公开(公告)号：US06921015B2

公开(公告)日：2005-07-26

申请号：US10417690

申请日：2003-04-17

申请人： William E. Bernier ,  Donald W. Henderson ,  James Spalik ,  Isabelle Paquin

发明人： William E. Bernier ,  Donald W. Henderson ,  James Spalik ,  Isabelle Paquin

IPC分类号： B23K35/22 ,  C23C8/00 ,  C23C26/00 ,  H01L21/60 ,  H05K3/28 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K35/226 ,  C23C8/00 ,  C23C26/00 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/014 ,  H05K3/282 ,  H05K3/3457

摘要： A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.

摘要翻译： 提供了一种用于保护氧化锡涂覆的焊料表面以防止进一步氧化的方法以及这种表面的无焊剂焊料接合的方法。

公开(公告)号：US06550667B2

公开(公告)日：2003-04-22

申请号：US09726697

申请日：2000-11-29

申请人： William E. Bernier ,  Donald W. Henderson ,  James Spalik

发明人： William E. Bernier ,  Donald W. Henderson ,  James Spalik

IPC分类号： B23K35362

CPC分类号： B23K35/3618 ,  B23K35/3612 ,  B23K35/3617 ,  H05K3/3489

摘要： A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1. A method for using the inventive composition to solder high density arrays which, for eutectic lead/tin solder, involves heating at extended dwell times and high temperature relative to typical compositions.

摘要翻译： 适用于高密度阵列的单相通量组合物，其包含足以与高密度阵列中的氧化表面积反应的二羧酸，第一有机溶剂和具有较高蒸发温度的第二有机溶剂 比所述第一有机溶剂的。 优选的二羧酸是己二酸，庚二酸，辛二酸，壬二酸和癸二酸。 优选地，组合物包含大于6％的二羧酸，更优选大于6％至约15％，甚至更优选约8％至约10％的二羧酸。 第一有机溶剂的优选量为约25重量％至约75重量％，优选的第二有机溶剂的量为约10重量％至约35重量％。 优选地，第一有机溶剂与第二有机溶剂的比例为约3:1。 使用本发明组合物来焊接高密度阵列的方法，对于共晶铅/锡焊料，其涉及相对于典型组合物在延长的停留时间和高温下加热。

公开(公告)号：US06585150B1

公开(公告)日：2003-07-01

申请号：US09687524

申请日：2000-10-12

申请人： William E. Bernier ,  Donald W. Henderson ,  James Spalik ,  Isabelle Paquin

发明人： William E. Bernier ,  Donald W. Henderson ,  James Spalik ,  Isabelle Paquin

IPC分类号： B23K3102

CPC分类号： H01L24/81 ,  B23K35/226 ,  C23C8/00 ,  C23C26/00 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/014 ,  H05K3/282 ,  H05K3/3457

摘要： A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.

摘要翻译： 提供了一种用于保护氧化锡涂覆的焊料表面以防止进一步氧化的方法以及这种表面的无焊剂焊料接合的方法。

公开(公告)号：US07067916B2

公开(公告)日：2006-06-27

申请号：US09885853

申请日：2001-06-20

申请人： William E. Bernier ,  Charles F. Carey ,  Eberhard B. Gramatzki ,  Thomas R. Homa ,  Eric A. Johnson ,  Pierre Langevin ,  Irving Memis ,  Son K. Tran ,  Robert F. White

发明人： William E. Bernier ,  Charles F. Carey ,  Eberhard B. Gramatzki ,  Thomas R. Homa ,  Eric A. Johnson ,  Pierre Langevin ,  Irving Memis ,  Son K. Tran ,  Robert F. White

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H05K3/3436 ,  H01L2924/00

摘要： A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

公开(公告)号：US06425772B1

公开(公告)日：2002-07-30

申请号：US09911270

申请日：2001-07-23

申请人： William E. Bernier ,  Edward G. Bundga

发明人： William E. Bernier ,  Edward G. Bundga

IPC分类号： H01R458

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H01R12/52 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10977 ,  H05K2203/0307 ,  Y10T428/12569 ,  H01L2924/00

摘要： Forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces. The resulting bond is preferably between metal contact pads on a dielectric substrate and on an electronic device. The connection is provided by utilizing a conductive adhesive wherein the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. The polymer preferably is conventional polyimide/siloxane which is a thermoplastic, i.e. upon heating softens and upon cooling sets, and upon reheating will soften and reflow.

摘要翻译： 在具有金属表面的两个制品之间形成各向同性的电连接和机械结合。 所得到的结合优选在电介质基底上的金属接触焊盘和电子器件之间。 通过使用导电粘合剂提供连接，其中导电由其上具有暴露的钯的金属颗粒提供。 颗粒可以是金属钯本身，或者它可以是一些其它金属，例如银，其上涂覆有钯。 颗粒通常是表面上具有初始树枝状形式的钯的薄片，即， 钯具有可以生长成完全形成的针状树枝状结构的多点表面构型。 聚合物优选是热塑性的常规聚酰亚胺/硅氧烷，即加热时软化和冷却组合，并且在再加热时将软化和回流。

公开(公告)号：US08957531B2

公开(公告)日：2015-02-17

申请号：US13277246

申请日：2011-10-20

申请人： William E. Bernier ,  Timothy H. Daubenspeck ,  Virendra R. Jadhav ,  Valerie A. Oberson ,  David L. Questad

发明人： William E. Bernier ,  Timothy H. Daubenspeck ,  Virendra R. Jadhav ,  Valerie A. Oberson ,  David L. Questad

IPC分类号： H01L23/538 ,  H01L21/66 ,  H01L23/00 ,  G01N3/60 ,  G01N19/04

CPC分类号： H01L22/30 ,  B05D1/36 ,  G01N3/60 ,  G01N19/04 ,  G01N25/16 ,  G01N2203/0296 ,  G01N2203/0298 ,  H01L24/13 ,  H01L2224/131 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00

摘要： A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.

