公开(公告)号：US20100207218A1

公开(公告)日：2010-08-19

申请号：US12704146

申请日：2010-02-11

申请人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi ,  Kei Murayama

发明人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi ,  Kei Murayama

IPC分类号： H01L29/84 ,  H05K3/30 ,  H01L21/50

CPC分类号： H01L23/13 ,  B81B7/007 ,  B81B2207/096 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/81097 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing an electronic component device, includes the steps of preparing a wiring substrate, which includes a silicon substrate, a concave portion provided on its upper surface side, a through hole formed to penetrate the silicon substrate on a bottom surface side of the concave portion, an insulating layer formed on the silicon substrate, a penetration electrode constructed by a lower conductor portion formed to a halfway position of a height direction from a bottom portion of the through hole and a connection metal member (indium layer) formed on the lower conductor portion in the through hole, and an electronic component having a terminal metal member (gold bump) on a lower surface side, and softening the connection metal member of the wiring substrate in a heating atmosphere and then sticking the terminal metal member of the electronic component into the connection metal member and connecting thereto.

摘要翻译： 一种电子部件装置的制造方法，其特征在于，包括：制作布线基板的步骤，所述布线基板包括硅基板，设置在其上表面侧的凹部，形成为贯通所述硅基板的通孔， 形成在硅基板上的绝缘层，由形成在通孔的底部的高度方向的中途位置的下部导体部分构成的贯通电极，以及形成在该基板上的连接金属部件（铟层） 通孔中的下导体部分和在下表面侧具有端子金属部件（金凸块）的电子部件，并且在加热气氛中软化接线基板的连接金属部件，然后将端子金属部件 电子部件插入连接金属部件并与其连接。

公开(公告)号：US20100193939A1

公开(公告)日：2010-08-05

申请号：US12686590

申请日：2010-01-13

申请人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi

发明人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi

IPC分类号： H01L23/48 ,  H01L23/488

CPC分类号： B81B7/0074 ,  H01L24/16 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10454 ,  H05K2201/10727 ,  H05K2201/10946 ,  H01L2924/00 ,  H01L2224/48

摘要： A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.

摘要翻译： 布线基板包括硅基板，形成为在厚度方向上穿透硅基板的通孔，形成在硅基板的两个表面和侧表面上的绝缘层和通孔的内表面，形成在 所述通孔，形成在所述硅衬底的至少一个表面上并连接到所述穿透电极的布线层和连接到所述布线层并形成为从所述硅衬底的一个表面延伸到其侧表面的金属线端子 。 电子装置的侧面上的金属线端子与安装基板连接，使得其中电子部件安装在布线基板上的电子装置的基板方向与安装基板的基板方向正交地交叉。

公开(公告)号：US20100038772A1

公开(公告)日：2010-02-18

申请号：US12535751

申请日：2009-08-05

申请人： Yuichi TAGUCHI ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Hideaki Sakaguchi ,  Masahiro Sunohara

发明人： Yuichi TAGUCHI ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Hideaki Sakaguchi ,  Masahiro Sunohara

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/6835 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.

摘要翻译： 半导体封装包括布线板和安装在布线板上的半导体器件。 至少一个穿透孔从半导体芯片的一个表面延伸到半导体芯片的相对表面。 穿透电极位于穿透孔的内部，而不与穿透孔的壁接触。 穿透电极具有固定在半导体芯片的一个表面上的一端和从半导体芯片的相对表面突出的相对端。 连接端子形成在穿透电极的相对端并电连接到布线板。

公开(公告)号：US20120086116A1

公开(公告)日：2012-04-12

申请号：US13221064

申请日：2011-08-30

申请人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi

发明人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi

IPC分类号： H01L23/04 ,  H01L21/58 ,  H01L23/48

CPC分类号： H01L23/10 ,  B81B7/0048 ,  B81C2203/019 ,  H01L21/50 ,  H01L21/6835 ,  H01L23/055 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/13109 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81409 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.

