公开(公告)号：US20130153276A1

公开(公告)日：2013-06-20

申请号：US13704248

申请日：2012-06-07

Applicant: Tetsuro Kubo ,  Tsuyoshi Himori ,  Shogo Hirai

Inventor： Tetsuro Kubo ,  Tsuyoshi Himori ,  Shogo Hirai

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H01B1/24 ,  H05K3/0073 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/029

Abstract: A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.

Abstract translation: 电路板包括芯基板部分，绝缘层，第二布线和作为通孔糊的固化产物的通孔。 通孔糊具有第一潜在性固化剂和第二潜在性固化剂，未固化树脂混合物和导电颗粒。 第一潜在性固化剂和第二潜在性固化剂的软化温度均等于或高于40℃，等于或低于200℃，第一潜在性固化剂的软化温度与第一潜在性固化剂的软化温度之差 潜在性固化剂和第二潜在性固化剂的固化剂等于或高于10℃并且等于或低于140℃。

公开(公告)号：US08451010B2

公开(公告)日：2013-05-28

申请号：US12828776

申请日：2010-07-01

Applicant: Kaoru Sugimoto ,  Katsuhiko Kobayashi

Inventor： Kaoru Sugimoto ,  Katsuhiko Kobayashi

IPC: H01H31/02

CPC classification number: H05K1/0269 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/029 ,  H05K2201/0989 ,  Y10T29/4922 ,  Y10T428/24124 ,  Y10T428/24273

Abstract: A coupon board is cut out together with a printed wiring board from a sheet material in which a solder resist film is formed on a surface of a glass cloth fiber. The coupon board is for evaluating characteristics of the printed wiring board. The coupon board includes a region on which the solder resist film is not formed, and which extends parallel with one side of the printed wiring board.

Abstract translation: 从玻璃布纤维的表面上形成有阻焊膜的片状材料与印刷线路板一起切割优惠券板。 优惠券板用于评估印刷电路板的特性。 优惠券板包括没有形成阻焊膜的区域，并且与印刷线路板的一侧平行延伸。

公开(公告)号：US20130037947A1

公开(公告)日：2013-02-14

申请号：US13648876

申请日：2012-10-10

Applicant: Renesas Electronics Corporation

Inventor： Eiji HAYASHI ,  Kyo GO ,  Kozo HARADA ,  Shinji BABA

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/373 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/81 ,  H01L2021/6015 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81909 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/0366 ,  H05K3/4602 ,  H05K2201/029 ,  H01L2924/0132 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

公开(公告)号：US20130020313A1

公开(公告)日：2013-01-24

申请号：US13628287

申请日：2012-09-27

Applicant: Stanley Shigezo Swallow ,  Asha Peta-Thompson

Inventor： Stanley Shigezo Swallow ,  Asha Peta-Thompson

IPC: H05B3/34

CPC classification number: D03D15/00 ,  D03D1/0088 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2211/02 ,  D10B2211/04 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/16 ,  D10B2403/02431 ,  H01H2203/0085 ,  H01H2203/01 ,  H05K3/10 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/3033 ,  Y10T442/3382 ,  Y10T442/339

Abstract: Electrical components are formed in a fabric during the weaving process by a series of crossing conductors in the warp and weft fibres of the fabric. Some of the crossing points provide permanent Separation of the crossing conductors, others permanent connection of the crossing conductors and others connection upon the application of pressure to the fabric. The structure provides the possibility of forming a greater range of components and more reliable component characteristics than heretofore possible.

Abstract translation: 在织造过程中，织物中的织物经纱和纬纱中的一系列交叉导体形成电气部件。 一些交叉点提供了交叉导体的永久分离，其他交叉导体和其他连接在施加压力时连接到织物上。 该结构提供了形成更大范围的部件和比迄今为止更可靠的部件特性的可能性。

公开(公告)号：US08345435B2

公开(公告)日：2013-01-01

申请号：US12851274

申请日：2010-08-05

Applicant: Toshiji Hamatani ,  Hiroki Adachi

Inventor： Toshiji Hamatani ,  Hiroki Adachi

IPC: H05K1/03 ,  H05K1/16 ,  H01L23/48

CPC classification number: H01L21/84 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/83 ,  H01L24/94 ,  H01L27/1203 ,  H01L2221/6835 ,  H01L2224/0401 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13379 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/94 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0017 ,  H05K3/245 ,  H05K3/281 ,  H05K3/4007 ,  H05K2201/029 ,  H05K2201/035 ,  H05K2201/0367 ,  Y10T29/49002 ,  Y10T29/49208 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/0665 ,  H01L2224/83851 ,  H01L2924/00

Abstract: A conductor having a projecting portion is formed which forms a terminal portion. An uncured prepreg including a reinforcing material is closely attached to the conductor and the prepreg is cured to form an insulating film including the reinforcing material. When the prepreg is closely attached, the prepreg is stretched by the projecting portion, so that a region of the prepreg, which is closely attached to the conductor, can be thinner than the other region of the prepreg. Then, by reducing the thickness of the entire insulating film, an opening can be formed in the portion having a smaller thickness. The step of reducing the thickness can be performed by etching. Further, it is preferable not to remove the reinforcing material in this step. The strength of a terminal and an electronic device can be increased by leaving the reinforcing material at the opening.

