公开(公告)号：US5673479A

公开(公告)日：1997-10-07

申请号：US323817

申请日：1994-10-17

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H05K3/34

CPC classification number: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49572 ,  H01L25/105 ,  H01L25/117 ,  H05K3/303 ,  H05K7/1061 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/1094 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10681 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

公开(公告)号：US5668702A

公开(公告)日：1997-09-16

申请号：US643377

申请日：1996-05-06

Applicant: Shary Nassimi

Inventor： Shary Nassimi

IPC: H01C1/02 ,  H01L23/04 ,  H05K3/34 ,  H05K7/00 ,  H01L23/053 ,  H01L23/055 ,  H05K7/02

CPC classification number: H01L23/041 ,  H01C1/02 ,  H05K3/341 ,  H05K3/3415 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613

Abstract: A combination axial and surface mounted cylindrically-shaped package containing at least one electronic component and being surface mountable to a printed circuit board with electrical lands by the use of conventional axial component through hole mounting machinery that includes a hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, at least one electronic component that is contained in the hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, a pair of electrically-conductive axial leads that are in electrical communication with the at least one electronic component, and at least one circumferentially-disposed, laterally-oriented, and electrically-conductive ring also in electrical communication with the at least one electronic component.

Abstract translation: 一种组合的轴向和表面安装的圆柱形包装，其包含至少一个电子部件，并且通过使用常规的轴向部件通孔安装机构可表面安装到具有电焊盘的印刷电路板，该机械包括中空的，电绝缘的，并且通常 圆形圆柱形壳体，至少一个电子部件，其容纳在中空的，电绝缘的和大致圆柱形的壳体中，一对导电轴向引线，其与至少一个 电子部件和至少一个周向布置的，横向定向的和导电的环，其还与所述至少一个电子部件电连通。

公开(公告)号：US5574310A

公开(公告)日：1996-11-12

申请号：US485117

申请日：1995-06-07

Applicant: Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

Inventor： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC: H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC classification number: H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract translation: 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US5157480A

公开(公告)日：1992-10-20

申请号：US651166

申请日：1991-02-06

Applicant: Michael B. McShane ,  Paul T. Lin

Inventor： Michael B. McShane ,  Paul T. Lin

IPC: H01L23/495 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49555 ,  H01L23/49517 ,  H01L23/49551 ,  H05K3/341 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K2201/09054 ,  H05K2201/09954 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact portion which are separated by an intermediate portion. A package body encapsulates the semiconductor device die and intermediate portions of the plurality of leads. The first contact portions of the leads are partially exposed on the bottom surface of the package body. The second contact portions extend from the package body along a portion of the package body perimeter. The first contact portions provide bottom-side contacts to the device, while the second contact portions provide peripheral contacts. The second contact portions are shaped into a desired lead configuration or are severed to establish a leadless device.

Abstract translation: 具有两个底侧触点和外围触点的半导体器件提供表面安装选项。 在一种形式中，半导体器件裸片位于引线框的管芯接收区域。 引线框架还具有多个引线，每个引线具有由中间部分分开的第一和第二接触部分。 封装体封装半导体器件裸片和多个引线的中间部分。 引线的第一接触部分部分地暴露在封装主体的底表面上。 第二接触部分沿着包装体周边的一部分从包装体延伸。 第一接触部分向器件提供底侧触点，而第二接触部分提供周边接触。 第二接触部分被成形为所需的引线结构或被切断以建立无引线器件。

公开(公告)号：US5148349A

公开(公告)日：1992-09-15

申请号：US637557

申请日：1991-01-04

Applicant: Hiroshi Kogure ,  Hidehiko Norimatsu

Inventor： Hiroshi Kogure ,  Hidehiko Norimatsu

IPC: H05K3/34

CPC classification number: H05K3/341 ,  H05K3/3426 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

Abstract: A structure of an electronic part which may be mounted on and soldered to the surface of a printed circuit board, and a method of mounting such an electronic part. While the electronic part mounted on the circuit board is operation, heat generated by the part is efficiently radiated to the ambience. Connecting terminals extending out from the electronic part are firmly soldered to the circuit board by a minimum of heat, whereby the bonding strength and the strength against shocks are enhanced. The electronic part of interest and other electronic parts neighboring it are free from damage ascriable to heat when the former has connecting terminals thereof soldered to the circuit board. When the connecting terminals of the electronic part are soldered to the circuit board by a laser beam. Other electronic parts mounted on the circuit board are prevented from being damaged by the laser beam.

