公开(公告)号：US08817487B2

公开(公告)日：2014-08-26

申请号：US13255945

申请日：2010-03-24

Applicant: Koji Motomura ,  Hideki Eifuku ,  Tadahiko Sakai

Inventor： Koji Motomura ,  Hideki Eifuku ,  Tadahiko Sakai

IPC: H05K7/02

CPC classification number: H05K3/363 ,  B23K3/0638 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3484 ,  H05K13/0465 ,  H05K13/0469 ,  H05K2201/10977

Abstract: Disclosed are an electronic component mounting system and an electronic component mounting method capable of ensuring high connection reliability. An electronic component mounting system (1) includes a component mounting section which includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), and a reflow device (M4), and mounts an electronic component on a main substrate (4), and a substrate connection section which includes a bonding material supply/substrate mounting device (M5) and a thermal compression device (M6), and connects the main substrate (4) with the component mounted thereon and a module substrate (5) to each other. A configuration is used in which a substrate conveying mechanism (3) of the reflow device (M4) on the lowermost stream side of the component mounting section and a substrate conveying mechanism (3) of the bonding material supply/substrate mounting device (M5) of the substrate connection section are connected directly to each other or are linked to each other by a conveying path through another conveying means. Thus, the main substrate (4) after reflow can be transferred immediately to a substrate connection step, and the generation of a void in the connection portion due to moisture being evaporated in the substrate connection step can be excluded.

Abstract translation: 公开了一种能够确保高连接可靠性的电子部件安装系统和电子部件安装方法。 一种电子部件安装系统（1），包括：包括焊料印刷装置（M1），涂布/检查装置（M2），部件安装装置（M3）和回流装置（M4）的部件安装部， 主基板（4）上的电子部件和包括接合材料供给/基板安装装置（M5）和热压缩装置（M6）的基板连接部，并且将主基板（4）与安装的部件 和模块基板（5）。 使用其中组件安装部分的最下游侧的回流装置（M4）的基板输送机构（3）和接合材料供给/基板安装装置（M5）的基板输送机构（3） 基板连接部分彼此直接连接或通过另一输送装置的输送路径相互连接。 因此，回流后的主基板（4）可以立即转移到基板连接步骤，并且可以排除在基板连接步骤中由于水分被蒸发而在连接部分中产生的空隙。

公开(公告)号：US20140191382A1

公开(公告)日：2014-07-10

申请号：US14133074

申请日：2013-12-18

Applicant: Sony Corporation

Inventor： Hiroshi Asami

IPC: H01L23/495 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/108 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2924/12042 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/099 ,  H05K2201/10977 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit substrate includes: a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted; patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and solder bumps provided on the respective patterns, and having substantially same shape as one another.

Abstract translation: 电路基板包括：具有被平坦化的暴露表面并且其中将安装预定芯片的安装区域; 设置在安装区域中的图案，并且包括形成暴露表面的一部分的相应顶面; 以及设置在各个图案上的焊料凸块，并且具有彼此基本相同的形状。

公开(公告)号：US08709293B2

公开(公告)日：2014-04-29

申请号：US11793175

申请日：2005-12-14

Applicant: Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

Inventor： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC: H01B1/02

CPC classification number: H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

Abstract: There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

Abstract translation: 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.当加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：US08697237B2

公开(公告)日：2014-04-15

申请号：US13872205

申请日：2013-04-29

Applicant: Panasonic Corporation

Inventor： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

IPC: B32B27/38 ,  C08L63/00 ,  C08G59/18 ,  C08K3/08 ,  B32B15/092

CPC classification number: C08K13/02 ,  C08K5/09 ,  C22C12/00 ,  C22C28/00 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T428/31511 ,  C08L63/00

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

Abstract translation: 本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。 金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。 使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。 在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键的有机基团。 电子并且能够与金属配位。

公开(公告)号：US08692968B2

公开(公告)日：2014-04-08

申请号：US13257679

申请日：2009-11-04

Applicant: Hiroki Miyazaki

Inventor： Hiroki Miyazaki

IPC: G02F1/1345 ,  G02F1/13 ,  H01L21/00 ,  H05K1/02

CPC classification number: H05K3/321 ,  H01L2224/27334 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83851 ,  H01L2224/97 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2224/83

Abstract: Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin (4) for maintaining the orientation of chip components (2) which are pressure-bonded to a substrate (1) via an anisotropic conductive film (7) is provided. In the chip component mounting method, after the position fixing resin (4) for maintaining the orientation of the chip components (2) which are mounted to the substrate (1) via the anisotropic conductive film (7) is applied to the substrate (1) and cured, the chip components (2) are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet (5) provided on the chip components (2) and, then, pressure-bond to the substrate (1) together. The liquid crystal display is provided with such a substrate.

