公开(公告)号：US09538665B2

公开(公告)日：2017-01-03

申请号：US14350971

申请日：2012-10-10

Applicant: ENTHONE INC.

Inventor： Edwin W. Bastenbeck ,  Harald Orschel ,  Ulrich Prinz

IPC: B05D5/12 ,  H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  B05D3/00

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。 通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

公开(公告)号：US09530534B2

公开(公告)日：2016-12-27

申请号：US14823001

申请日：2015-08-11

Applicant: C3Nano Inc.

Inventor： Yongxing Hu ,  Xiqiang Yang ,  Ying-Syi Li ,  Alexander Seung-Il Hong ,  Melanie Mariko Inouye ,  Yadong Cao ,  Ajay Virkar

IPC: B32B15/04 ,  B32B15/08 ,  H05K3/10 ,  H05K1/09 ,  C09D11/52 ,  H01B1/22 ,  C23C18/42 ,  C23C18/16 ,  H05K1/02 ,  H05K3/12 ,  C09D101/02 ,  C09D139/06 ,  B82Y30/00 ,  H01B13/30

CPC classification number: C23C18/44 ,  B32B9/045 ,  B32B15/018 ,  B32B15/04 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/103 ,  B32B2262/12 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2457/20 ,  B82Y20/00 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D105/08 ,  C09D133/06 ,  C09D139/06 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/42 ,  C23C18/54 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/097 ,  H05K3/10 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  Y10T428/12444 ,  Y10T428/12479 ,  Y10T428/12486 ,  Y10T428/12889 ,  Y10T428/12896

Abstract: Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

Abstract translation: 描述了具有均匀的贵金属涂层的金属纳米线。 公开了两种方法，电镀交换和直接沉积，以成功形成均匀的贵金属涂层。 电化学交换反应和直接沉积方法均受益于包含适当强结合配体以控制或介导涂覆方法以提供均匀涂层的形成。 贵金属涂覆的纳米线对于生产稳定的透明导电膜是有效的，其可以包括熔融金属纳米结构网络。

公开(公告)号：US20160372228A1

公开(公告)日：2016-12-22

申请号：US14745004

申请日：2015-06-19

Applicant: Hamilton Sundstrand Corporation

Inventor： Ying She ,  Sameh Dardona ,  Wayde R. Schmidt

IPC: H01B1/04 ,  C23C18/38 ,  C23C18/42 ,  C23C18/18

CPC classification number: H01B1/04 ,  C23C18/1635 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/1889 ,  C23C18/1893 ,  C23C18/38 ,  C23C18/42

Abstract: A method of making a composite material includes disposing a carbon-based particulate material, such as graphene or carbon nanotubes, in an activation solution and activating surfaces of the carbon-based particulate material using the activation solution. Once the surfaces of the carbon-based particulate material have been activated a metallic coating is applied to the activated surfaces to form a composite material. The composite material is then recovered as a particulate material formed having carbon-based particulate material with a metallic coating that is suitable for fusing together for forming electrical conductors, such as with an additive manufacturing technique.

Abstract translation: 制造复合材料的方法包括在活化溶液中设置碳基颗粒材料，例如石墨烯或碳纳米管，并使用活化溶液活化碳基颗粒材料的表面。 一旦已经激活了碳基颗粒材料的表面，就将金属涂层施加到活化表面上以形成复合材料。 然后将复合材料作为形成的具有碳基颗粒材料的颗粒材料回收，所述颗粒材料具有适合于熔合在一起以形成电导体的金属涂层，例如用添加剂制造技术。

公开(公告)号：US20160369405A1

公开(公告)日：2016-12-22

申请号：US14899099

申请日：2014-06-18

Applicant: NEXEON LIMITED

Inventor： David William Bent

IPC: C23C18/42 ,  C23C18/16

CPC classification number: C23C18/42 ,  B01J2/006 ,  C23C18/08 ,  C23C18/1619 ,  C23C18/1635 ,  C23C18/1639 ,  C23C18/1676 ,  C23C18/168 ,  C23C18/1689 ,  C23C18/54

Abstract: The present invention relates to a method of forming a metal coated particle, to metal coated particles prepared according to the method and the use of these metal coated particles. The method comprising the steps of:providing a source of base particles to be coated; providing a source of a metal-comprising coating particles; and feeding the base particles specified in step (a) and the source of metal comprising coating particles specified in step (b) into a continuous reactor including heat exchange means to cause contact of the base particles with the source of coating particles thereby to form the metal coated particles. The coated particles include a homogeneous coating and can be used in a variety of applications.

