Bioresorbable silicon electronics for transient implants

    公开(公告)号:US10925543B2

    公开(公告)日:2021-02-23

    申请号:US15349525

    申请日:2016-11-11

    摘要: Provided are implantable and bioresorbable medical devices comprising a bioresorbable substrate and an electronic circuit supported by the bioresorbable substrate. The electronic circuit comprises a membrane of silicon having a thickness less than or equal to 5 μm and an array of dissolvable electrodes, wherein the dissolvable electrodes are formed from the membrane of silicon. The electronic circuit is configured to conformally contact a biological tissue and electrically interface with biological tissue during use. The silicon may be highly doped to provide the requisite characteristics for electrically interfacing with biological tissue, and may be further used to form other components of the electronic circuit, including back-plane transistors electrically connected to the electrode array.