公开(公告)号：US06344273B1

公开(公告)日：2002-02-05

申请号：US09448475

申请日：1999-11-24

申请人： Yuichi Satsu ,  Hideaki Katayama ,  Yuzo Ito ,  Akio Takahashi ,  Noboru Baba ,  Chikara Tanaka ,  Kazuo Asaka ,  Chio Ishihara ,  Hiroaki Miyata ,  Kazuhiro Satou

发明人： Yuichi Satsu ,  Hideaki Katayama ,  Yuzo Ito ,  Akio Takahashi ,  Noboru Baba ,  Chikara Tanaka ,  Kazuo Asaka ,  Chio Ishihara ,  Hiroaki Miyata ,  Kazuhiro Satou

IPC分类号： B05D700

CPC分类号： H01F1/26 ,  H01F1/24 ,  H01F41/0246 ,  Y10T428/2991

摘要： The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with an insulating layer-forming solution which comprises a phosphating solution and a rust inhibitor, which is an organic compound containing at least one of nitrogen or sulfur having a lone pair of electrons suppressing the formation of iron oxide and surfactant, and drying the treated soft magnetic particles at a predetermined temperature. The soft magnetic powder composite core is excellent in iron loss and magnetic flux density.

摘要翻译： 本发明提供了一种用于在其表面上具有电绝缘层的软磁性颗粒制造的电气设备的软磁性粉末复合芯，其中所述电绝缘层通过将所述软磁性颗粒与绝缘层形成溶液混合而形成，所述绝缘层形成溶液包括 磷化溶液和防锈剂，其是含有具有抑制氧化铁和表面活性剂的形成的单一电子对的至少一种氮或硫的有机化合物，以及在预定温度下干燥处理的软磁性颗粒。 软磁性粉末复合铁心的铁损和磁通密度优良。

公开(公告)号：US6054219A

公开(公告)日：2000-04-25

申请号：US863627

申请日：1997-05-27

申请人： Yuichi Satsu ,  Hideaki Katayama ,  Yuzo Ito ,  Akio Takahashi ,  Noboru Baba ,  Chikara Tanaka ,  Kazuo Asaka ,  Chio Ishihara ,  Hiroaki Miyata ,  Kazuhiro Satou

发明人： Yuichi Satsu ,  Hideaki Katayama ,  Yuzo Ito ,  Akio Takahashi ,  Noboru Baba ,  Chikara Tanaka ,  Kazuo Asaka ,  Chio Ishihara ,  Hiroaki Miyata ,  Kazuhiro Satou

IPC分类号： H01F1/24 ,  H01F1/26 ,  H01F41/02 ,  B05D7/00 ,  B05D3/02

CPC分类号： H01F1/26 ,  H01F1/24 ,  H01F41/0246 ,  Y10T428/2991

摘要： The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with an insulating layer-forming solution which comprises a phosphating solution and a rust inhibitor, which is an organic compound containing at least one of nitrogen or sulfur having a lone pair of electrons suppressing the formation of iron oxide and surfactant, and drying the treated soft magnetic particles at a predetermined temperature. The soft magnetic powder composite core is excellent in iron loss and magnetic flux density.

摘要翻译： 本发明提供了一种用于在其表面上具有电绝缘层的软磁性颗粒制造的电气设备的软磁性粉末复合芯，其中所述电绝缘层通过将所述软磁性颗粒与绝缘层形成溶液混合而形成，所述绝缘层形成溶液包括 磷化溶液和防锈剂，其是含有具有抑制氧化铁和表面活性剂的形成的单一电子对的至少一种氮或硫的有机化合物，以及在预定温度下干燥处理的软磁性颗粒。 软磁性粉末复合铁心的铁损和磁通密度优良。

公开(公告)号：US06946198B2

公开(公告)日：2005-09-20

申请号：US10602713

申请日：2003-06-25

申请人： Akio Takahashi ,  Yuichi Satsu ,  Harukazu Nakai ,  Masao Suzuki ,  Yuzo Ito ,  Shuichi Oohara

发明人： Akio Takahashi ,  Yuichi Satsu ,  Harukazu Nakai ,  Masao Suzuki ,  Yuzo Ito ,  Shuichi Oohara

IPC分类号： C08G59/40 ,  C08G77/42 ,  C08L63/00 ,  C09D183/10 ,  H01L21/56 ,  H01L23/29 ,  H01L23/498 ,  B32B27/38 ,  B32B15/08 ,  H01L21/50

CPC分类号： C08G77/42 ,  C08G59/4085 ,  C08L63/00 ,  C09D183/10 ,  H01L21/563 ,  H01L23/293 ,  H01L23/296 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

摘要翻译： 无溶剂的热固性树脂组合物，其包含环氧树脂（a）和由通式（1）表示的有机硅化合物的反应的产物（b）（其中R是含有与 通过加成反应的环氧树脂; R1是甲基或乙基），与水一起，产物（b）含有在环氧树脂（a）中形成并且具有2或更高缩聚度的有机硅化合物缩聚物， 在室温（25℃）下具有低粘度，并且得到具有完整材料性能的固化树脂，特别是完整的高温机械性能; 树脂组合物的制造方法; 和通过应用组合物获得的产品。

公开(公告)号：US06821657B1

公开(公告)日：2004-11-23

申请号：US10182181

申请日：2002-09-25

申请人： Akio Takahashi ,  Yuichi Satsu ,  Harukazu Nakai ,  Masao Suzuki ,  Yuzo Ito ,  Shuichi Oohara