摘要翻译： 公开了一种对称的平板层压结构，用于使测试结构中的变量最小化，以实验测量白色凸起对CTE不匹配的敏感性。 测试结构包括平板层压结构。 使用测试结构的方法包括隔离多变量芯片连接问题的原因，其由翘曲不利地影响并量化翘曲的贡献本身在多变量芯片连接问题的形成中。

公开(公告)号：US08444043B1

公开(公告)日：2013-05-21

申请号：US13362228

申请日：2012-01-31

申请人： William E. Bernier ,  Marcus E. Interrante ,  Rajneesh Kumar ,  Chenzhou Lian ,  Janak G. Patel ,  Peter Slota, Jr.

发明人： William E. Bernier ,  Marcus E. Interrante ,  Rajneesh Kumar ,  Chenzhou Lian ,  Janak G. Patel ,  Peter Slota, Jr.

IPC分类号： B23K31/00 ,  B23K31/02

CPC分类号： H01L23/49816 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K2101/42 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75101 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.

摘要翻译： 一组焊球附着到第一衬底和第二衬底之一的焊盘上。 在相对于第一基板和第二基板中的另一个的焊盘对准焊球的阵列之后，将热质量增加的夹具放置在第二基板的表面上以形成第一基板的组件，第二基板 基板以及它们之间的焊球的阵列，以及热质量增加夹具。 热质量增加夹具与第二基板的周边的至少一个表面物理接触。 热质量增加夹具降低了回流步骤后外围焊球的冷却速率，从而增加了冷却期间外围焊球变形的时间，并降低了冷却后焊锡球上的机械应力 。

公开(公告)号：US07442878B2

公开(公告)日：2008-10-28

申请号：US11538823

申请日：2006-10-05

申请人： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

发明人： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

IPC分类号： H05K1/16

CPC分类号： H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

摘要翻译： 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US20080250725A1

公开(公告)日：2008-10-16

申请号：US12100084

申请日：2008-04-09

申请人： Glen A. Smith ,  William E. Bernier

发明人： Glen A. Smith ,  William E. Bernier

IPC分类号： C09K3/14

CPC分类号： B24D5/06 ,  C09K3/1409 ,  D21B1/063

摘要： Pulp production techniques are disclosed. In one embodiment, pulpstone segments are provided, that include proppant grits in the place of some or all of the conventional abrasive typically used in pulpstone applications. The proppant or proppant-abrasive mixture can be combined into a three-dimensional matrix supported by a vitrified bond. Alternative embodiments use proppant grits in an organic bond or a metal bond or a cement bond (each of which may also include abrasive grits in addition to proppant grits). The proportion of proppant grits to abrasive grits can be varied to produce pulp of varying fiber length distribution as required by the end-user (e.g., paper mill). The greater the proppant concentration, the less cutting of the fibers by the conventional abrasive will occur, producing a greater percentage content of longer fibers. Such pulp produces higher quality paper.

摘要翻译： 公布了纸浆生产技术。 在一个实施例中，提供了纸浆段，其包括支撑剂砂粒代替通常用于纸浆应用中的一些或全部常规磨料。 支撑剂或支撑剂 - 研磨剂混合物可以组合成由玻璃化键支撑的三维基质。 替代实施例使用有机粘结剂或金属粘结剂或粘结剂粘合剂中的支撑剂砂砾（除了支撑剂砂砾之外，每种也可包括磨料砂粒）。 可以改变支撑剂砂粒对磨料砂粒的比例，以产生根据最终用户（例如造纸厂）所要求的不同纤维长度分布的纸浆。 支撑剂浓度越大，将会发生常规研磨剂对纤维的切割越少，从而产生更长的纤维含量。 这样的纸浆产生更高质量的纸张。

公开(公告)号：US07332821B2

公开(公告)日：2008-02-19

申请号：US10711076

申请日：2004-08-20

申请人： William E. Bernier ,  Tien-Jen Cheng ,  Marie S. Cole ,  David E. Eichstadt ,  Mukta G. Farooq ,  John A. Fitzsimmons ,  Lewis S. Goldmann ,  John U. Knickerbocker ,  Tasha E. Lopez ,  David J. Welsh

发明人： William E. Bernier ,  Tien-Jen Cheng ,  Marie S. Cole ,  David E. Eichstadt ,  Mukta G. Farooq ,  John A. Fitzsimmons ,  Lewis S. Goldmann ,  John U. Knickerbocker ,  Tasha E. Lopez ,  David J. Welsh

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/488 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L23/3171 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13566 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R43/0256 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/0401

摘要： Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.

摘要翻译： 公开了一种形成集成电路结构的方法，其在器件上形成无铅连接器，用可压缩膜围绕无铅连接器，将器件连接到载体（无铅连接器将器件电连接到载体上 ），并用绝缘底部填充物填充载体和装置之间的间隙。