously in the step of etching the seed layer, whereby a soft etching step of the wiring layer carried out prior to the step of the blackening process is omitted.

摘要翻译： 制造本发明的布线基板的方法包括以下步骤：在下层上形成种子层，形成在种子层上形成开口部的电镀抗蚀剂，在开口部形成铜镀层 通过电镀，除去电镀抗蚀剂，使用铜镀层作为掩模对种子层进行湿法蚀刻以获得布线层，通过黑化处理使布线层的表面粗糙化，以及在布线层上形成绝缘层 其中，在蚀刻种子层的步骤中，同时对铜镀层的表面进行软蚀刻，由此省略在黑化处理之前执行的布线层的软蚀刻步骤。

公开(公告)号：US20110253306A1

公开(公告)日：2011-10-20

申请号：US13169736

申请日：2011-06-27

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H05K3/00 ,  B32B38/04

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.

摘要翻译： 制造印刷电路板的方法包括以下步骤（A）至（D）。 （A）在芯部件的两侧各自层叠树脂绝缘层，形成芯基板，（B）通过施加激光而在芯基板上形成贯通孔，（C）在芯基板上形成粗糙面， 和（D）为每个穿透孔提供金属膜以形成通孔。

公开(公告)号：US20110186221A1

公开(公告)日：2011-08-04

申请号：US12697425

申请日：2010-02-01

申请人： Ming De Wang ,  Steven A. Castaldi ,  Kesheng Feng

发明人： Ming De Wang ,  Steven A. Castaldi ,  Kesheng Feng

IPC分类号： B32B7/12 ,  C09D5/00 ,  C08K5/32

CPC分类号： B32B7/12 ,  B32B7/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2307/50 ,  B32B2307/732 ,  B32B2457/08 ,  C23C22/63 ,  C23C22/78 ,  C23C22/83 ,  H05K3/385 ,  H05K3/388 ,  H05K2203/0315

摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.

摘要翻译： 提高铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 和（v）硫代化合物。 浸渍后组合物是碱性溶液，其包含（i）磷酸盐; （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。

公开(公告)号：US20110147072A1

公开(公告)日：2011-06-23

申请号：US13060095

申请日：2009-06-17

申请人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

发明人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

IPC分类号： H05K1/03 ,  C23C22/68 ,  C22C9/00 ,  B32B15/04

CPC分类号： C23F1/18 ,  C23F1/02 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T29/49982 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

公开(公告)号：US07806311B2

公开(公告)日：2010-10-05

申请号：US12029340

申请日：2008-02-11

申请人： Wei-Hsing Tuan

发明人： Wei-Hsing Tuan

IPC分类号： B23K31/00

CPC分类号： H05K3/385 ,  B32B38/0036 ,  B32B2311/12 ,  B32B2315/02 ,  C04B37/021 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/96 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/54 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T156/10

摘要： A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on the copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together to enhance interface strength between the copper sheet and the ceramic substrate according to the multi-stage pre-oxidizing process. The multi-stage pre-oxidizing process includes a first stage of pre-oxidizing process and a second stage of pre-oxidizing process, and the first and second stages of pre-oxidizing processes are performed in atmospheres with different oxygen partial pressures and at different temperatures.

摘要翻译： 制造陶瓷/金属复合结构体的方法包括以下步骤：对铜板进行多级预氧化处理; 将铜片放置在陶瓷基板上; 并且将铜片和陶瓷基板加热至接合温度，以将铜片和陶瓷基片接合在一起，以提高根据多级预氧化工艺的铜片和陶瓷基片之间的界面强度。 多级预氧化工艺包括预氧化工艺的第一阶段和预氧化工艺的第二阶段，第一和第二阶段的预氧化工艺在具有不同氧分压和不同氧分压的气氛中进行 温度。

公开(公告)号：US20100206618A1

公开(公告)日：2010-08-19

申请号：US12691502

申请日：2010-01-21

申请人： Chien-Hao Wang ,  Ming-Chiang Lee

发明人： Chien-Hao Wang ,  Ming-Chiang Lee

IPC分类号： H05K1/09 ,  H05K3/00 ,  C23C28/00

CPC分类号： H05K3/4007 ,  H05K1/111 ,  H05K1/113 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/108 ,  H05K3/205 ,  H05K3/28 ,  H05K3/385 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2203/0315

摘要： The present invention relates to a coreless substrate and a method for making the same. The method for making the coreless substrate includes: (a) providing a carrier and a first conductive layer, wherein the carrier has a first surface and a second surface, and the first conductive layer is disposed on the first surface of the carrier; (b) forming a first embedded circuit on the first conductive layer; (c) forming a first dielectric layer so as to cover the first embedded circuit; (d) removing the carrier; (e) removing part of the first conductive layer so as to form at least one first pad; and (f) forming a first solder mask so as to cover the first embedded circuit and the first dielectric layer and to expose the first pad. Therefore, the coreless substrate of the present invention has high density of layout and involves low manufacturing cost.

摘要翻译： 无芯基板及其制造方法技术领域本发明涉及无芯基板及其制造方法。 制造无芯基板的方法包括：（a）提供载体和第一导电层，其中载体具有第一表面和第二表面，并且第一导电层设置在载体的第一表面上; （b）在第一导电层上形成第一嵌入电路; （c）形成第一介电层以覆盖第一嵌入式电路; （d）清除载体; （e）去除所述第一导电层的一部分以便形成至少一个第一焊盘; 和（f）形成第一焊料掩模以覆盖第一嵌入电路和第一电介质层并露出第一焊盘。 因此，本发明的无芯基板具有高的布局密度，并且制造成本低。