公开(公告)号：US07863745B2

公开(公告)日：2011-01-04

申请号：US11595854

申请日：2006-11-13

申请人： Ryuji Nomoto ,  Hirohisa Matsuki

发明人： Ryuji Nomoto ,  Hirohisa Matsuki

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/564 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2908 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/83104 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

摘要： A semiconductor device, including a semiconductor substrate where a plurality of functional elements is formed; and a multilayer interconnection layer provided over the semiconductor substrate, the multilayer interconnection layer including a wiring layer mutually connecting the plural functional elements and including an interlayer insulation layer, wherein a region where the wiring layer is formed is surrounded by a groove forming part, the groove forming part piercing the multilayer interconnection layer; and the groove forming part is filled with an organic insulation material.

摘要翻译： 一种半导体器件，包括其中形成有多个功能元件的半导体衬底; 以及设置在所述半导体衬底上的多层布线层，所述多层布线层包括相互连接所述多个功能元件并且包括层间绝缘层的布线层，其中所述布线层形成的区域被沟槽形成部分包围， 沟槽形成部分刺穿多层互连层; 并且槽形成部分填充有机绝缘材料。

公开(公告)号：US20070284755A1

公开(公告)日：2007-12-13

申请号：US11595854

申请日：2006-11-13

申请人： Ryuji Nomoto ,  Hirohisa Matsuki

发明人： Ryuji Nomoto ,  Hirohisa Matsuki

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/564 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2908 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/83104 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

摘要： A semiconductor device, including a semiconductor substrate where a plurality of functional elements is formed; and a multilayer interconnection layer provided over the semiconductor substrate, the multilayer interconnection layer including a wiring layer mutually connecting the plural functional elements and including an interlayer insulation layer, wherein a region where the wiring layer is formed is surrounded by a groove forming part, the groove forming part piercing the multilayer interconnection layer; and the groove forming part is filled with an organic insulation material.

摘要翻译： 一种半导体器件，包括其中形成有多个功能元件的半导体衬底; 以及设置在所述半导体衬底上的多层布线层，所述多层布线层包括相互连接所述多个功能元件并且包括层间绝缘层的布线层，其中所述布线层形成的区域被沟槽形成部分包围， 沟槽形成部分刺穿多层互连层; 并且槽形成部分填充有机绝缘材料。

公开(公告)号：US06288444B1

公开(公告)日：2001-09-11

申请号：US09325747

申请日：1999-06-04

申请人： Mitsuo Abe ,  Yoshihiro Kubota ,  Yoshitsugu Katoh ,  Michio Hayakawa ,  Ryuji Nomoto ,  Mitsutaka Sato ,  Seiichi Orimo ,  Hiroshi Inoue ,  Toshio Hamano

发明人： Mitsuo Abe ,  Yoshihiro Kubota ,  Yoshitsugu Katoh ,  Michio Hayakawa ,  Ryuji Nomoto ,  Mitsutaka Sato ,  Seiichi Orimo ,  Hiroshi Inoue ,  Toshio Hamano

IPC分类号： H01L2334

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion and a wiring layer on an inner portion. Wires are bonded to the wiring layer, and an opening is formed in the center of the printed wiring board. The heat spreader is bonded to the printed wiring board, with the semiconductor chip being thermally connected to the stage portion of the heat spreader. The sealing resin is made up of a first sealing resin portion and a second sealing resin portion. The first and second sealing resin portions sandwich the heat spreader.

摘要翻译： 提供半导体器件和制造半导体器件的方法。 该半导体器件包括半导体芯片，印刷线路板，散热器，密封树脂和焊球。 印刷电路板在外部设置有焊球，在内部设置有布线层。 导线被接合到布线层，并且在印刷线路板的中心形成开口。 散热器与印刷电路板接合，半导体芯片与散热器的台部热连接。 密封树脂由第一密封树脂部分和第二密封树脂部分构成。 第一和第二密封树脂部分夹着散热器。

公开(公告)号：US06215182B1

公开(公告)日：2001-04-10

申请号：US09531232

申请日：2000-03-20

申请人： Kaname Ozawa ,  Hayato Okuda ,  Ryuji Nomoto ,  Yuji Akashi ,  Katsuro Hiraiwa

发明人： Kaname Ozawa ,  Hayato Okuda ,  Ryuji Nomoto ,  Yuji Akashi ,  Katsuro Hiraiwa

IPC分类号： H01L2334

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48479 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85009 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes the first through third semiconductor devices which are stacked on a substrate and the first through third wires for connecting the semiconductor elements and the substrate. The first wires serve to connect electrodes of the first semiconductor element positioned uppermost and electrodes of the second semiconductor element. The second wires serve to connect the electrodes of the second semiconductor element and electrodes of the third semiconductor element. The third wires serve to connect the electrodes of the third semiconductor element and bonding pads of the substrate. Between the first wires and the electrodes of the second semiconductor element and between the second wires and the electrodes of the third semiconductor element, stud bumps are provided so as to form space therebetween, thereby avoiding short-circuits therebetween.

