公开(公告)号：US06324754B1

公开(公告)日：2001-12-04

申请号：US09047638

申请日：1998-03-25

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad

IPC: H05K334

CPC classification number: H01L24/81 ,  H01L23/49838 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0397 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solder ball and keeps the solder ball down in the desired position thereby minimizing variations in height of the resulting solder bumps. Also, the solder pad may include non-wettable surfaces defined by a non-wettable metal, a metal compound or a dielectric material. The non-wettable areas on the pad confine the solder and avoid the need for a separate solder mask.

Abstract translation: 用于微电子连接的焊盘由一组从中心点径向向外延伸的可焊接润湿条形成。 固体芯焊球位于每个焊盘上并回流。 焊盘配置有助于使焊球居中，并将焊球保持在所需位置，从而最小化所得焊料凸块的高度变化。 此外，焊盘可以包括由非可润湿金属，金属化合物或电介质材料限定的不可润湿表面。 焊盘上的不可润湿区域限制焊料，并避免需要单独的焊接掩模。

公开(公告)号：US06247228B1

公开(公告)日：2001-06-19

申请号：US08989305

申请日：1997-12-12

Applicant: Thomas H. Distefano ,  Joseph Fjelstad

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H05K336

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

公开(公告)号：US06239384B1

公开(公告)日：2001-05-29

申请号：US09020754

申请日：1998-02-09

Applicant: John W. Smith ,  Joseph Fjelstad

Inventor： John W. Smith ,  Joseph Fjelstad

IPC: H01R909

CPC classification number: H01L23/3107 ,  H01L23/49572 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H01L24/50 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/118

Abstract: A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or first signal conductor for connection to a first contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor, or as a second signal conductor connected to a second contact on the chip. The system provides enhanced resistance to crosstalk and rapid signal transmission, and is compatible with differential signal transmission.

Abstract translation: 微电子连接部件具有由其上具有金属导体的聚合物条形成的柔性引线。 金属导体可以非常薄，期望小于5微米厚，并且提供良好的耐疲劳性。 每个条带可以在其上具有两个导体，一个用作连接到芯片或其他微电子元件上的第一触点的另一个用作主要信号导体或第一信号导体，另一个用作电位参考或接地导体，或者作为连接到 第二次接触芯片。 该系统提供增强的串扰阻抗和快速信号传输，并且与差分信号传输兼容。

公开(公告)号：US6107682A

公开(公告)日：2000-08-22

申请号：US387880

申请日：1999-09-01

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/14 ,  H01L23/28 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10S438/977

Abstract: A semiconductor chip assembly with a frame having an aperture, a continuous rail enclosing the aperture and bonds pads disposed on the top surface of the continuous rail; a semiconductor chip having contacts on its top surface fitted within the aperture; a plurality of wire loops connecting the bond pads to the contacts, and a compliant layer disposed over the first surface of the semiconductor chip and the plurality of wire loops such that the top portion of each wire loop is exposed. The semiconductor chip assembly can be incorporated into a larger assembly by connecting the wire loops to connection pads on an external substrate.

Abstract translation: 一种半导体芯片组件，其具有带有孔的框架，连续的轨道封闭所述孔并且连接设置在所述连续轨道的顶表面上的焊盘; 半导体芯片，其上表面上具有接合孔，该顶面安装在所述孔内; 将所述接合焊盘连接到所述触点的多个线环，以及设置在所述半导体芯片的所述第一表面上的柔顺层和所述多个线环，使得每个线环的顶部被暴露。 通过将线圈连接到外部基板上的连接焊盘，可以将半导体芯片组件并入更大的组件。

公开(公告)号：US5989939A

公开(公告)日：1999-11-23

申请号：US989368

申请日：1997-12-12

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L21/283 ,  H01L21/56 ,  H01L21/58

CPC classification number: H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10S438/977

Abstract: A method of making a assembly including the steps of fitting a chip within an aperture in a frame, connecting the bond pads on the frame to the contacts on the chip by forming wire loops therebetween, dispensing a compliant material over the frame, chip and wire loops for form a compliant layer, and plasma etching the top surface of the compliant layer to expose the top portion of each wire loop. The semiconductor chip assembly can then be incorporated into a larger assembly by connecting the wire loops to connection pads on an external substrate.