Abstract translation: 形成金属涂覆颗粒的方法包括以下步骤：提供待涂覆的基础颗粒源; 提供含金属的涂层颗粒的来源; 并将步骤（a）中规定的基础颗粒和包含步骤（b）中规定的涂布颗粒的金属源进料到包括热交换装置的连续反应器中，以使基础颗粒与涂层颗粒的源接触，从而形成 金属涂层颗粒。 基础颗粒可以选自硅，锗，锡，铝，镓，锌等，并且金属包覆颗粒的来源可以选自银，铜，铂，铁，钴，铑，钒，镍，钌， 铱和金。 涂覆的颗粒包括均匀的涂层并且可以用于各种应用中。 还示出了覆膜颗粒和用于执行该方法的装置。

公开(公告)号：US20160359173A1

公开(公告)日：2016-12-08

申请号：US15117314

申请日：2014-12-22

Applicant: Toyota Jidosha Kabushiki Kaisha

Inventor： Keiichi KANEKO ,  Hiroko KIMURA ,  Makoto ADACHI

IPC: H01M4/92 ,  C25D3/38 ,  C25D5/48 ,  C23C28/02 ,  C23C18/42 ,  C23C18/18 ,  C23C18/16 ,  H01M4/88 ,  C25D7/00

CPC classification number: H01M4/925 ,  B22F1/025 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1648 ,  C23C18/168 ,  C23C18/1689 ,  C23C18/1848 ,  C23C18/42 ,  C23C18/54 ,  C23C28/023 ,  C25D3/38 ,  C25D5/34 ,  C25D5/48 ,  C25D7/00 ,  C25D7/006 ,  H01M4/8657 ,  H01M4/8825 ,  H01M4/8832 ,  H01M4/8853 ,  H01M4/8878 ,  H01M4/921

Abstract: The present invention is to provide a method for producing core-shell catalyst particles with high catalytic activity per unit mass of platinum. Disclosed is a method for producing core-shell catalyst particles including a core containing palladium and a shell containing platinum and covering the shell, wherein the method includes: a step of depositing copper on the surface of the palladium-containing particles by applying a potential that is nobler than the oxidation-reduction potential of copper to the palladium-containing particles in a copper ion-containing electrolyte, and a step of forming the shell by, after the copper deposition step and inside the reaction system kept at −3° C. or more and 10° C. or less, substituting the copper deposited on the surface of the palladium-containing particles with platinum by bringing the copper into contact with a platinum ion-containing solution in which platinum ions and a reaction inhibitor that inhibits a substitution reaction between the copper and the platinum, are contained.

Abstract translation: 本发明提供一种生产具有高铂催化活性的核 - 壳催化剂颗粒的方法。 公开了一种生产核 - 壳催化剂颗粒的方法，其包括含有钯和包含铂并包覆壳的壳的芯，其中所述方法包括：通过施加以下方法的一个步骤：在含钯颗粒的表面上沉积铜 比铜对含铜离子的电解质中的含钯颗粒的氧化还原电位更高，并且在铜沉积步骤之后并且在反应体系内部保持在-3℃下形成壳的步骤。 以上且10℃以下，通过使铜与含铂离子和抑制取代的反应抑制剂的含铂离子溶液接触，用铂代替沉积在含钯粒子表面的铜 包含铜和铂之间的反应。

公开(公告)号：US09511582B2

公开(公告)日：2016-12-06

申请号：US14418184

申请日：2013-03-12

Applicant: Eastman Kodak Company

Inventor： Danliang Jin ,  Ed S. Ramakrishnan

IPC: B41F5/24 ,  H05K3/18 ,  C09D11/101 ,  C09D11/52 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/52

CPC classification number: B41F5/24 ,  C09D11/101 ,  C09D11/52 ,  C23C18/1608 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/52 ,  G06F2203/04103 ,  H05K3/182 ,  H05K2203/0709 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: Systems and methods disclosed herein are directed towards flexographic printing of microscopic high resolution conductive patterns (HRCP). These HRCP may be printed using one or more formulations for high polarity and stable viscosity inks for use in the flexographic printing process. The inks may be water permeable, UV curable, and configured to resist loss of integrity when exposed to water and atmospheric moisture.

