公开(公告)号：US5160787A

公开(公告)日：1992-11-03

申请号：US754997

申请日：1991-09-05

申请人： Morio Gaku ,  Kenzi Ishii ,  Takamasa Nakai

发明人： Morio Gaku ,  Kenzi Ishii ,  Takamasa Nakai

IPC分类号： B32B15/08 ,  C08K5/45 ,  H01L23/552 ,  H05K1/03

CPC分类号： H01L23/552 ,  B32B15/08 ,  C08K5/45 ,  H01L2924/0002 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/261 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31688 ,  Y10T442/2607 ,  Y10T442/3415 ,  Y10T442/656

摘要： An electrical laminate having an ability to absorb or shield ultraviolet rays having wavelength of 300-420 nm which comprises (i) at least one thermosetting resin-impregnated substrate, (ii) said substrate and a metal foil or (iii) said substrate, a metal foil and an adhesive layer for the metal foil comprising a thermosetting resin, characterized in that the thermosetting resin constituting part or all of said substrates or constituting said adhesive layer contains 0.2-6.0% by weight of a light absorber (A) on the basis of weight of the thermosetting resin, said light absorber is (a) an alkylthioxantone or a mixture of (a) said alkylthioxantone and (b) an ultraviolet rays-absorber.

摘要翻译： 具有吸收或屏蔽波长为300-420nm的紫外线的能力的电层压板，其包括（i）至少一种热固性树脂浸渍基材，（ii）所述基材和金属箔或（iii）所述基材， 金属箔和用于包含热固性树脂的金属箔的粘合剂层，其特征在于，构成所述基材的一部分或全部或构成所述粘合剂层的热固性树脂在基础上含有0.2-6.0重量％的光吸收体（A） 所述光吸收剂为（a）烷基噻吨酮或（a）所述烷基噻吨酮和（b）紫外线吸收剂的混合物。

公开(公告)号：US4917758A

公开(公告)日：1990-04-17

申请号：US354954

申请日：1989-05-19

申请人： Koichi Ishizuka ,  Morio Gaku ,  Kenzi Ishii ,  Hidenori Kinbara ,  Masakazu Motegi

发明人： Koichi Ishizuka ,  Morio Gaku ,  Kenzi Ishii ,  Hidenori Kinbara ,  Masakazu Motegi

IPC分类号： C23F1/18 ,  H05K3/06

CPC分类号： C23F1/18 ,  H05K3/06 ,  H05K2203/0353

摘要： A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper foil having an average thickness of 12 .mu.m or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness, and the variation of the thickness of the copper foil remaining after the etching is within .+-.2.0 .mu.m on the basis of a desired thickness.

公开(公告)号：US20070172674A1

公开(公告)日：2007-07-26

申请号：US11657529

申请日：2007-01-25

申请人： Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

发明人： Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

IPC分类号： B32B15/08

CPC分类号： B32B27/281 ,  B32B7/06 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G73/1042 ,  C08G73/12 ,  H05K3/181 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

摘要翻译： 一种树脂复合铜箔，其包含铜箔和含有嵌段共聚物聚酰亚胺和马来酰亚胺化合物的树脂层，所述树脂层形成在所述铜箔的一个表面上，其制造方法，使用所述树脂复合材料的覆铜层压板 铜箔，使用覆铜层压板的印刷电路板的制造方法，以及通过上述方法得到的印刷电路板。

公开(公告)号：US06337463B1

公开(公告)日：2002-01-08

申请号：US09271897

申请日：1999-03-18

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

IPC分类号： B23K2600

CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

公开(公告)号：US06265767B1

公开(公告)日：2001-07-24

申请号：US09583148

申请日：2000-05-30

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

IPC分类号： H01L2144

CPC分类号： H01L21/486 ,  H01L21/481 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/056 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/09827 ,  H05K2203/0369 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

摘要翻译： 提供了一种半导体塑料封装，其中至少一个半导体芯片安装在小型印刷线路板，用于上述封装的金属板和用于制造用于上述封装的铜包覆板的方法中。 更具体地，提供了适用于诸如微处理器，微控制器，ASIC和图形的相对高瓦特，多端子和高密度半导体塑料封装的半导体塑料封装及其制造方法。

公开(公告)号：US4871811A

公开(公告)日：1989-10-03

申请号：US235814

申请日：1988-08-23

申请人： Morio Gaku ,  Hidenori Kinbara

发明人： Morio Gaku ,  Hidenori Kinbara

IPC分类号： C09J123/08 ,  C09J167/00

CPC分类号： C09J123/08 ,  C09J167/00

摘要： A hot melt adhesive composition comprising (A) 99 to 80 wt % of a thermoplastic resin selected from the group consisting of a substantially amorphous thermoplastic saturated polyester resin, an ethylene-vinyl acetate copolymer and an ethylene-ethyl acrylate copolymer and (B) from 1 to 20 wt % of a monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in the molecule is disclosed. The hot melt adhesive composition can further contain a co-modifier, a monofunctional or polyfunctional maleimide compound or a cross-linking catalyst for the thermoplastic resin (A). This composition has improved adhesive force, mechanical characteristics and heat resistance.

