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    APPARATUS AND PROCESS FOR PRODUCING PLANO-CONVEX SILICONE-ON-GLASS LENS ARRAYS
    21.
    发明申请
    APPARATUS AND PROCESS FOR PRODUCING PLANO-CONVEX SILICONE-ON-GLASS LENS ARRAYS 审中-公开
    用于生产平面玻璃硅玻璃透镜阵列的装置和工艺

    公开(公告)号：US20130182333A1

    公开(公告)日：2013-07-18

    申请号：US13812100

    申请日：2011-07-21

    申请人： Matthew Meitl ,  Rudolph Bukovnik ,  Etienne Menard ,  Wolfgang Wagner ,  David Kneeburg ,  Jimmy Mark

    发明人： Matthew Meitl ,  Rudolph Bukovnik ,  Etienne Menard ,  Wolfgang Wagner ,  David Kneeburg ,  Jimmy Mark

    IPC分类号： G02B3/00

    CPC分类号： G02B3/0031 ,  B29C33/3842 ,  B29C33/58 ,  B29C33/62 ,  G02B3/0025 ,  G02B3/0056

    摘要： Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.

    摘要翻译： 用可流动的可硬化聚合物涂层涂覆加工的模具产生光学光滑的表面，并保持向上指向特征的清晰度。 这些程序以快速和便宜的方式为高效平凸硅硅玻璃透镜阵列生产模具，其中端铣刀限定透镜的形状，并且涂层产生其平滑度。 端铣加工和具有可移动销的板中的透镜形状特征在具有布置在特征内的弹出特征的模具中，其形成用于透镜元件的模板，而不显着降低光学性能。 此外，具有可移动嵌件的机械加工和涂布板可以产生具有减小体积的透镜阵列的模具和每个透镜元件中的一个或几个环。

    Printable, flexible and stretchable diamond for thermal management
    22.
    发明授权
    Printable, flexible and stretchable diamond for thermal management 有权
    可打印，灵活和可拉伸的金刚石进行热管理

    公开(公告)号：US08470701B2

    公开(公告)日：2013-06-25

    申请号：US12418071

    申请日：2009-04-03

    申请人： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

    发明人： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

    IPC分类号： H01L21/20

    CPC分类号： H01L21/20 ,  B81B7/0093 ,  B81C1/0038 ,  B81C2201/0191 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

    摘要翻译： 公开了各种散热部件和制造散热部件的方法，其中与一个或多个发热部件热接触的金刚石能够散热，从而提供热调节部件。 导热金刚石以能够提供有效和最大的热传递的图案提供，远离可能易受高温损坏的部件。 这些器件和方法用于冷却易于产生显着热量的柔性电子器件，集成电路和其他复杂电子器件。 还提供了制造可在一系列装置和装置部件中使用的可印刷金刚石图案的方法。

    Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
    27.
    发明申请
    Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby 有权
    形成可印刷的集成电路器件和器件的方法

    公开(公告)号：US20100248484A1

    公开(公告)日：2010-09-30

    申请号：US12732868

    申请日：2010-03-26

    申请人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    发明人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    IPC分类号： H01L21/302

    CPC分类号： H01L27/1266 ,  H01L21/3065 ,  H01L21/32055 ,  H01L21/76834 ,  H01L21/76877 ,  H01L21/84 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1248 ,  H01L29/78666

    摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.

    摘要翻译： 形成集成电路器件的方法包括在处理衬底上形成牺牲层并在牺牲层上形成半导体活性层。 执行步骤以依次选择性地蚀刻半导体有源层和牺牲层以限定绝缘体上半导体（SOI）衬底，其包括半导体有源层的第一部分。 可以在SOI衬底上形成多层电互连网络。 该多层电互连网络可以由与半导体有源层的第一部分的上表面接触的无机覆盖层封装。 可以执行步骤以选择性地蚀刻通过覆盖层和半导体有源层的第一部分，从而暴露牺牲层。 可以从半导体有源层的第一部分和处理衬底之间选择性地去除牺牲层，从而限定由封盖层封装的悬浮集成电路芯片。

    STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS
    30.
    发明申请
    STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS 有权
    用于测试可打印集成电路的结构和方法

    公开(公告)号：US20130221355A1

    公开(公告)日：2013-08-29

    申请号：US13818901

    申请日：2011-08-24

    申请人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    发明人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    IPC分类号： H01L21/66 ,  G01R31/26 ,  H01L21/308

    CPC分类号： H01L33/62 ,  G01R31/26 ,  G01R31/2644 ,  H01L21/308 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/30 ,  H01L22/32 ,  H01L25/0753 ,  H01L33/16 ,  H01L33/30 ,  H01L33/34 ,  H01L33/48 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.

    摘要翻译： 衬底包括物理地固定到衬底（10）的表面上的锚定区域（30）和至少一个可印刷的电子部件（20）。 所述至少一个可印刷电子部件包括其上具有一个或多个有源元件的有源层（14），并且通过导电可破坏的系绳（40）悬挂在基板的表面上。 导电可破裂系绳包括绝缘层和导电层，其物理地固定和电连接至少一个可印刷的电子部件到锚定区域，并且被配置为响应于施加到其上的压力而优先断裂。 还讨论了相关的制造和测试方法。