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91.发明授权Adhesive composition, an adhesive sheet and a production method of a semiconductor device 有权粘合剂组合物，粘合片和半导体装置的制造方法公开(公告)号：US09382455B2
公开(公告)日：2016-07-05
申请号：US13832210
申请日：2013-03-15
申请人： LINTEC Corporation
发明人： Sayaka Tsuchiyama , Isao Ichikawa
IPC分类号： B32B27/30 , B32B27/38 , C09J133/08 , C09J133/10 , C09J133/14 , H01L21/784 , H01L23/14 , C09J133/00 , H01L21/78 , H01L21/683 , B32B17/10 , C09J163/00 , C09J133/06 , H01L23/00 , H01L23/29
CPC分类号： C09J133/00 , B32B17/10697 , B32B17/10733 , B32B17/10743 , C09J133/066 , C09J133/08 , C09J133/10 , C09J163/00 , H01L21/6836 , H01L21/78 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68377 , H01L2221/68381 , H01L2224/27003 , H01L2224/27436 , H01L2224/2929 , H01L2224/29387 , H01L2224/2949 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/83 , H01L2224/83048 , H01L2224/83191 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/83907 , H01L2224/92 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , Y10T428/2826 , H01L2224/27 , H01L2924/0635 , H01L2924/05442 , H01L2924/00012 , H01L2224/45099 , H01L2924/00
摘要： An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.
摘要翻译： 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和表面具有反应性双键的填料（C）。
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公开(公告)号：US20160172328A1
公开(公告)日：2016-06-16
申请号：US14966585
申请日：2015-12-11
CPC分类号： H01L24/83 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F7/064 , B22F9/24 , B22F2301/255 , B22F2303/01 , B22F2304/054 , B22F2304/056 , B22F2999/00 , B23K1/0008 , B23K1/0016 , B23K1/20 , B23K1/203 , B23K35/025 , B23K35/3006 , B23K35/36 , B23K35/3618 , B23K2101/42 , B82Y30/00 , C09J11/06 , C22C5/06 , H01B1/02 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/29139 , H01L2224/29339 , H01L2224/2949 , H01L2224/32145 , H01L2224/32221 , H01L2224/83011 , H01L2224/83048 , H01L2224/83075 , H01L2224/83801 , H01L2224/8384 , H01L2924/00 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/203 , H05K3/32 , H05K3/3489 , H05K2201/0257 , H05K2203/086 , H05K2203/1131 , H01L2224/2919 , H01L2924/3512
摘要： A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
摘要翻译： 接合两种不同物质的方法包括以下步骤：将包含含有至少两个羧基的有机材料的助熔剂成分的接合材料施加到接合物的接合表面，将待接合物体设置在接合材料上 在设置待接合物体的状态下，在预设温度下进行预烧，并且在比预热的温度高的温度下进行加热。
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公开(公告)号：US09365749B2
公开(公告)日：2016-06-14
申请号：US14054529
申请日：2013-10-15
发明人： S. Kumar Khanna
CPC分类号： C09J9/02 , C08K9/08 , C09J11/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83007 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83986 , H01L2924/00014 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2924/00 , H01L2224/0401
摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。
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公开(公告)号：US20160099087A1
公开(公告)日：2016-04-07
申请号：US14966598
申请日：2015-12-11
CPC分类号： H01L24/83 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F7/064 , B22F9/24 , B22F2301/255 , B22F2303/01 , B22F2304/054 , B22F2304/056 , B22F2999/00 , B23K1/0008 , B23K1/0016 , B23K1/20 , B23K1/203 , B23K35/025 , B23K35/3006 , B23K35/36 , B23K35/3618 , B23K2101/42 , B82Y30/00 , C09J11/06 , C22C5/06 , H01B1/02 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/29139 , H01L2224/29339 , H01L2224/2949 , H01L2224/32145 , H01L2224/32221 , H01L2224/83011 , H01L2224/83048 , H01L2224/83075 , H01L2224/83801 , H01L2224/8384 , H01L2924/00 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/203 , H05K3/32 , H05K3/3489 , H05K2201/0257 , H05K2203/086 , H05K2203/1131 , H01L2224/2919 , H01L2924/3512
摘要： A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.