公开(公告)号：US4370467A

公开(公告)日：1983-01-25

申请号：US165560

申请日：1980-07-03

申请人： Morio Gaku ,  Nobuyuki Ikeguchi

发明人： Morio Gaku ,  Nobuyuki Ikeguchi

IPC分类号： C08F20/00 ,  C08F2/44 ,  C08F4/28 ,  C08F22/36 ,  C08F22/40 ,  C08G59/00 ,  C08G59/40 ,  C08G59/68 ,  C08G73/00 ,  C08G73/06 ,  C08L79/04 ,  C08G73/12 ,  C08G83/00

CPC分类号： C08L79/04

摘要： A curable resin composition comprising (i) a catalytic composite comprising a peroxide and other catalytic component and (ii) a mixture or a preliminary reaction product of (a) a polyfunctional cyanate ester, prepolymer of the cyanate ester or coprepolymer of the cyanate ester and an amine and (b) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine and optionally (c) other component is disclosed. The composition cures rapidly at a low temperature and is preferable from view point of quantity production and workability. The composition is excellent in respect of adhering property, heat-resistance, moisture-resistance and chemical-resistance, and is useful for preparing laminated products, molded products, paint, powder paint, adhesive or varnish.

摘要翻译： 一种可固化树脂组合物，其包含（i）包含过氧化物和其它催化组分的催化复合物和（ii）（a）多官能氰酸酯，氰酸酯或氰酸酯的共聚物的预聚物和氰酸酯的预混合物或预反应产物和 公开了一种胺和（b）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺的共聚单体和胺和任选的（c）其它组分的预聚物。 组合物在低温下快速固化，从量产生和加工性的观点出发优选。 该组合物在粘合性，耐热性，耐湿性和耐化学性方面优异，可用于制备层压产品，模塑产品，油漆，粉末涂料，粘合剂或清漆。

公开(公告)号：US4110364A

公开(公告)日：1978-08-29

申请号：US559650

申请日：1975-03-18

申请人： Morio Gaku ,  Kazuhiro Suzuki ,  Kazuyuki Nakamichi

发明人： Morio Gaku ,  Kazuhiro Suzuki ,  Kazuyuki Nakamichi

IPC分类号： C08F2/50 ,  C08G73/12 ,  C08G73/00

CPC分类号： C08G73/121

摘要： A curable resin composition comprising(a) a cyanate ester component selected from the group consisting of polyfunctional aromatic cyanate ester monomers having at least 2 cyanate groups bonded to their aromatic ring, prepolymers of the cyanate esters and prepolymers of the cyanate ester monomers and amines, and(b) a bismaleimide component selected from the group consisting of bismaleimides, bismaleimide prepolymers and prepolymers of the bismaleimides and amines;The weight ratio of the component (a) to (b) being 1:99 to 99:1.

摘要翻译： 一种可固化树脂组合物，其包含（A）选自由多官能芳族羧酸酯单体组成的组中的氰基酯组分，所述单体具有至少两个与其芳族环结合的氰基团，氰基酯和氰基酯单体和氨基酸的预聚物， 和（B）由BISMALEIMIDES，BISMALEIMIDES和BISMALEIMIDES和AMINES的制备物组成的组所选择的二氯甲烷组分; 组分（A）至（B）的重量比为1:99至99：1。

公开(公告)号：US08377544B2

公开(公告)日：2013-02-19

申请号：US12907089

申请日：2010-10-19

申请人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

发明人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

IPC分类号： B32B9/00 ,  B32B17/04

CPC分类号： B32B15/14 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T442/209 ,  Y10T442/2738 ,  Y10T442/2951 ,  Y10T442/2992 ,  Y10T442/3008 ,  Y10T442/3341 ,  Y10T442/3415 ,  Y10T442/3423

摘要： A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

摘要翻译： 一种高弹性玻璃织物基材/热固性树脂的覆铜层压板，由预浸料形成，所述预浸料通过浸渍由玻璃织物制成的玻璃织物基材，所述玻璃织物基材由厚度为25至150μm，重量为15至165g / m 2，透气度为1〜20cm 3 / cm 2 / sec。 用热固性树脂组合物干燥。

公开(公告)号：US07140103B2

公开(公告)日：2006-11-28

申请号：US10170614

申请日：2002-06-14

申请人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

发明人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

IPC分类号： H01K3/10

CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2203/0723 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

摘要翻译： 一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层 使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层 通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度 其中未形成图案铜镀层。