Abstract translation: 本文公开的系统和方法针对微观高分辨率导电图案（HRCP）的柔性版印刷。 这些HRCP可以使用一种或多种用于柔性版印刷工艺的高极性和稳定粘度油墨的配方印刷。 油墨可以是透水的，UV可固化的，并且被配置为当暴露于水和大气湿气时抵抗完整性的损失。

公开(公告)号：US20160343463A1

公开(公告)日：2016-11-24

申请号：US15162471

申请日：2016-05-23

Applicant: LSIS CO., LTD. ,  Research & Business Foundation SungKyunKwan University

Inventor： Wookdong Cho ,  Chuldong Moon ,  Hyeonjeong Choi ,  Wonyoung Kim ,  Seunghyun Baik ,  Dongmok Lee ,  Jeonghyun Sim

IPC: H01B1/02 ,  C23C18/18 ,  C23C18/16 ,  C23C18/42

CPC classification number: H01B1/02 ,  B22F2998/10 ,  B22F2999/00 ,  B82Y25/00 ,  B82Y40/00 ,  C22C1/0425 ,  C22C1/0433 ,  C22C1/0466 ,  C22C5/06 ,  C22C47/04 ,  C22C47/14 ,  C22C49/02 ,  C22C49/14 ,  C23C18/1635 ,  C23C18/1658 ,  C23C18/1689 ,  C23C18/1692 ,  C23C18/1851 ,  C23C18/1893 ,  C23C18/42 ,  C23C18/44 ,  H01B1/04 ,  H01H1/023 ,  H01H1/027 ,  H01H2300/036 ,  Y10S977/742 ,  Y10S977/847 ,  Y10S977/932 ,  B22F9/24 ,  C22C1/05 ,  B22F3/10

Abstract: In some embodiments, the effect of uniformly dispersing carbon nanotubes in the material is achieved by including Ag in the carbon nanotubes to suppress the aggregation of carbon nanotubes when the electrical contacts are prepared.

Abstract translation: 在一些实施方案中，通过在碳纳米管中包含Ag以在制备电接触时抑制碳纳米管的聚集来实现在材料中均匀分散碳纳米管的效果。

公开(公告)号：US09469773B2

公开(公告)日：2016-10-18

申请号：US14368202

申请日：2012-12-20

Applicant: The Board of Trustees of the University of Illinois

Inventor： Steven B. Walker ,  Jennifer A. Lewis

IPC: C09D11/52 ,  C23C18/42 ,  B05D1/04 ,  B05D1/18 ,  B05D1/00 ,  C23C18/16 ,  C23C26/02

CPC classification number: C09D11/52 ,  B05D1/005 ,  B05D1/04 ,  B05D1/18 ,  C23C18/168 ,  C23C18/42 ,  C23C26/02

Abstract: An ink composition for making a conductive silver structure comprises a silver salt and a complex of (a) a complexing agent and a short chain carboxylic acid or (b) a complexing agent and a salt of a short chain carboxylic acid, according to one embodiment. A method for making a silver structure entails combining a silver salt and a complexing agent, and then adding a short chain carboxylic acid or a salt of the short chain carboxylic acid to the combined silver salt and a complexing agent to form an ink composition. A concentration of the complexing agent in the ink composition is reduced to form a concentrated formulation, and the silver salt is reduced to form a conductive silver structure, where the concentrated formulation and the conductive silver structure are formed at a temperature of about 120° C. or less.

Abstract translation: 根据一个实施方案，用于制造导电银结构的油墨组合物包含银盐和（a）络合剂和短链羧酸或（b）络合剂和短链羧酸的盐的络合物 。 制造银结构的方法需要组合银盐和络合剂，然后将短链羧酸或短链羧酸的盐加入到组合的银盐和络合剂中以形成油墨组合物。 减少墨水组合物中络合剂的浓度以形成浓缩的配方，并且将银盐还原形成导电银结构，其中浓缩配方和导电银结构在约120℃的温度下形成 。 或更少。

公开(公告)号：US09388497B2

公开(公告)日：2016-07-12

申请号：US14414655

申请日：2013-07-11

Applicant: TOYO KOHAN CO., LTD.