Abstract translation: 一种制造组件的方法，包括以下步骤：将芯片安装在框架中的孔内，通过在其间形成线环将框架上的接合焊盘连接到芯片上的触点，在框架，芯片和线上分配柔性材料 用于形成柔顺层的环，以及等离子体蚀刻柔顺层的顶表面以暴露每个导线环的顶部。 然后可以通过将线环连接到外部衬底上的连接焊盘将半导体芯片组件并入更大的组件中。

公开(公告)号：US5966587A

公开(公告)日：1999-10-12

申请号：US020613

申请日：1998-02-09

Applicant: Konstantine Karavakis ,  Joseph Fjelstad

Inventor： Konstantine Karavakis ,  Joseph Fjelstad

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  G01R31/26 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/66

CPC classification number: H01L24/05 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A method of forming a microelectronic assembly having an element with contacts on a front surface thereof, an interposer with a plurality of connecting terminals in a connecting terminal region and bonding terminals in a bonding terminal region electrically connected to the connecting terminals includes the steps of juxtaposing the interposer with the microelectronic element so that the connecting terminals and bonding terminals of the interposer face away from the front surface of the element and so that the bonding terminal region is adjacent to the contacts of the microelectronic element; and connecting at least some of the contacts with at least some of the bonding terminals by a plurality of flexible leads while supporting the bonding terminals against the vertical movement to facilitate the connection.

Abstract translation: 一种形成具有在其表面上具有触点的元件的微电子组件的方法，在连接端子区域中具有多个连接端子的插入件以及与连接端子电连接的接合端子区域中的接合端子包括并置的步骤 所述插入器与所述微电子元件相连，使得所述插入器的所述连接端子和所述接合端子远离所述元件的前表面，并且所述接合端子区域与所述微电子元件的所述触点相邻; 以及通过多个柔性引线将至少一些所述接合端与至少一些所述接合端子连接，同时支撑所述接合端子以抵抗所述垂直运动以便于所述连接。

公开(公告)号：US5934914A

公开(公告)日：1999-08-10

申请号：US845016

申请日：1997-04-22

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC: B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

公开(公告)号：US5812378A

公开(公告)日：1998-09-22

申请号：US511131

申请日：1995-08-04

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H05K7/12 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/72 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06733 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子的连接器包括具有多个孔的片状体，理想地布置成规则的格子图案。 每个孔设置有弹性层状接触，例如金属板的环，其具有在主体的第一主表面的孔的内部向内延伸的多个突起。 连接器主体的第二表面上的端子电连接到触点。 连接器可以附接到诸如多层电路板的基板，使得连接器上的端子电连接到基板内的引线。 具有凸起引线的微电子元件可以与连接器接合并且因此连接到基板，通过将凸块引线推进到连接器的孔中以与触点接合凸起引线。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US5776796A

公开(公告)日：1998-07-07

申请号：US726697

申请日：1996-10-07

Applicant: Thomas H. Distefano ,  John W. Smith ,  Joseph Fjelstad ,  Craig S. Mitchell ,  Konstantine Karavakis

Inventor： Thomas H. Distefano ,  John W. Smith ,  Joseph Fjelstad ,  Craig S. Mitchell ,  Konstantine Karavakis

IPC: H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/50 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042

Abstract: A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly having a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on a first end and bonded to respective chip contacts on a second end. Typically, the spacer layer is comprised of a compliant or elastomeric material. A protective layer is attached on a bottom surface of the substrate so as to cover the terminals on the substrate. A flowable, curable encapsulant material is deposited around a periphery of the semiconductor chip after the attachment of the protective layer so as to encapsulate the leads. The encapsulant material is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.

Abstract translation: 一种封装半导体器件的方法。 封装方法包括：半导体芯片封装组件，其具有在片状基板的顶表面和半导体芯片的接触支承表面之间的间隔层，其中，所述基板在其上具有导电引线，所述引线电连接到 第一端并且在第二端上结合到各个芯片触点。 通常，间隔层由顺应性或弹性体材料构成。 保护层附着在基板的底面，以覆盖基板上的端子。 在安装保护层以便封装引线之后，可流动的可固化的密封剂材料围绕半导体芯片的周边沉积。 然后固化密封材料。 通常，这种封装方法同时在多个芯片组件上执行。

公开(公告)号：US5763941A

公开(公告)日：1998-06-09

申请号：US547170

申请日：1995-10-24

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/498 ,  H01L23/538 ,  H05K3/40 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/5387 ,  H05K3/4092 ,  H01L2924/0002 ,  H01L2924/12044

Abstract: A connection component for a microelectronic device such as a semiconductor chip incorporates a dielectric layer and leads extending across a surface of the dielectric layer. Each lead has one end permanently fastened to the dielectric layer and another end releasably bonded to the dielectric layer. The releasable end is held in place by a bond having a relatively low peel strength, desirably less than about 0.35.times.10.sup.6 dynes/cm.