发明人： Akio Takahashi ,  Yuichi Satsu ,  Harukazu Nakai ,  Masao Suzuki ,  Yuzo Ito ,  Shuichi Oohara

IPC分类号： B32B2738

CPC分类号： C08G77/42 ,  C08G59/4085 ,  C08L63/00 ,  C09D183/10 ,  H01L21/563 ,  H01L23/293 ,  H01L23/296 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

摘要翻译： 无溶剂的热固性树脂组合物，其包含环氧树脂（a）和由通式（1）表示的有机硅化合物的反应的产物（b）（其中R是含有与 通过加成反应的环氧树脂; R1是甲基或乙基），与水一起，产物（b）含有在环氧树脂（a）中形成并且具有2或更高缩聚度的有机硅化合物缩聚物， 在室温（25℃）下具有低粘度，并且得到具有完整材料性能的固化树脂，特别是完整的高温机械性能; 树脂组合物的制造方法; 和通过应用组合物获得的产品。

公开(公告)号：US5686191A

公开(公告)日：1997-11-11

申请号：US553240

申请日：1995-11-07

申请人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

发明人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

IPC分类号： C08G73/10 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B27/06

CPC分类号： H05K3/4655 ,  C08G73/1039 ,  C08G73/1071 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/386 ,  H05K3/4605 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

摘要翻译： 包含（A）热固性聚酰亚胺和（B）双马来酰亚胺并且在其热固化期间显示出107至102达因/ cm 2的弹性模量的热固性树脂组合物适用于形成具有优异的薄膜布线板中使用的粘合剂膜 耐热性和高可靠性。

公开(公告)号：US06638352B2

公开(公告)日：2003-10-28

申请号：US10097664

申请日：2002-03-15

申请人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

发明人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

IPC分类号： C08L8300

CPC分类号： H01L24/10 ,  C08L79/08 ,  C08L83/10 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/49894 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K1/0271 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

摘要翻译： 本发明提供一种热稳定性低的弹性模量材料，它具有高的热稳定性，在-50℃至300℃的温度范围内的动态特性如热膨胀系数和弹性模量的变化很小，具有 在室温下为2-0.01GPa的弹性模量，并且电绝缘的可靠性高，而不管温度波动如何，并且提供了使用其的半导体器件。本发明还提供一种通过热量获得的热稳定性低弹性模量树脂组合物 固化含有聚酰亚胺，聚酰胺 - 酰亚胺或聚酰胺树脂或树脂前体的混合物，其固化产物在-50℃下测量的2-0.01GPa的弹性模量和具有官能团的有机硅化合物的低聚物 引起与NH和/或COOH基团的加成反应。

公开(公告)号：US07220481B2

公开(公告)日：2007-05-22

申请号：US10062562

申请日：2002-02-05

申请人： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

发明人： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

IPC分类号： B32B27/20 ,  B32B33/00 ,  C08K3/08 ,  C08K5/00

CPC分类号： H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

摘要： A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

摘要翻译： 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。

公开(公告)号：US20050014388A1

公开(公告)日：2005-01-20

申请号：US10484840

申请日：2002-07-22

申请人： Akio Takahashi ,  Yuichi Satsu ,  Harakazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Karen Mailyan

发明人： Akio Takahashi ,  Yuichi Satsu ,  Harakazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Karen Mailyan

IPC分类号： C08G61/02 ,  C08J5/18 ,  C08L65/04 ,  H01L21/312 ,  H01L21/76 ,  H01L21/768 ,  H01L49/02 ,  H05K1/00 ,  H01L21/31 ,  H01L21/469

CPC分类号： C08J5/18 ,  C08G61/02 ,  C08J2365/04 ,  C08L65/04 ,  H01L21/02118 ,  H01L21/0212 ,  H01L21/02203 ,  H01L21/02271 ,  H01L21/312 ,  H01L21/3127 ,  H01L21/7682 ,  H05K3/4676 ,  Y10T428/31913

摘要： An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.

公开(公告)号：US5768108A

公开(公告)日：1998-06-16

申请号：US720028

申请日：1996-09-27

申请人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

发明人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

IPC分类号： H05K1/05 ,  H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16

CPC分类号： H01L21/4857 ,  H01L23/5385 ,  H05K3/4641 ,  H01L2224/16225 ,  H05K1/113 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623

摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。

公开(公告)号：US5712080A

公开(公告)日：1998-01-27

申请号：US801421

申请日：1997-02-18

申请人： Yuichi Satsu ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi ,  Masashi Miyazaki ,  Toshiaki Ishimaru

发明人： Yuichi Satsu ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi ,  Masashi Miyazaki ,  Toshiaki Ishimaru

IPC分类号： G03F7/004 ,  G03F7/038 ,  G03F7/085 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38

CPC分类号： G03F7/085 ,  H05K3/108 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/1105 ,  H05K2203/124 ,  H05K3/0076 ,  H05K3/062 ,  H05K3/384 ,  Y10S430/155

摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，使用由感光性树脂组合物层构成的负极图案，通过化学金属电镀形成配线图案作为电镀抗蚀剂，其特征在于，所述感光性树脂至少含有由以下所示的重复单元构成的直链状高分子 通式（1）; 具有1-9个碳原子的烷氧基，具有1-9个碳原子的羧基烷基，R2是具有1-9个碳原子的亚烷基，n是重复单元的聚合数 和由以下通式（2）表示的有机化合物。 （2）其中，R3为H或具有1-6个碳原子的烷基，X为NH或S，Z为N或C-Y，其中Y为H，NH2或SH。