摘要翻译： 一种电子部件装置，包括：基板，由金属材料制成的电极柱，设置在基板上，以及连接电极与电极柱连接的电子部件，其中，电子部件的连接电极和电极柱 通过包含与电极柱的金属材料不同的金属的合金层连接。

公开(公告)号：US20090081867A1

公开(公告)日：2009-03-26

申请号：US12233875

申请日：2008-09-19

申请人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/44 ,  H01L21/302

CPC分类号： H01L33/486 ,  B81B2207/096 ,  B81C1/00301 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599

摘要： The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first surface of the silicon substrate; (b) forming a first insulating film to cover the first surface of the silicon substrate, surfaces of the silicon substrate exposed from the through holes, and a second surface of the silicon substrate opposite to the first surface; (c) forming an opening in a portion of the first insulating film provided on the second surface, the portion of the first insulating film corresponding to an area in which the through holes are formed; (d) etching the silicon substrate using the first insulating film provided on the second surface as a mask, thereby forming a cavity in the silicon substrate; and (e) removing the first insulating film.

摘要翻译： 本公开涉及一种制造衬底的方法。 该方法包括：（a）通过从硅衬底的第一表面向硅衬底施加各向异性蚀刻形成通孔; （b）形成第一绝缘膜以覆盖硅衬底的第一表面，从通孔露出的硅衬底的表面和与第一表面相对的硅衬底的第二表面; （c）在设置在第二表面上的第一绝缘膜的一部分中形成开口，第一绝缘膜的与形成通孔的区域相对应的部分; （d）使用设置在第二表面上的第一绝缘膜作为掩模蚀刻硅衬底，从而在硅衬底中形成空腔; 和（e）去除第一绝缘膜。

公开(公告)号：US20110272821A1

公开(公告)日：2011-11-10

申请号：US13098620

申请日：2011-05-02

申请人： Yuichi TAGUCHI ,  Akinori Shiraishi

发明人： Yuichi TAGUCHI ,  Akinori Shiraishi

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/6835 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/1461 ,  H01L2924/00

摘要： A wiring substrate manufactured by thinning a silicon substrate, which is coated by an insulation film, from a lower surface to an upper surface to form a substrate body. The substrate body is etched using a resist, which includes an opening, as a mask and the insulation film as an etching stopper layer to form a through hole and a cover, which covers an opening of the through hole at the upper surface of the substrate body. In a state in which the cover is formed, a functional element is formed on the upper surface of a further insulation film at the upper side of the substrate body. Then, a through electrode is formed in at least the through hole.

摘要翻译： 通过将由绝缘膜涂覆的硅衬底从下表面变薄到上表面而制造的布线衬底以形成衬底本体。 使用包括开口作为掩模的抗蚀剂和作为蚀刻停止层的绝缘膜以形成通孔和覆盖物的覆盖基板本体的上表面的通孔的蚀刻 身体。 在形成盖的状态下，在基板主体的上侧的另一绝缘膜的上表面上形成功能元件。 然后，至少在通孔中形成贯通电极。

公开(公告)号：US20090284276A1

公开(公告)日：2009-11-19

申请号：US12464916

申请日：2009-05-13

申请人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi

发明人： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi

IPC分类号： G01R31/02

CPC分类号： G01R1/06716 ,  G01R1/06755 ,  G01R1/07314 ,  G01R3/00

摘要： A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip.

摘要翻译： 公开了一种探针卡，其包括具有第一表面和彼此背离的第二表面的板和形成在第一表面和第二表面之间的通孔; 以及具有穿透部和支撑部的探针。 穿透部分放置在通孔中而不与板接触并从板的第一和第二表面突出。 所述支撑部与所述贯通部的所述端部的第一端部一体化，且与所述基板的所述第一面和所述第二表面中的一个连接。 支撑部分具有弹簧特性。 穿透部被配置为在半导体芯片上进行电气测试时使其第二端部与半导体芯片的电极焊盘接触。

公开(公告)号：US20120175968A1

公开(公告)日：2012-07-12

申请号：US13343168

申请日：2012-01-04

申请人： Hiroshi KATSUNAGA ,  Yuichi TAGUCHI

发明人： Hiroshi KATSUNAGA ,  Yuichi TAGUCHI

IPC分类号： H02J17/00

CPC分类号： H02J50/12 ,  B60L53/12 ,  B60L53/36 ,  B60L2210/30 ,  B60L2210/40 ,  H02J5/005 ,  H02J7/025 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T10/7241 ,  Y02T90/12 ,  Y02T90/121 ,  Y02T90/122 ,  Y02T90/125 ,  Y02T90/127 ,  Y02T90/14

摘要： A primary coil, a primary resonance coil, a secondary resonance coil, a secondary coil, and a load form a resonant system. A frequency matching section is configured to match the resonant frequency of a resonant system and the output frequency of a high frequency power source with each other when the load fluctuates. An impedance matching section is configured to match the impedance from input terminals of the primary coil to the load at the resonant frequency and the impedance from the high frequency power source to the input terminals of the primary coil with each other.

