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    MICRO DEVICE ARRAY
    101.
    发明申请
    MICRO DEVICE ARRAY 有权
    微型设备阵列

    公开(公告)号：US20130128585A1

    公开(公告)日：2013-05-23

    申请号：US13708704

    申请日：2012-12-07

    Applicant: LUXVUE TECHNOLOGY CORPORATION

    Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

    IPC: H01L33/04 ,  F21V7/00 ,  H01L29/06

    CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

    Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

    RFID tag and micro chip integration design
    104.
    发明授权
    RFID tag and micro chip integration design 有权
    RFID标签和微芯片集成设计

    公开(公告)号：US09542638B2

    公开(公告)日：2017-01-10

    申请号：US14183427

    申请日：2014-02-18

    Applicant: LuxVue Technology Corporation

    Inventor： Vikram Pavate ,  Andreas Bibl

    IPC: G06K19/06 ,  G06K19/077 ,  H05K1/02 ,  H05K1/16

    CPC classification number: G06K19/07783 ,  H05K1/0293 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/175 ,  Y10T29/49144 ,  Y10T29/53174

    Abstract: An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.

    Abstract translation: 描述了集成微芯片，集成微芯片的方法和微芯片集成系统。 在一个实施例中，诸如微型RFID芯片或集成无源器件（IPD）的微芯片被静电转印并结合到包括断线的导电图案。 在一个实施例中，线断裂通过合适的切割技术形成，例如激光激光烧蚀，离子束蚀刻或具有化学蚀刻的光刻以适应微芯片。

    Compliant electrostatic transfer head with spring support layer
    105.
    发明授权
    Compliant electrostatic transfer head with spring support layer 有权
    符合静电转印头带弹簧支撑层

    公开(公告)号：US09425151B2

    公开(公告)日：2016-08-23

    申请号：US14307325

    申请日：2014-06-17

    Applicant: LuxVue Technology Corporation

    Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

    IPC: H01L21/768 ,  H01L23/538 ,  H01L23/00

    CPC classification number: H01L23/5384 ,  B81C99/002 ,  H01L21/76898 ,  H01L24/75 ,  H01L24/95

    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

    Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底中的空腔，在基底衬底上的弹簧支撑层，以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓，该弹性支撑层梁型材向空腔延伸并且可偏转，并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。

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