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    METHOD FOR PRODUCING LIGHT-EMITTING SEMICONDUCTOR COMPONENTS AND LIGHT-EMITTING SEMICONDUCTOR COMPONENT
    1.
    发明申请
    METHOD FOR PRODUCING LIGHT-EMITTING SEMICONDUCTOR COMPONENTS AND LIGHT-EMITTING SEMICONDUCTOR COMPONENT 审中-公开

    公开(公告)号：US20200083401A1

    公开(公告)日：2020-03-12

    申请号：US15749768

    申请日：2016-08-10

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： David O'BRIEN ,  Britta GOEOETZ ,  Norwin VON MALM

    IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/06 ,  H01L51/56 ,  H01L27/32 ,  H01L51/52

    摘要： The invention relates, in one embodiment, to a method for producing light-emitting semiconductor components, which method comprises the following steps: A) providing a glass capillary (2) composed of a glass material, B) filling the glass capillary (2) with luminescent substances (3), C) sealing the glass capillary (2) in a sealing region (22) by melting the glass material such that the glass capillary (2) is closed by the glass material itself, and D) attaching the sealed glass capillary (2) to a light-emitting diode chip (4) such that the radiation emitted by the light-emitting diode chip (4) is converted into visible light by the luminescent substances (3) during operation, wherein in step C) a distance between the sealing region (22) and the luminescent substances (3) is at most 7 mm, and wherein the different luminescent substances (3) are separated from each other along a longitudinal axis (L) of the glass capillary (2).

    Optoelectronic Semiconductor Component
    7.
    发明申请
    Optoelectronic Semiconductor Component 审中-公开

    公开(公告)号：US20190214375A1

    公开(公告)日：2019-07-11

    申请号：US16071253

    申请日：2017-03-02

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Siegfried Herrmann

    IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/48 ,  H01L33/60

    CPC分类号： H01L25/0756 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0091

    摘要： An optoelectronic semiconductor component is disclosed. In an embodiment a component includes a housing having a recess, a first semiconductor chip for generating light of a first color and a second semiconductor chip for generating light of a second color which is different from the first color, wherein, during operation, a mixed radiation including at least the light of the first color is emitted along a main emission direction, wherein the first semiconductor chip is arranged in a first plane and the second semiconductor chip is arranged in a second plane in the recess, the planes following one another along the main emission direction, wherein active zones of the first and second semiconductor chips are arranged side by side to one another, and wherein at least one electrical connection surface of the first semiconductor chip forms a part of a mounting surface of the semiconductor component.

    Module for a Video Wall
    8.
    发明申请
    Module for a Video Wall 审中-公开

    公开(公告)号：US20190157247A1

    公开(公告)日：2019-05-23

    申请号：US16098212

    申请日：2017-05-09

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Jürgen Moosburger ,  Frank Singer ,  Thomas Schwarz ,  Alexander Martin

    IPC分类号： H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  G09F9/302

    摘要： A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.

    Optoelectronic Semiconductor Chip
    10.
    发明申请
    Optoelectronic Semiconductor Chip 审中-公开

    公开(公告)号：US20180212107A1

    公开(公告)日：2018-07-26

    申请号：US15742871

    申请日：2016-07-07

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Philipp Kreuter ,  Markus Bröll ,  Jens Müller

    IPC分类号： H01L33/38 ,  H01L33/62 ,  H01L33/20 ,  H01L33/00

    CPC分类号： H01L33/382 ,  H01L33/0062 ,  H01L33/20 ,  H01L33/62

    摘要： An optoelectronic semiconductor chip is disclosed. In an embodiment, the chip includes a semiconductor layer sequence with a first side, a second side and an active zone and at least one via electrically contacting the first side with the second side through the active zone, wherein the via has a base region including a cylinder, a truncated cone or a truncated pyramid, wherein the via is surrounded in a lateral direction by an electric insulation layer, wherein the via has a contact region including a truncated cone, a truncated pyramid, or a spherical or aspherical body, wherein the contract region directly follows the base region, wherein the contact region is in direct contact with the second side, wherein a first flank angle of the base region is different from a second flank angle of the contact region, and wherein the first and second flank angles are related to the lateral direction.