Abstract translation: 提供了一种芯片部件安装结构和芯片部件安装方法，其中当通过各向异性导电膜将多个具有不同高度的芯片部件安装在基板上时，当芯片部件被压接在基板上时发生位置间隙 并且能够将芯片部件精确地安装在基板的目标位置; 以及设置有该基板的液晶显示装置。 在芯片部件安装结构中，设置有用于通过各向异性导电膜（7）将用于保持与基板（1）压接的芯片部件（2）的取向保持的定位树脂（4）。 在芯片部件安装方法中，在用于将经由各向异性导电膜（7）安装到基板（1）的芯片部件（2）的取向的位置固定树脂（4）施加到基板（1） ）并固化，芯片部件（2）被加热到预定温度，并通过设置在芯片部件（2）上的弹性片（5）以预定压力压制，然后压接到基板（1） 一起。 液晶显示器设置有这样的基板。

公开(公告)号：US20140092569A1

公开(公告)日：2014-04-03

申请号：US14040358

申请日：2013-09-27

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Keizou SAKURAI

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/1461 ,  H05K3/3452 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/0588 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper surface and a solder resist layer 4 deposited in a portion between the element mounting portion 1a and the frame joining portion 1b. In the wiring board 10, a first joining pad 6 provided in the frame joining portion 1b and a second joining pad 16 provided in a lower surface of the frame wiring board 20 are joined together via a solder bump H so that a gap may be formed between the frame joining portion 1b and the frame wiring board 20. The base wiring board 10 has a resin injection hole 8 penetrating through the base wiring board 10 in the frame joining portion 1b, and the gap is filled with a sealing resin 18.

Abstract translation: 布线基板包括基底布线板10和框架布线板20.基布线板10具有在上表面上的元件安装部分1a和框架形框架接合部分1b以及沉积在部分上的阻焊层4 在元件安装部分1a和框架接合部分1b之间。 在布线板10中，设置在框架接合部分1b中的第一接合焊盘6和设置在框架接线板20的下表面中的第二接合焊盘16通过焊料凸块H接合在一起，从而可以形成间隙 框架接合部分1b和框架接线板20之间。底部布线板10具有穿过框架接合部分1b中的基底布线板10的树脂注入孔8，并且间隙填充有密封树脂18。

公开(公告)号：US08659168B2

公开(公告)日：2014-02-25

申请号：US12047811

申请日：2008-03-13

Applicant: Takao Nishimura ,  Yoshikazu Kumagaya

Inventor： Takao Nishimura ,  Yoshikazu Kumagaya

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0594 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patterns.

Abstract translation: 电路板包括主表面，其中电子部件以正面朝下的方式安装，使得具有多个外部连接端子的电子部件的表面面向布线板的主表面，电子部件固定到布线 用粘合剂板; 形成在安装有电子部件的主表面上的绝缘层; 形成在所述绝缘层中的开口部，使得多个相邻布线图案共同且部分地开放，所述相邻布线图形具有连接所述电子部件的电极的电极; 其特征在于，所述开口部的位于所述布线基板的中心侧的外周部沿相对于所述布线图案的延伸方向的倾斜方向形成。

公开(公告)号：US20140049930A1

公开(公告)日：2014-02-20

申请号：US14007808

申请日：2012-04-02

Applicant: Atsushi Yamaguchi ,  Hisahiko Yoshida ,  Arata Kishi ,  Naomichi Ohashi

Inventor： Atsushi Yamaguchi ,  Hisahiko Yoshida ,  Arata Kishi ,  Naomichi Ohashi

IPC: H05K13/04 ,  H05K1/18

CPC classification number: H05K13/0465 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13111 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/8149 ,  H01L2224/8159 ,  H01L2224/81613 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/047 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.

Abstract translation: 在通过使用具有低熔点的焊料将第一安装基板接合到第二基板的情况下，在第二基板上安装半导体元件被焊料界定的第一安装基板的情况下，连接强度变低。 一种安装结构，其中通过使用熔点为217℃或更高的第一焊料将半导体元件接合在其上的第一安装基板安装在第二基板上，包括多个接合部分接合第一安装基板 到第二基板; 以及形成在所述接合部周围的加强部件。 每个接合部分包含熔点低于第一焊料的熔点的第二焊料，并且在彼此相邻的接合部分之间存在不存在增强部件的空间。

公开(公告)号：US08644937B2

公开(公告)日：2014-02-04

申请号：US13610653

申请日：2012-09-11

Applicant: Robert J. Greenberg ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Jerry Ok

IPC: A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到 某些非目标人士。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US08621750B2

公开(公告)日：2014-01-07

申请号：US12623682

申请日：2009-11-23

Applicant: Richard Schmachtenberg, III ,  John R. Andrews ,  Bradley J. Gerner ,  Jonathan R. Brick ,  Samuel Schultz ,  Chad J. Slenes

Inventor： Richard Schmachtenberg, III ,  John R. Andrews ,  Bradley J. Gerner ,  Jonathan R. Brick ,  Samuel Schultz ,  Chad J. Slenes

IPC: H01K3/10

CPC classification number: H05K3/361 ,  H05K3/305 ,  H05K3/321 ,  H05K3/363 ,  H05K2201/09854 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T156/10 ,  Y10T156/1052

Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract translation: 电互连具有粘合剂层，其中形成有孔阵列，孔是非圆形的。 电路装置具有至少一个电接触的第一电路，具有与第一电路的电触点对准的至少一个电接触的第二电路，以及第一和第二电路之间的至少一个孔对准的间隔结构 到第一和第二电路的一个电接触，该孔是非圆形的。