摘要翻译： 通过涂布含有平均一次粒径为1〜200nm的银纳米粒子的银膏，进行烧成，得到粘合体。 在惰性气氛中在250℃加热10分钟时，Ag的（111）面上的结合产物的微晶直径为65nm以上。
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95.发明授权Production method for polyamide acid particles, production method for polyimide particles, polyimide particles and bonding material for electronic component 有权聚酰胺酸粒子的制造方法，聚酰亚胺粒子的制造方法，聚酰亚胺粒子，电子部件用接合材料等公开(公告)号：US09228118B2
公开(公告)日：2016-01-05
申请号：US13993808
申请日：2011-12-14
申请人： Satoshi Hayashi
发明人： Satoshi Hayashi
IPC分类号： C09J179/08 , C08L3/14 , C08J3/14 , H01L23/29 , C09J177/06 , C08G73/10 , C08G73/22 , H01L23/00
CPC分类号： C09J179/08 , C08G73/1025 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/22 , C08J3/14 , C08J2379/08 , C08L63/00 , C09J177/06 , H01L23/293 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/27416 , H01L2224/27436 , H01L2224/2929 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/2949 , H01L2224/32225 , H01L2224/73203 , H01L2224/81191 , H01L2224/81203 , H01L2224/81447 , H01L2224/81815 , H01L2224/83191 , H01L2224/83203 , H01L2224/8385 , H01L2224/9211 , H01L2924/01012 , H01L2924/01029 , H01L2924/15788 , H01L2924/351 , H01L2924/00014 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/07025 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： An object of the present invention is to provide a method for producing polyamide acid particles which is used as a raw material for polyimide particles with a small average particle diameter having high heat resistance. Other objects of the present invention are to provide a method for producing polyimide particles using the method for producing polyamide acid particles, and polyimide particles produced by the method for producing polyimide particles. Yet another object of the present invention is to provide a bonding material for an electronic component, which has a low linear expansion coefficient and a low elastic modulus after being cured in the temperature range equal to or less than the glass transition temperature, so that a joined body with high reliability can be produced. The present invention is a method for producing polyamide acid particles having a step of preparing a solution having a diamine compound dissolved, and a step of precipitating polyamide acid particles by adding a tetracarboxylic anhydride in a non-solution state to the solution having a diamine compound dissolved while applying a physical impact thereto.
摘要翻译： 本发明的目的是提供一种聚酰胺酸性粒子的制造方法，其用作具有高耐热性的平均粒径小的聚酰亚胺粒子的原料。 本发明的其他目的在于提供一种使用聚酰胺酸粒子的制造方法制造聚酰亚胺粒子的方法以及通过聚酰亚胺粒子的制造方法制造的聚酰亚胺粒子。 本发明的另一个目的是提供一种用于电子部件的接合材料，其在等于或小于玻璃化转变温度的温度范围内固化后具有低线性膨胀系数和低弹性模量，使得 可以生产高可靠性的接合体。 本发明是一种制备具有制备溶解有二胺化合物的溶液的步骤的聚酰胺酸颗粒的方法，以及通过向具有二胺化合物的溶液中加入非溶解状态的四羧酸酐来沉淀聚酰胺酸颗粒的步骤 溶解，同时对其施加物理影响。
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96.发明授权Method for manufacturing semiconductor device and adhesive for mounting flip chip 有权用于制造半导体器件的方法和用于安装倒装芯片的粘合剂公开(公告)号：US09209155B2
公开(公告)日：2015-12-08
申请号：US14391781
申请日：2013-08-05
IPC分类号： H01L21/00 , H01L23/48 , H01L23/00 , H01L21/768 , C09J163/00
CPC分类号： H01L24/29 , C08K9/06 , C09J163/00 , H01L21/563 , H01L21/76841 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/131 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27416 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29387 , H01L2224/2949 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/83091 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83204 , H01L2224/83855 , H01L2224/83862 , H01L2224/83907 , H01L2224/83986 , H01L2224/9205 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2924/0665 , H01L2924/12042 , H01L2924/20106 , H01L2924/3512 , H01L2924/3841 , H01L2924/00014 , H01L2924/014 , H01L2924/00 , H01L2224/27 , H01L2924/05442 , H01L2924/00012
摘要： The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ΔE of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C., and a reaction rate of 40% or less at 4 seconds at 260° C., as determined by differential scanning calorimetry and Ozawa method.
