公开(公告)号：US06548328B1

公开(公告)日：2003-04-15

申请号：US09671135

申请日：2000-09-27

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L2144

CPC分类号： H01L24/48 ,  H01L21/4821 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/165 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48739 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/187 ,  H05K1/188 ,  H05K3/06 ,  H05K3/202 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/07811 ,  H01L2224/83205

摘要： After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 requisite for the circuit are formed, and can be prevented from slipping because of the curved structure 59 and a visor 58.

摘要翻译： 在导电箔60中形成沟槽54之后，安装电路元件，并且将绝缘树脂施加在作为支撑基板的导电箔60上。 反转后，将导电箔60作为用于分离的导电路径的支撑基板在绝缘树脂50上进行研磨。 因此，可以制造其中导电通路51和电路元件52由绝缘树脂50支撑的电路装置，而不使用支撑基板。 并且形成电路所需的互连L1至L3，并且可以防止由于弯曲结构59和遮阳板58而滑动。

公开(公告)号：US06545364B2

公开(公告)日：2003-04-08

申请号：US09810110

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi ,  Hirokazu Fukuda ,  Hiroki Etou

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi ,  Hirokazu Fukuda ,  Hiroki Etou

IPC分类号： H01L2348

CPC分类号： H01L24/40 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/06 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate.

公开(公告)号：US06531370B2

公开(公告)日：2003-03-11

申请号：US09944322

申请日：2001-08-31

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L21331

CPC分类号： H01L22/20 ,  H01L21/4832 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/06 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： After mounting portions (65) are formed in each block (62), circuit elements are mounted on the mounting portions (65) and molded with insulating resin (50). Then, the back surface of conductive foil (60) is etched to form conductive patterns 51in each block. Further, a plurality of blocks are bonded onto a adhesive sheet so that a testing step and a dicing step are carried out upon the blocks in a lump.

公开(公告)号：US07220921B1

公开(公告)日：2007-05-22

申请号：US09678142

申请日：2000-10-03

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： In the present invention there is formed a sheet-like board member 50 having conductive coating films, such as first pads 55 and die pads 59, formed thereon or a sheet-like board member 50 which has been half-etched by using conductive coating films such as first pads 55 and die pads 59. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.

摘要翻译： 在本发明中，形成有具有导电性涂膜的片状基板部件50，例如形成在其上的第一焊盘55和焊盘59，或者通过使用导电性涂膜半刻蚀的片状基板部件50 例如第一焊盘55和焊盘59。 可以通过利用半导体制造商的后处理工艺来制造混合IC。 此外，可以在不采用支撑板的情况下制造混合IC，因此可以制造具有较低轮廓并具有优异散热特性的混合IC。

公开(公告)号：US06975022B2

公开(公告)日：2005-12-13

申请号：US09809917

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/28 ,  H01L21/48 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H01L23/495

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48669 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48769 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85469 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A device containing a flat member is provided, having a pattern for a bonding pad, a wiring, and an electrode, by half-etching through the flat member.

摘要翻译： 提供一种包含平坦部件的装置，其具有用于焊盘，布线和电极的图案，通过半平板部件的半蚀刻。

公开(公告)号：US20050206014A1

公开(公告)日：2005-09-22

申请号：US11119439

申请日：2005-04-29

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi ,  Takeshi Nakamura

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi ,  Takeshi Nakamura

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L23/3121 ,  H01L21/4828 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： As conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided.

公开(公告)号：US06933604B2

公开(公告)日：2005-08-23

申请号：US09810117

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/28 ,  H01L21/48 ,  H01L23/12 ,  H01L23/29 ,  H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H01L23/34 ,  H01L23/995 ,  H01L921/4763

CPC分类号： H05K1/021 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73257 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K1/0204 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24).

摘要翻译： 半导体芯片（16）的背面从绝缘树脂（13）的背面露出，金属板（23）固定在该半导体芯片（16）上。 该金属板（23）的后表面和第一支撑构件（11）的后表面基本上位于同一平面内，从而容易地固定在第二支撑构件（24）上。 因此，可以通过金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

公开(公告)号：US06889428B2

公开(公告)日：2005-05-10

申请号：US10617339

申请日：2003-07-10

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Takeshi Nakamura ,  Yoshiyuki Kobayashi

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Takeshi Nakamura ,  Yoshiyuki Kobayashi

IPC分类号： C25D5/02 ,  C25D7/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/04 ,  H01L25/18 ,  H05K3/30

CPC分类号： H01L21/4832 ,  C25D5/026 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/97 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/3754 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/84 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.

摘要翻译： 本发明是在导电箔上形成大面积精密电镀膜，简化了镀膜的形成工序。 在导电箔的表面上形成由热固性树脂构成的树脂膜。 通过激光蚀刻消除了成为接合焊盘和管芯焊盘的部件的树脂膜。 块体的周边的夹持器压制以在块上形成密封的空间。 夹持器的内部通过注射装置和排气装置填充电镀液，随后通过电镀法形成Ag镀膜。

公开(公告)号：US06730933B1

公开(公告)日：2004-05-04

申请号：US09536898

申请日：2000-03-28

申请人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

发明人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

IPC分类号： H01L2715

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency, reduction of the size and weight, and prevention of temporal changes are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. A transparent substrate 50 is bonded via a seal 51, and temporal changes of a light emitting element 10 and electrodes which are sealed therein are suppressed.

摘要翻译： 在其中将发光元件附着在印刷电路板上的光照射装置中，提高了散热性能，并且实现了发光效率的提高，尺寸和重量的减小以及防止时间变化。 在金属基板11上形成被Ni覆盖的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。透明基板50通过密封件51接合，发光元件10的时间变化和密封在其中的电极被抑制 。

公开(公告)号：US06548832B1

公开(公告)日：2003-04-15

申请号：US09536921

申请日：2000-03-28

申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

IPC分类号： H01L3300

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark 53 and a flow stop 57 are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。当在混合集成电路基板的一个区域中配置电路时，将位置识别标记53和流动停止器57设置在 开放区域。 此外，该区域被Ni覆盖，以起到反射装置的作用。