Inventor： Nobuaki Mukai

IPC: C23C18/16 ,  C23C18/42 ,  C23C28/02 ,  B32B15/01 ,  C23C18/50 ,  C22C19/00 ,  C23C18/44 ,  C23C18/36 ,  H01M8/02

CPC classification number: C23C18/1831 ,  B32B15/01 ,  B32B15/017 ,  B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C19/00 ,  C22C21/06 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  C23C18/40 ,  C23C18/42 ,  C23C18/44 ,  C23C18/48 ,  C23C18/50 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C28/021 ,  C23C30/00 ,  C23C30/005 ,  H01M8/0228 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12924 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12972 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

Abstract: There is provided a method of electroless gold plating, wherein the method includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the method is characterized in that the underlying alloy layer is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

Abstract translation: 提供了一种无电镀金的方法，其中所述方法包括在基材上形成下面的合金层的步骤，以及通过使用氰化物的无电还原电镀直接在下面的合金层上形成金板层的步骤 其特征在于，下面的合金层由M1-M2-M3合金（其中M1是选自Ni，Fe，Co，Cu，Zn和Sn中的至少一种元素，M2，M2 是选自Pd，Re，Pt，Rh，Ag和Ru中的至少一种元素，M3是选自P和B中的至少一种元素）。

公开(公告)号：US09339588B2

公开(公告)日：2016-05-17

申请号：US14166217

申请日：2014-01-28

Applicant: Bactiguard AB

Inventor： Mattias Ohrlander ,  Billy Södervall

IPC: A01N59/16 ,  A61L2/238 ,  A61L27/30 ,  B32B5/16 ,  B32B27/00 ,  C23C18/18 ,  A61L27/50 ,  A61L29/10 ,  A61L31/08 ,  A61L33/00 ,  C23C18/16 ,  C23C18/42 ,  C23C18/44 ,  C23C26/00 ,  C23C30/00 ,  A01N25/08 ,  A61K9/00 ,  A61K33/24 ,  A61K33/38 ,  B32B5/30 ,  B32B9/00 ,  B32B15/16 ,  B32B27/14 ,  B32B27/16 ,  A61L26/00 ,  B05D3/02

CPC classification number: A61L31/088 ,  A01N25/08 ,  A01N59/16 ,  A61K9/00 ,  A61K33/24 ,  A61K33/38 ,  A61L2/238 ,  A61L26/0004 ,  A61L27/30 ,  A61L27/306 ,  A61L27/50 ,  A61L29/10 ,  A61L29/106 ,  A61L31/022 ,  A61L31/024 ,  A61L31/026 ,  A61L31/042 ,  A61L31/048 ,  A61L31/06 ,  A61L31/08 ,  A61L33/0076 ,  A61L2400/18 ,  A61L2420/02 ,  B05D3/0254 ,  B32B5/16 ,  B32B5/30 ,  B32B9/005 ,  B32B15/16 ,  B32B27/00 ,  B32B27/14 ,  B32B27/16 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2264/105 ,  B32B2307/7145 ,  B32B2307/73 ,  B32B2535/00 ,  C23C18/1635 ,  C23C18/1646 ,  C23C18/1689 ,  C23C18/18 ,  C23C18/42 ,  C23C18/44 ,  C23C26/00 ,  C23C30/00 ,  Y10T428/12569 ,  Y10T428/12875 ,  Y10T428/12896 ,  Y10T428/256 ,  Y10T428/27 ,  Y10T428/273 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/31667 ,  Y10T428/31678 ,  A01N25/10 ,  A01N25/34 ,  A01N2300/00

Abstract: A substrate has an electron donating surface, and metal particles on its surface, the metal particles including palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of the metal particles is from about 0.001 to about 8 μg/cm2. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels.

Abstract translation: 基材具有给电子表面，其表面上的金属颗粒，金属颗粒包括钯和选自金，钌，铑，锇，铱和铂中的至少一种金属，其中金属的量 颗粒为约0.001至约8μg/ cm 2。 涂覆物体的实例包括隐形眼镜，起搏器，起搏器电极，支架，牙植入物，破裂网，破裂网，血液离心机设备，手术器械，手套，血袋，人造心脏瓣膜，中心静脉导管，外周静脉导管，血管端口 ，血液透析设备，腹膜透析设备，血浆置换装置，吸入药物递送装置，血管移植物，动脉移植物，心脏辅助装置，伤口敷料，间歇导管，ECG电极，外周支架，骨置换植入物，整形外科植入物，整形外科装置，组织替代 植入物，眼内透镜，缝线，针，药物输送装置，气管内导管，分流器，排水管，抽吸装置，助听器装置，尿道医疗装置和人造血管。