公开(公告)号：US06825421B1

公开(公告)日：2004-11-30

申请号：US09380994

申请日：1999-09-13

Applicant: Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

IPC: H05K103

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

公开(公告)号：US06232558B1

公开(公告)日：2001-05-15

申请号：US09064770

申请日：1998-04-23

Applicant: Kiyotaka Tsukada ,  Hisashi Minoura ,  Koji Asano ,  Naoto Ishida ,  Morio Nakao

Inventor： Kiyotaka Tsukada ,  Hisashi Minoura ,  Koji Asano ,  Naoto Ishida ,  Morio Nakao

IPC: H05K100

CPC classification number: H05K3/308 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/4985 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2924/3511

Abstract: An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat main body and a projection portion extending vertically from a side face of the main body, and provided with a slit deforming portion absorbing deformation of the insulating substrate.

Abstract translation: 电子部件安装基板具有设置有导体电路的绝缘基板和电子部件的安装部，以及附着在绝缘基板上的散热片，其中，热芯由扁平主体和突出部延伸 从主体的侧面垂直地设置有吸收绝缘基板的变形的狭缝变形部。

公开(公告)号：US5914859A

公开(公告)日：1999-06-22

申请号：US837793

申请日：1997-04-22

Applicant: Masaru Takada ,  Kiyotaka Tsukada ,  Morio Nakao

Inventor： Masaru Takada ,  Kiyotaka Tsukada ,  Morio Nakao

IPC: H05K1/02 ,  H01L23/36 ,  H01L23/498 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/44 ,  H05K9/00 ,  H05K7/20

CPC classification number: H05K9/0039 ,  H01L23/36 ,  H01L23/49827 ,  H05K3/44 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K2201/066 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/386 ,  Y10T29/49128

Abstract: An electronic component mounting base board comprises an insulating substrate provided with a mounting portion for mounting an electronic component and a heat-sink plate disposed on an lower surface of the insulating substrate, in which the insulating substrate is provided with a wiring pattern for signal or power, a grounding pattern and a grounding hole, and the grounding hole is provided on its inner wall with a metal plated film for electrically connecting to the grounding pattern and a solder is filled in an inside of the grounding hole for electrically connecting to the heat-sink plate.

Abstract translation: 电子部件安装基板包括设置有用于安装电子部件的安装部分和设置在绝缘基板的下表面上的散热板的绝缘基板，其中绝缘基板设置有用于信号的布线图案或 电源，接地图案和接地孔，并且接地孔在其内壁上设置有用于电连接到接地图案的金属镀膜，并且焊料填充在接地孔的内部，用于电连接到热 贴板

公开(公告)号：US4540677A

公开(公告)日：1985-09-10

申请号：US656161

申请日：1984-09-27

Applicant: Ryo Enomoto ,  Kiyotaka Tsukada

Inventor： Ryo Enomoto ,  Kiyotaka Tsukada

IPC: C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634 ,  C04B35/00

CPC classification number: C04B35/63436 ,  C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634

Abstract: A powder composition for producing sintered ceramic, which composition contains fluororesin powder which has not been used in the prior art as one of the materials constituting a molding assistant to be blended in the composition. With this composition, it is possible to produce a high-density green molding with few molding defects under a relatively low molding pressure. The invention also provides a process for producing such a composition.

Abstract translation: 一种用于制造烧结陶瓷的粉末组合物，该组合物含有在现有技术中未使用的氟树脂粉末作为组合物中混合的成型助剂的材料之一。 通过该组合物，可以在相对较低的成型压力下生产具有少量成型缺陷的高密度绿色模制品。 本发明还提供了一种制备这种组合物的方法。

公开(公告)号：US4485182A

公开(公告)日：1984-11-27

申请号：US516760

申请日：1983-07-25

Applicant: Ryo Enomoto ,  Kiyotaka Tsukada

Inventor： Ryo Enomoto ,  Kiyotaka Tsukada

IPC: C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634 ,  C04B35/00

CPC classification number: C04B35/63436 ,  C04B35/111 ,  C04B35/565 ,  C04B35/584 ,  C04B35/634

Abstract: A powder composition for producing sintered ceramic, which composition contains fluororesin powder which has not been used in the prior art as one of the materials constituting a molding assistant to be blended in the composition. With this composition, it is possible to produce a high-density green molding with few molding defects under a relatively low molding pressure. The invention also provides a process for producing such a composition.