摘要翻译： 本发明的目的在于提供一种半导体器件的制造方法，该方法能够通过抑制空穴来实现高的可靠性。 本发明还旨在提供一种用于制造半导体器件的方法的倒装芯片安装粘合剂。 半导体器件的制造方法技术领域本发明涉及半导体器件的制造方法，其特征在于，包括：步骤1，通过粘合剂将半导体芯片定位在基板上，所述半导体芯片具有各自具有由焊料构成的端部的凸块电极; 在焊料的熔点或更高温度下加热半导体芯片以进行焊接并将半导体芯片的凸块电极接合到基板的电极部分的步骤2，并且同时临时固定粘合剂; 以及步骤3，通过在加压气氛下加热所述粘合剂来除去空隙，其中所述粘合剂具有100kJ / mol以下的活化能和Dgr; E，在260℃下2秒的反应速率为20％以下， 并且通过差示扫描量热法和小泽法测定，在260℃下4秒钟的反应速率为40％以下。
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公开(公告)号：US20150115018A1
公开(公告)日：2015-04-30
申请号：US14394347
申请日：2013-08-20
申请人： KAKEN TECH CO., LTD.
发明人： Shigeo Hori , Hirohiko Furui , Akira Fujita
CPC分类号： H01L24/83 , B22F1/0051 , B22F1/0062 , B22F1/0074 , B22F9/24 , B23K1/0008 , B23K1/0016 , B23K31/12 , B23K35/025 , B23K35/3006 , B23K35/3613 , H01B1/22 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/04026 , H01L2224/05639 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/27416 , H01L2224/29294 , H01L2224/29339 , H01L2224/29387 , H01L2224/2939 , H01L2224/29395 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32227 , H01L2224/32245 , H01L2224/83055 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/8323 , H01L2224/83439 , H01L2224/8384 , H01L2924/01047 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/05442 , H01L2924/0665 , H01L2924/066
摘要： Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste.Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 μm as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2θ=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2θ=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C., 60 minutes) of the silver particles is designated as S2, the value of S2/S1 is adjusted to a value within the range of 0.2 to 0.8.
摘要翻译： 提供：通过使用通过XRD分析定义的具有规定的晶体变换特性的银粒子容易地控制导电性糊剂的银粒子的烧结性的导电性糊料，并且在烧结处理之后，可以稳定地获得优异的导电性和导热性 ; 以及使用导电性糊料的芯片接合方法。 公开了一种导电性糊剂，其包含体积平均粒径为0.1〜30μm的银粒子作为可烧结导电材料，以及用于形成糊状形态的分散介质，其中当2θ的峰值的积分强度 ;在银粒子的烧结处理之前通过XRD分析得到的X射线衍射图中，= 38°±0.2°表示为S1，峰值在2θ时的积分强度= 38°±0.2° 将银粒子的烧结处理（250℃，60分钟）后的XRD分析得到的X射线衍射图表示为S2，将S2 / S1的值调整为0.2〜0.8的范围 。
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98.发明申请METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUNTING FLIP CHIP 有权制造半导体器件的方法和用于安装片芯的粘合剂公开(公告)号：US20150064847A1
公开(公告)日：2015-03-05
申请号：US14391781
申请日：2013-08-05
IPC分类号： H01L23/00
CPC分类号： H01L24/29 , C08K9/06 , C09J163/00 , H01L21/563 , H01L21/76841 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/131 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27416 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29387 , H01L2224/2949 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/83091 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83204 , H01L2224/83855 , H01L2224/83862 , H01L2224/83907 , H01L2224/83986 , H01L2224/9205 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2924/0665 , H01L2924/12042 , H01L2924/20106 , H01L2924/3512 , H01L2924/3841 , H01L2924/00014 , H01L2924/014 , H01L2924/00 , H01L2224/27 , H01L2924/05442 , H01L2924/00012
摘要： The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ΔE of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C., and a reaction rate of 40% or less at 4 seconds at 260° C., as determined by differential scanning calorimetry and Ozawa method.
