公开(公告)号：US20060091507A1

公开(公告)日：2006-05-04

申请号：US11182484

申请日：2005-07-14

Applicant: Joseph Fjelstad ,  Kevin Grundy ,  Gary Yasumura

Inventor： Joseph Fjelstad ,  Kevin Grundy ,  Gary Yasumura

IPC: H01L23/495

CPC classification number: H01L23/49805 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are IC package structures comprised of standard IC packages modified with separate circuit interconnection structures and disposed to interconnect either directly to other IC packages or to intermediate pedestal connectors which serve to support and interconnect various circuit elements, thus effectively allowing critical signals to bypass the generally less capable interconnection paths within standard interconnection substrates.

Abstract translation: 公开的IC封装结构包括由单独的电路互连结构修改的标准IC封装，并且被设置成直接与其它IC封装或者用于支持和互连各种电路元件的中间基座连接器互连，从而有效地允许关键信号绕过一般 标准互连基板内的能力较弱的互连路径。

公开(公告)号：US20060084250A1

公开(公告)日：2006-04-20

申请号：US11289743

申请日：2005-11-29

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/22

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.

Abstract translation: 制造微电子组件的方法包括提供第一微电子元件，其具有在第一表面处暴露的第一表面和多个触点; 提供第二微电子元件，其具有在顶表面处暴露的顶表面和多个触点，形成多个导电弹性体柱，其将第一微电子元件的至少一些触点连接到第二微电子元件的至少一些触点 微电子元件，以及在所述第一微电子元件的第一表面和所述第二微电子元件的顶表面之间注入柔性材料以形成柔顺层。

公开(公告)号：US20060040488A1

公开(公告)日：2006-02-23

申请号：US11257296

申请日：2005-10-24

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

公开(公告)号：US20060035482A1

公开(公告)日：2006-02-16

申请号：US11123863

申请日：2005-05-06

Applicant: Gary Yasumura ,  William Wiedemann ,  Joseph Fjelstad ,  Para Segaram ,  Kevin Grundy

Inventor： Gary Yasumura ,  William Wiedemann ,  Joseph Fjelstad ,  Para Segaram ,  Kevin Grundy

IPC: H05K1/00

CPC classification number: H01R12/714 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/24 ,  H01R13/6599

Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Abstract translation: 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。

公开(公告)号：US06978538B2

公开(公告)日：2005-12-27

申请号：US10658941

申请日：2003-09-10

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad

IPC: H01L23/498 ,  H01L23/538 ,  H01R12/51 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

Abstract translation: 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。

公开(公告)号：US20050133922A1

公开(公告)日：2005-06-23

申请号：US10987187

申请日：2004-11-12

Applicant: Joseph Fjelstad ,  Kevin Grundy ,  Para Segaram ,  Gary Yasumura

Inventor： Joseph Fjelstad ,  Kevin Grundy ,  Para Segaram ,  Gary Yasumura

IPC: G01R31/28 ,  H01L20060101 ,  H01L23/13 ,  H01L23/498 ,  H01L23/66 ,  H01P3/08 ,  H01P5/02 ,  H04J1/16 ,  H04L1/00 ,  H05K1/02

CPC classification number: H05K1/0243 ,  G01R31/2822 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  Y10S438/981 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Abstract translation: 公开了锥形电介质和导体结构，其提供受控的阻抗互连，同时信号导体线从更细的间距转换到较粗的间距，从而消除通常与电路接触间距的变化相关的电中断。 还公开了用于构造装置和应用的方法。

公开(公告)号：US06888168B2

公开(公告)日：2005-05-03

申请号：US10342973

申请日：2003-01-15

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L31/0203 ,  H01L29/267

CPC classification number: H01L21/568 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L31/0203 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package including an optoelectronic element having a front face including contacts and a rear surface; flexible conductive leads having first ends connected to the contacts and second ends connected to conductive pads adjacent the optoelectronic element; and an at least partially transparent encapsulant covering the optoelectronic element, the flexible leads and the conductive pads, the conductive pads being exposed on a bottom surface of the encapsulant, the bottom surface of the encapsulant defining a bottom of the package, wherein the encapsulant at the bottom of the package extends between the conductive pads.

