公开(公告)号：US20180043478A1

公开(公告)日：2018-02-15

申请号：US15792392

申请日：2017-10-24

申请人： International Business Machines Corporation

发明人： Victor Alvarez ,  Pierre Y. Beaulieu ,  Kang-Wook Lee ,  Jae-Woong Nah ,  Lavanya Turlapati

IPC分类号： B23K35/36 ,  B23K1/00 ,  H01L23/00 ,  B23K35/362 ,  H01L21/56

CPC分类号： B23K35/3612 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K35/362 ,  H01L21/563 ,  H01L23/293 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/06 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107

摘要： A flux formulation includes an activator and a protic solvent. The activator may be glutaric acid, levulinic acid, 2-ketobutyric acid, 2-oxovaleric acid, or mixtures thereof. Suitable protic solvents include alkanediol, alkoxy propanol and alkoxy ethanol. The flux formulation may be a no-clean flux formulation that may be used in the soldering of electronic circuit board assemblies, for example, in conjunction with a support fixture having a planar back surface that minimizes vibrations during processing that might otherwise cause misalignment between a chip and a substrate prior to solder reflow.

公开(公告)号：US20180005975A1

公开(公告)日：2018-01-04

申请号：US15705311

申请日：2017-09-15

申请人： International Business Machines Corporation

发明人： Charles C. Bureau ,  Eric Duchesne ,  Kang-Wook Lee ,  Isabelle Paquin ,  Dragoljub Veljanovic

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  C21D9/50 ,  C23G1/00 ,  C23G5/00 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/81911 ,  H01L2224/81948 ,  H01L2924/014 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/00014

摘要： An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

公开(公告)号：US20170352641A1

公开(公告)日：2017-12-07

申请号：US15173816

申请日：2016-06-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Ling HWANG ,  Hsin-Hung LIAO ,  Yu-Ting CHIU ,  Ching-Hua HSIEH

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13017 ,  H01L2224/751 ,  H01L2224/75753 ,  H01L2224/80127 ,  H01L2224/80136 ,  H01L2224/81024 ,  H01L2224/81201 ,  H01L2224/81345 ,  H01L2924/00012

摘要： A method for mounting components on a substrate is provided. The method includes providing a positioning plate which has a plurality of through holes. The method further includes supplying components each having a longitudinal portion on the positioning plate. The method also includes performing a component alignment process to put the longitudinal portions of the components in the through holes. In addition, the method includes connecting a substrate to the components which have their longitudinal portions in the through holes and removing the positioning plate.

公开(公告)号：US09786621B2

公开(公告)日：2017-10-10

申请号：US14877525

申请日：2015-10-07

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chita Chuang ,  Chen-Shien Chen ,  Ming Hung Tseng ,  Yao-Chun Chuang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L24/13 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81424 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2924/00012 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/01047

摘要： A package structure includes a chip attached to a substrate. The chip includes a bump structure including a conductive pillar having a length (L) measured along a long axis of the conductive pillar and a width (W) measured along a short axis of the conductive pillar. The substrate includes a pad region and a mask layer overlying the pad region, wherein the mask layer has an opening exposing a portion of the pad region. The chip is attached to the substrate to form an interconnection between the conductive pillar and the pad region. The opening has a first dimension (d1) measured along the long axis and a second dimension (d2) measured along the short axis. In an embodiment, L is greater than d1, and W is less than d2.

公开(公告)号：US20170243852A1

公开(公告)日：2017-08-24

申请号：US15052461

申请日：2016-02-24

申请人： International Business Machines Corporation

发明人： Charles C. Bureau ,  Eric Duchesne ,  Kang-Wook Lee ,  Isabelle Paquin ,  Dragoljub Veljanovic

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/36 ,  B23K2101/42 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/81911 ,  H01L2224/81948 ,  H01L2924/014 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/00014

摘要： An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

公开(公告)号：US20170179070A1

公开(公告)日：2017-06-22

申请号：US14974823

申请日：2015-12-18

申请人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

发明人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/75981 ,  H01L2224/81013 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00015 ,  H01L2924/01001 ,  H01L2924/01002 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01036 ,  H01L2924/01054 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2924/014

摘要： Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

公开(公告)号：US20170179069A1

公开(公告)日：2017-06-22

申请号：US14974807

申请日：2015-12-18

申请人： Jonathon R. Carstens ,  Michael S. Brazel ,  Russell S. Aoki ,  Laura S. Mortimer

发明人： Jonathon R. Carstens ,  Michael S. Brazel ,  Russell S. Aoki ,  Laura S. Mortimer

IPC分类号： H01L23/00 ,  B23K3/06 ,  B23K1/00 ,  B23K3/08 ,  H01L23/498 ,  H01L23/34

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K3/06 ,  B23K3/0638 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/345 ,  H01L23/49816 ,  H01L24/75 ,  H01L2224/81007 ,  H01L2224/81024 ,  H01L2224/81035 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/15321 ,  H05K3/1225 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2203/166

摘要： Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.

公开(公告)号：US09673158B2

公开(公告)日：2017-06-06

申请号：US14630265

申请日：2015-02-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Chien-Hsun Lee

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

CPC分类号： H01L24/11 ,  H01L21/561 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3192 ,  H01L24/13 ,  H01L24/16 ,  H01L24/18 ,  H01L24/81 ,  H01L2224/02379 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/11515 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/05552 ,  H01L2224/64

摘要： A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

公开(公告)号：US20170125359A1

公开(公告)日：2017-05-04

申请号：US15299339

申请日：2016-10-20

申请人： FUJITSU LIMITED

发明人： Taiji Sakai ,  Seiki Sakuyama ,  Nobuhiro Imaizumi ,  Aki Dote

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/4012 ,  H01L23/538 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/98 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/0756 ,  H01L25/117 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17134 ,  H01L2224/17177 ,  H01L2224/17505 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81065 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/00 ,  H01L2021/60022 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.

公开(公告)号：US09640508B2

公开(公告)日：2017-05-02

申请号：US14885356

申请日：2015-10-16

申请人： FUJITSU LIMITED

发明人： Taiki Uemura ,  Kozo Shimizu ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  B23K35/26 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  B23K35/26 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16507 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75702 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81098 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/8191 ,  H01L2224/81948 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/0133 ,  H01L2924/20104 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10674 ,  H05K2203/047 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/00012

摘要： An electrical apparatus includes a first electrical component; a second electrical component; and an In—Sn—Ag alloy connecting the first electrical component and the second electrical component, the In—Sn—Ag alloy containing AgIn2 and Ag2In, a Ag2In content being lower than a AgIn2 content.