摘要翻译： 本发明的目的在于提供一种半导体器件的制造方法，该方法能够通过抑制空穴来实现高的可靠性。 本发明还旨在提供一种用于制造半导体器件的方法的倒装芯片安装粘合剂。 半导体器件的制造方法技术领域本发明涉及半导体器件的制造方法，其特征在于，包括：步骤1，通过粘合剂将半导体芯片定位在基板上，所述半导体芯片具有各自具有由焊料构成的端部的凸块电极; 在焊料的熔点或更高温度下加热半导体芯片以进行焊接并将半导体芯片的凸块电极接合到基板的电极部分的步骤2，并且同时临时固定粘合剂; 以及步骤3，通过在加压气氛下加热所述粘合剂来除去空隙，其中所述粘合剂具有100kJ / mol以下的活化能和Dgr; E，在260℃下2秒的反应速率为20％以下， 并且通过差示扫描量热法和小泽法测定，在260℃下4秒钟的反应速率为40％以下。
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公开(公告)号：US20140353540A1
公开(公告)日：2014-12-04
申请号：US14054529
申请日：2013-10-15
发明人： S. Kumar Khanna
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08K9/08 , C09J11/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/16505 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29387 , H01L2224/29393 , H01L2224/29395 , H01L2224/29439 , H01L2224/29444 , H01L2224/29488 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32058 , H01L2224/3213 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/73204 , H01L2224/75101 , H01L2224/75264 , H01L2224/75272 , H01L2224/75804 , H01L2224/83007 , H01L2224/83055 , H01L2224/831 , H01L2224/83192 , H01L2224/8321 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2224/83887 , H01L2224/83906 , H01L2224/83986 , H01L2924/00014 , H05K3/323 , H05K2203/104 , H01L2924/01006 , H01L2924/066 , H01L2924/00012 , H01L2224/83886 , H01L2924/00 , H01L2224/0401
摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。
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100.发明申请公开(公告)号：US20140290059A1
公开(公告)日：2014-10-02
申请号：US14224003
申请日：2014-03-24
申请人： FUJIFILM CORPORATION
发明人： Takeaki KAWASHIMA
CPC分类号： H01B7/0009 , C08K3/08 , C08K3/36 , C08K9/02 , C08K2201/016 , C09J7/10 , C09J9/02 , C09J2201/28 , C09J2201/602 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2205/106 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16237 , H01L2224/16238 , H01L2224/27003 , H01L2224/2711 , H01L2224/27334 , H01L2224/29016 , H01L2224/29076 , H01L2224/2919 , H01L2224/2929 , H01L2224/2939 , H01L2224/294 , H01L2224/2949 , H01L2224/32145 , H01L2224/32225 , H01L2224/81191 , H01L2224/83192 , H01L2224/83345 , H01L2224/83851 , H01L2924/15788 , H01R43/16 , H05K3/321 , H05K2201/10378 , H05K2201/10674 , Y10T29/49208 , Y10T428/24479 , H01L2924/00012 , H01L2924/00
摘要： An anisotropic conductive film includes: an insulation region having a planer shape and containing an insulating filler at a first content rate; and a plurality of conductive particle holding regions arranged in the insulation region, the conductive particle holding regions holding conductive particles and containing the insulating filler at a second content rate lower than the first content rate, the conductive particle holding regions being arranged discretely in a planar direction of the insulation region. A method of making conductive connection between a first terminal arranged on a first member and a second terminal arranged on a second member includes: preliminarily tacking the anisotropic conductive film to the first member; holding the first and second members such that the first and second terminals face to each other across the preliminarily tacked anisotropic conductive film; pressing the first and second members to each other; and heating the anisotropic conductive film.
摘要翻译： 各向异性导电膜包括：具有平面形状并且以第一含量速率包含绝缘填料的绝缘区域; 以及布置在所述绝缘区域中的多个导电粒子保持区域，所述导电粒子保持区域保持导电粒子并且以比所述第一含有率低的第二含量率包含所述绝缘填料，所述导电粒子保持区域分散地布置在平面 绝缘区域的方向。 在布置在第一构件上的第一端子和布置在第二构件上的第二端子之间进行导电连接的方法包括：预先将各向异性导电膜固定到第一构件; 保持第一和第二构件，使得第一和第二端子跨越预先粘合的各向异性导电膜彼此面对; 将第一和第二成员彼此按压; 并加热各向异性导电膜。
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