Abstract translation: 一种用于制造烧结陶瓷的粉末组合物，该组合物含有在现有技术中未使用的氟树脂粉末作为组合物中混合的成型助剂的材料之一。 通过该组合物，可以在相对较低的成型压力下生产具有少量成型缺陷的高密度绿色模制品。 本发明还提供了一种制备这种组合物的方法。

公开(公告)号：US08441806B2

公开(公告)日：2013-05-14

申请号：US12894968

申请日：2010-09-30

Applicant: Kiyotaka Tsukada ,  Tetsuya Muraki

Inventor： Kiyotaka Tsukada ,  Tetsuya Muraki

IPC: H01R9/00

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.

Abstract translation: 电路板包括用于电连接到半导体器件的第一电极的第一导电柱，连接到第一导电柱的第一金属板，用于电连接到半导体器件的第二电极的第二导电柱，第二金属 板，连接到第二导电柱，用于电连接到半导体器件的第三电极的第三导电柱，以及连接到第三导电柱的第三金属板。

公开(公告)号：US08415791B2

公开(公告)日：2013-04-09

申请号：US12952655

申请日：2010-11-23

Applicant: Kiyotaka Tsukada ,  Tetsuya Muraki ,  Atsunari Yamashita ,  Yoshitomo Tomida

Inventor： Kiyotaka Tsukada ,  Tetsuya Muraki ,  Atsunari Yamashita ,  Yoshitomo Tomida

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L24/01 ,  H01L2224/32225 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.

Abstract translation: 半导体器件包括：形成有孔的支撑板和形成在孔的壁表面上的导体;半导体元件; 以及由导体构成的导电柱，所述导体在一端具有第一端部，在另一端形成有第二端部。 导电柱的第二端部连接到半导体元件，并且导电柱的侧表面固定到孔的壁表面上的导体，孔的壁表面通过导电柱的压力在靠近第一侧的一侧的压力而变形 端部比第二端部。

公开(公告)号：US08278753B2

公开(公告)日：2012-10-02

申请号：US12952720

申请日：2010-11-23

Applicant: Kiyotaka Tsukada ,  Tetsuya Muraki ,  Atsunari Yamashita ,  Yoshitomo Tomida

Inventor： Kiyotaka Tsukada ,  Tetsuya Muraki ,  Atsunari Yamashita ,  Yoshitomo Tomida

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L23/36 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49844 ,  H01L23/49866 ,  H01L24/01 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.

Abstract translation: 半导体器件包括支撑板; 半导体元件 以及导体柱，其由在一端具有第一端并且在另一端具有第二端的导体构成，所述第二端连接到所述半导体元件，并且所述导体柱在所述半导体元件侧的位置处连接到所述支撑板 更靠近第一端的第二端，其中导体柱具有约200W / m·K以上的导热率和约70或更低的维氏硬度。

公开(公告)号：US20090285980A1

公开(公告)日：2009-11-19

申请号：US12494948

申请日：2009-06-30

Applicant: Tsutomu IWAI ,  Yoshihiro Kodera ,  Shinya Maeda ,  Hiroyuki Watanabe ,  Kazunari Suzuki ,  Kiyotaka Tsukada

Inventor： Tsutomu IWAI ,  Yoshihiro Kodera ,  Shinya Maeda ,  Hiroyuki Watanabe ,  Kazunari Suzuki ,  Kiyotaka Tsukada

IPC: B05D5/12

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/498 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/3463 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract translation: 在焊盘上形成由Ni层和Pd层构成的复合层，复合层上的焊料由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并进行缓冲，从而通过热应力降低对焊料凸块或焊料层的应力传递程度。

公开(公告)号：US07594320B2

公开(公告)日：2009-09-29

申请号：US11260077

申请日：2005-10-27

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: H01K3/10 ,  H05K3/10

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。