公开(公告)号：US4530002A

公开(公告)日：1985-07-16

申请号：US391161

申请日：1982-06-22

Applicant: Yasunori Kanai

Inventor： Yasunori Kanai

IPC: H05K1/18 ,  H01L23/055 ,  H01L23/057 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H05K3/34 ,  H01L23/48

CPC classification number: H05K3/3415 ,  H01L23/055 ,  H01L23/057 ,  H01L23/49827 ,  H01L23/5383 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K3/3421 ,  H05K3/3447 ,  Y02P70/613

Abstract: A semiconductor device having improved construction of connection leads extending from the chip carrier housing for connecting a semiconductor chip in the housing with the external circuitry. The connection leads are arranged in the form of a plurality of concentric arrays. The leads in the outermost array are composed of surface connection leads to be electrically connected to the uppermost layer of a multilayer printed board to which the semiconductor device will be mounted, and the leads in the inner array or arrays are composed of lead pins to be inserted into and be electrically connected to the through holes of the multilayer printed board.

Abstract translation: 一种半导体器件，其具有从芯片载体壳体延伸的连接引线的改进结构，用于将壳体中的半导体芯片与外部电路连接。 连接引线以多个同心圆盘的形式布置。 最外面阵列中的引线由表面连接引线组成，电连接到多层印刷电路板的最上层，半导体器件将被安装到其上，内部阵列或阵列中的引线由引脚引脚组成 插入并电连接到多层印刷电路板的通孔。

公开(公告)号：US12080634B2

公开(公告)日：2024-09-03

申请号：US17756556

申请日：2020-11-25

Applicant: THE NOCO COMPANY

Inventor： James P. McBride ,  James Richard Stanfield

IPC: H05K1/18 ,  H01L23/495 ,  H01M10/42 ,  H01M50/519 ,  H05K1/14 ,  H05K3/34 ,  H01L25/11

CPC classification number: H01L23/49555 ,  H01L23/49562 ,  H01M10/4257 ,  H01M50/519 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3426 ,  H01L25/115 ,  H01M2010/4271 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2203/049

Abstract: Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

公开(公告)号：US20240147619A1

公开(公告)日：2024-05-02

申请号：US18406734

申请日：2024-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwan SHIM ,  Bumhee BAE ,  Younho KIM ,  Jeongnam CHEON

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3457 ,  H05K2201/0154 ,  H05K2201/0314 ,  H05K2201/10318 ,  H05K2201/10659 ,  H05K2203/041

Abstract: A substrate structure is provided. The substrate structure includes a first substrate, a plurality of first elastomer pins arranged on the first substrate, an elastic body disposed on the first substrate to surround the plurality of first elastomer pins, the elastic body including a plurality of spaces for receiving a plurality of solder balls on a second substrate connected to the first substrate, and a plurality of solder ball holders arranged on a boundary area of an opening of each of the plurality of spaces, wherein each of the plurality of solder ball holders has strength higher than that of the elastic body, and wherein each of the plurality of solder ball holders includes a plurality of pieces.

公开(公告)号：US20170330827A1

公开(公告)日：2017-11-16

申请号：US15376458

申请日：2016-12-12

Applicant: Digi International Inc.

Inventor： Mike Oliver Rohrmoser ,  Sebastien Joseph Xavier Meyer

IPC: H01L23/498 ,  H05K1/02 ,  H01L23/552 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/5386 ,  H01L23/552 ,  H05K1/0287 ,  H05K1/111 ,  H05K1/117 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10159 ,  H05K2201/10659 ,  H05K2201/10719

Abstract: A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at least one electronic component. A plurality of castellated edge pads are mounted around the outer periphery of the substrate, with at least some of the castellated edge pads coupled to the at least one electronic component. At least some of the land grid array pads are mapped to at least some of the castellated edge pads.

公开(公告)号：US20120155044A1

公开(公告)日：2012-06-21

申请号：US12971862

申请日：2010-12-17

Applicant: David Mulford Shaddock ,  Vinayak Tilak ,  Tan Zhang

Inventor： David Mulford Shaddock ,  Vinayak Tilak ,  Tan Zhang

IPC: H05K7/00 ,  H05K3/10

CPC classification number: H05K3/328 ,  H05K3/4629 ,  H05K2201/10151 ,  H05K2201/10659 ,  H05K2201/10674 ,  Y10T29/49155

Abstract: An apparatus includes a set of first metal contact pads disposed on a low temperature co-fired ceramic substrate. A plurality of metalized interconnectors extend between a digital electronic component and the low temperature co-fired ceramic substrate. The apparatus is configured to operate at a temperature greater than 250 degrees Celsius.

Abstract translation: 一种装置包括设置在低温共烧陶瓷基板上的一组第一金属接触焊盘。 多个金属化互连器在数字电子部件和低温共烧陶瓷基板之间延伸。 该装置被配置为在大于250摄氏度的温度下操作。