摘要翻译： 半导体器件包括层叠在基板上的第一至第三半导体器件以及用于连接半导体元件和基板的第一至第三布线。 第一导线用于连接位于最上面的第一半导体元件的电极和第二半导体元件的电极。 第二导线用于连接第二半导体元件的电极和第三半导体元件的电极。 第三导线用于连接第三半导体元件的电极和基板的焊盘。 在第一导线与第二半导体元件的电极之间以及第二导线与第三半导体元件的电极之间，设置柱形凸块，以在它们之间形成空间，从而避免它们之间的短路。

公开(公告)号：US07456089B2

公开(公告)日：2008-11-25

申请号：US11512238

申请日：2006-08-30

申请人： Yoshitaka Aiba ,  Ryuji Nomoto

发明人： Yoshitaka Aiba ,  Ryuji Nomoto

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/48

CPC分类号： H01L23/3114 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05558 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a second end, opposite to the first end, projecting from the encapsulation resin, and an external connection member is connected to the column electrode at the second end so that the external connection member is separate from a surface of the encapsulation resin.

摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片上的布线层，在第一端连接到布线层的列电极和形成在半导体芯片上的封装树脂。 在半导体器件中，列电极设置有从封装树脂突出的与第一端相对的第二端，并且外部连接构件在第二端处连接到列电极，使得外部连接构件分离 从封装树脂的表面。

公开(公告)号：US20050253264A1

公开(公告)日：2005-11-17

申请号：US10945111

申请日：2004-09-21

申请人： Yoshitaka Aiba ,  Ryuji Nomoto

发明人： Yoshitaka Aiba ,  Ryuji Nomoto

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L23/3114 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05558 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a second end, opposite to the first end, projecting from the encapsulation resin, and an external connection member is connected to the column electrode at the second end so that the external connection member is separate from a surface of the encapsulation resin.

摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片上的布线层，在第一端连接到布线层的列电极和形成在半导体芯片上的封装树脂。 在半导体器件中，列电极设置有从封装树脂突出的与第一端相对的第二端，并且外部连接构件在第二端处连接到列电极，使得外部连接构件分离 从封装树脂的表面。

公开(公告)号：US06856017B2

公开(公告)日：2005-02-15

申请号：US09442038

申请日：1999-11-17

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

摘要翻译： 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US07122897B2

公开(公告)日：2006-10-17

申请号：US10945111

申请日：2004-09-21

申请人： Yoshitaka Aiba ,  Ryuji Nomoto

发明人： Yoshitaka Aiba ,  Ryuji Nomoto

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3114 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05558 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a second end, opposite to the first end, projecting from the encapsulation resin, and an external connection member is connected to the column electrode at the second end so that the external connection member is separate from a surface of the encapsulation resin.

摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片上的布线层，在第一端连接到布线层的列电极和形成在半导体芯片上的封装树脂。 在半导体器件中，列电极设置有从封装树脂突出的与第一端相对的第二端，并且外部连接构件在第二端处连接到列电极，使得外部连接构件分离 从封装树脂的表面。

公开(公告)号：US20060040532A1

公开(公告)日：2006-02-23

申请号：US11019156

申请日：2004-12-23

申请人： Kaname Ozawa ,  Mitsutaka Sato ,  Tetsuya Fujisawa ,  Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Yoshitaka Aiba

发明人： Kaname Ozawa ,  Mitsutaka Sato ,  Tetsuya Fujisawa ,  Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Yoshitaka Aiba

IPC分类号： H01R13/648

CPC分类号： G06F17/5068 ,  H05K3/0005

摘要： A method of design of a circuit board enabling high density conductor lines to be drawn efficiently. A rats nest is formed by connecting pads to which terminals of an electronic device are connected and external connection terminals by lines. A region with the highest density of lines of the rats nest is then selected and design rules relating to routes and dimensions of conductor lines are set in the region with the highest density of lines of the rats nest. Conductor lines are then laid at the region with the highest density of lines of the rats nest, and whether or not the conductor lines can be laid at the region with the highest density of lines of the rats nest is confirmed. Setting of the design rules and laying of conductor lines are if the conductor lines cannot be laid, and the conductor lines of the remaining regions are laid by the set design rules if the conductor lines can be laid.

摘要翻译： 一种能够高效率地绘制高密度导线的电路板的设计方法。 大鼠巢通过连接电子装置的端子的连接垫和通过线路的外部连接端子形成。 然后选择大鼠巢线密度最高的区域，并且在具有最大密度的大鼠巢的区域中设置与导线的路线和尺寸相关的设计规则。 然后将导体线放置在具有最高密度的大鼠巢的区域，并且确定导线是否可以放置在具有最大密度的大鼠巢的密度的区域。 如果导体线不能铺设，则设计规则和布线的设置，如果可以铺设导线，则通过设定的规则布置其余区域的导体线。

公开(公告)号：US06573121B2

公开(公告)日：2003-06-03

申请号：US09809105

申请日：2001-03-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2144

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.