摘要翻译： 初级线圈，初级共振线圈，次级谐振线圈，次级线圈和负载形成谐振系统。 频率匹配部分被配置为当负载波动时将谐振系统的谐振频率和高频电源的输出频率彼此匹配。 阻抗匹配部被配置为使从初级线圈的输入端子到谐振频率处的负载和从高频电源到初级线圈的输入端子的阻抗彼此匹配的阻抗匹配。

公开(公告)号：US20100049916A1

公开(公告)日：2010-02-25

申请号：US12247508

申请日：2008-10-08

申请人： Noriko NAKAJIMA ,  Yuichi TAGUCHI ,  Jun Mizuno

发明人： Noriko NAKAJIMA ,  Yuichi TAGUCHI ,  Jun Mizuno

IPC分类号： G06F12/16 ,  G06F12/00 ,  G06F1/32

CPC分类号： G06F3/0634 ,  G06F3/0611 ,  G06F3/0625 ,  G06F3/065 ,  G06F3/0689 ,  G06F11/1456 ,  G06F11/1458 ,  Y02D10/154

摘要： A storage subsystem includes: a controller; a first logical storage area corresponding to a RAID group configured by a plurality of storage devices; and a second logical storage area corresponding to a plurality of the RAID groups each configured by the plurality of storage devices, and storing a copy of data stored in the first logical storage area. In the storage subsystem, the first and second logical storage areas form a copy group, and for starting copying from the first to second logical storage area, the controller performs a mode change, from a power saving mode to a ready mode, to the plurality of storage devices configuring the plurality of RAID groups corresponding to the second logical storage area. With such a storage subsystem, the time can be reduced for activating copy-destination storage devices to which a power saving function is applied, and the copy time is thus favorably reduced.

摘要翻译： 存储子系统包括：控制器; 对应于由多个存储设备配置的RAID组的第一逻辑存储区域; 以及对应于由所述多个存储设备配置的多个RAID组的第二逻辑存储区域，并且存储存储在所述第一逻辑存储区域中的数据的副本。 在存储子系统中，第一逻辑存储区域和第二逻辑存储区域形成复制组，并且为了开始从第一逻辑存储区域到第二逻辑存储区域的复制，控制器执行从省电模式到准备模式的模式改变到多个 配置与第二逻辑存储区域对应的多个RAID组的存储装置。 利用这种存储子系统，可以减少用于激活应用功率节省功能的复制目的地存储设备的时间，因此有利地减少了复制时间。

公开(公告)号：US20090232574A1

公开(公告)日：2009-09-17

申请号：US12048642

申请日：2008-03-14

申请人： Akira TAKAHASHI ,  Yuichi TAGUCHI ,  Yutaka INOKUCHI

发明人： Akira TAKAHASHI ,  Yuichi TAGUCHI ,  Yutaka INOKUCHI

IPC分类号： B41J15/02

CPC分类号： B41J15/042 ,  B41J11/70 ,  B65H29/20 ,  B65H29/58 ,  B65H2301/51256 ,  B65H2403/942 ,  B65H2404/6111 ,  B65H2404/632 ,  B65H2801/15

摘要： A printer, which prints by repeatedly reciprocating a rolled recording paper and ejects a printed recording paper, has therein a recording paper storage unit in which the recording paper is temporarily stored. The recording paper storage unit has a configuration formed by at least a part of the periphery of the rolled recording paper or a configuration provided in a space between the rolled paper holder and an ejection slot. This configuration eliminates the need for separately providing a configuration in which a recording paper is set aside when printing a long sheet of printed material and, at the same time, makes the printer smaller.

摘要翻译： 通过反复往复滚动的记录纸并弹出打印的记录纸打印的打印机在其中具有临时存储记录纸的记录纸存储单元。 记录纸存储单元具有由卷状记录纸的周边的至少一部分形成的构造或设置在卷纸保持件与排出槽之间的空间中的构造。 该配置消除了在打印长版印刷材料时单独提供其中记录纸被搁置的配置的需要，并且同时使得打印机更小。