Abstract translation: 一种微电子封装，包括具有包括触点和后表面的正面的光电元件; 柔性导电引线具有连接到触点的第一端和连接到与光电元件相邻的导电焊盘的第二端; 以及覆盖所述光电子元件，所述柔性引线和所述导电焊盘的至少部分透明的密封剂，所述导电焊盘暴露在所述密封剂的底表面上，所述密封剂的底表面限定所述封装的底部，其中所述密封剂在 封装的底部在导电焊盘之间延伸。

公开(公告)号：US06885106B1

公开(公告)日：2005-04-26

申请号：US10044121

申请日：2002-01-11

Applicant: Philip Damberg ,  Craig S. Mitchell ,  John B. Riley ,  Michael Warner ,  Joseph Fjelstad

Inventor： Philip Damberg ,  Craig S. Mitchell ,  John B. Riley ,  Michael Warner ,  Joseph Fjelstad

IPC: H01L23/31 ,  H01L23/49 ,  H01L25/065 ,  H01L23/48 ,  H01R12/00

CPC classification number: H01L25/0657 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between the second microelectronic element and the dielectric. The dielectric element has opposed first and second surfaces with conductive features exposed at the first surface and terminals exposed on the second surface. Preferably, the contact-bearing face of the first microelectronic element confronts the first surface of the dielectric with at least some of the conductive features being movable with respect to the contacts or terminals. By providing such movable features, joining units have heights of about 300 microns or less may be joined to the terminals thereby reducing the overall height of the microelectronic assembly to 1.2 mm and less.

Abstract translation: 堆叠的微电子组件包括介电元件和第一和第二微电子元件，第一和第二微电子元件彼此堆叠，第一微电子元件设置在第二微电子元件和电介质之间。 电介质元件具有相对的第一表面和第二表面，其导电特征在第一表面暴露并且端子暴露在第二表面上。 优选地，第一微电子元件的接触面面对电介质的第一表面，其中至少一些导电特征可相对于触点或端子移动。 通过提供这种可移动特征，具有约300微米或更小的高度的接合单元可以连接到端子，从而将微电子组件的整体高度减小到1.2mm以下。

公开(公告)号：US20050085012A1

公开(公告)日：2005-04-21

申请号：US10980381

申请日：2004-11-03

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/48 ,  H01L23/498 ,  H01L21/44

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

Abstract translation: 电连接具有带有多个触点的第一表面的微电子部件的方法。 该方法包括以下步骤：通过将具有支撑结构的连接部件和由支撑结构的第一表面基本上彼此平行延伸的多个细长柱与微电子部件并置而形成子组件，使得支撑结构覆盖在表面 所述部件的柱子远离所述部件并且将所述柱电连接到所述微电子部件的触头。

公开(公告)号：US06856235B2

公开(公告)日：2005-02-15

申请号：US09950761

申请日：2001-09-12

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: D21F1/06 ,  D21G9/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L25/18 ,  H01C1/14

CPC classification number: H01L21/568 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L25/18 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85444 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material. In another embodiment, a method of making resistors includes the steps of providing a sacrificial layer having a roughened first surface and a second surface, depositing resistive material over the first surface of the sacrificial layer such that the resistive material covers the first surface of the sacrificial layer, and selectively etching the sacrificial layer to form electrodes.

Abstract translation: 制造电阻器的方法包括提供牺牲层。 然后在牺牲层的区域上形成导电材料。 然后将电阻材料沉积在牺牲层的第一表面上，使得电阻材料覆盖牺牲层和导电材料。 然后去除牺牲层的一部分以暴露导电材料。 制造电阻器的方法包括以下步骤：提供牺牲层，从牺牲层的区域去除牺牲层的至少一部分，以在牺牲层内产生多个空腔，用导电材料镀覆所述空腔， 在所述牺牲层的第一表面上设置电阻材料，使得电阻材料覆盖所述牺牲层和所述导电材料，以及去除所述牺牲层的至少一部分以暴露所述导电材料。 在另一个实施例中，制造电阻器的方法包括以下步骤：提供具有粗糙化的第一表面和第二表面的牺牲层，在牺牲层的第一表面上沉积电阻材料，使得电阻材料覆盖牺牲层的第一表面 层，并且选择性地蚀刻牺牲层以形成电极。