Abstract translation: 形成具有突出部分的导体，其形成端子部分。 包含增强材料的未固化的预浸料坯紧密地连接到导体上，并且预浸料被固化以形成包括增强材料的绝缘膜。 当预浸料坯紧密贴合时，预浸料被突出部分拉伸，使得与预浸料坯的其它区域相比，紧贴在导体上的预浸料坯的区域更薄。 然后，通过减小整个绝缘膜的厚度，可以在具有较小厚度的部分中形成开口。 可以通过蚀刻来进行厚度减小的步骤。 此外，优选在该步骤中不去除增强材料。 终端和电子设备的强度可以通过将加强材料留在开口处来增加。

公开(公告)号：US08338717B2

公开(公告)日：2012-12-25

申请号：US12845582

申请日：2010-07-28

Applicant: Tadashi Nagasawa

Inventor： Tadashi Nagasawa

IPC: H05K1/11

CPC classification number: H05K1/036 ,  H01L2224/16225 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/029

Abstract: A circuit substrate includes a base and conductive layers disposed on lower and upper surfaces of the substrate. The base includes resin layers and the conductive layers overlapping with each other in a plan view. The resin layers include first resin layers and a second resin layer interposed between the first resin layers. The first resin layer has a filler and the second resin layer has no filler or a filler whose amount is 1 volume % or less and smaller than an amount of the filler in the first resin layer.

Abstract translation: 电路基板包括设置在基板的下表面和上表面上的基底和导电层。 基底包括树脂层，并且导电层在平面图中彼此重叠。 树脂层包括第一树脂层和介于第一树脂层之间的第二树脂层。 第一树脂层具有填料，第二树脂层不含有第一树脂层中的填料量或1体积％以下的填料。

公开(公告)号：US20120231689A1

公开(公告)日：2012-09-13

申请号：US13075147

申请日：2011-03-29

Applicant: Deok Hoon Kim ,  Kyung Wook Paik ,  Kyoung Lim Suk ,  Jae Ok Kim

Inventor： Deok Hoon Kim ,  Kyung Wook Paik ,  Kyoung Lim Suk ,  Jae Ok Kim

IPC: D03D15/00 ,  H01B1/22 ,  C09K11/08 ,  H01B1/20 ,  H01F1/01

CPC classification number: H01R4/04 ,  C08G2650/40 ,  C08L71/00 ,  C08L71/02 ,  C08L77/00 ,  C08L77/10 ,  C08L79/04 ,  C08L81/02 ,  C08L81/06 ,  C09J133/08 ,  C09J133/20 ,  C09J133/24 ,  C09J135/06 ,  C09J143/04 ,  D01D5/0007 ,  D01F1/10 ,  H01R12/52 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T428/254 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/2896 ,  Y10T442/30

Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

公开(公告)号：US20120156955A1

公开(公告)日：2012-06-21

申请号：US13392461

申请日：2010-08-25

Applicant: Masaaki Endo ,  Daisuke Matsude ,  Susumu Ohigashi

Inventor： Masaaki Endo ,  Daisuke Matsude ,  Susumu Ohigashi

IPC: D03D15/00

CPC classification number: H05K1/0366 ,  C08J5/24 ,  D03D1/0082 ,  D03D15/0011 ,  D03D15/0094 ,  H05K2201/029 ,  Y10T442/3065

Abstract: The present invention provides a glass cloth suitable for producing a printed wiring board to be used in the electronics and electric fields, which has small anisotropy in dimensional change and is free from warpage and twist, a prepreg using said glass cloth, and a printed wiring board using said glass cloth. The glass cloth relevant to the present invention is characterized in that the warp yarn and the weft yarn are configured with a glass yarn of 1.8×10−6 kg/m to 14×10−6 kg/m, a (breadth/length) ratio of an average filament diameter of said weft yarn to an average filament diameter of said warp yarn is 1.01 or more but less than 1.27, and a thickness is 10 μm to 40 μm.

Abstract translation: 本发明提供一种玻璃布，其适用于制造电子电场中使用的印刷布线板，其尺寸变化各向异性小，不发生翘曲和扭曲，使用所述玻璃布的预浸料和印刷布线 使用玻璃布板。 本发明的玻璃布的特征在于，经纱和纬纱配置有1.8×10 -6 kg / m至14×10 -6 kg / m 2的玻璃丝，（宽度/长度） 所述纬纱的平均长丝直径与所述经纱的平均长丝直径之比为1.01以上且小于1.27，厚度为10μm〜40μm。

公开(公告)号：US08198569B2

公开(公告)日：2012-06-12

申请号：US11189369

申请日：2005-07-26

Applicant: Martin Krobok ,  Markus Voelk ,  Peter Bramberger

Inventor： Martin Krobok ,  Markus Voelk ,  Peter Bramberger

IPC: H05B3/02 ,  H05B1/00

CPC classification number: H05K3/10 ,  H05B3/34 ,  H05B2203/013 ,  H05B2203/029 ,  H05K3/244 ,  H05K3/3405 ,  H05K2201/029 ,  H05K2201/0367 ,  H05K2201/09736 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: A surface structure (1) that is at least partially electrically conductively coated by a conductor coating (11), and which can be connected to an electric power source by at least one electric connecting conductor (2). The connecting conductor (2) electrically contacts the conductor coating (11) at at least one solder point (3), and the conductive coating (11) is thickened at least at one contact zone (4) in the area of the solder point (3) as opposed to other areas (7) of the surface structure (1).

Abstract translation: 一种表面结构（1），其至少部分地由导体涂层（11）导电地涂覆，并且可以由至少一个电连接导体（2）连接到电源。 连接导体（2）在至少一个焊点（3）处与导体涂层（11）电接触，并且导电涂层（11）在焊点的区域中至少在一个接触区域（4） 3）与表面结构（1）的其它区域（7）相对。

公开(公告)号：US20120141753A1

公开(公告)日：2012-06-07

申请号：US13309513

申请日：2011-12-01

Applicant: Christopher A. Hunrath

Inventor： Christopher A. Hunrath

IPC: C09J7/02 ,  B32B15/08 ,  C09J139/04

CPC classification number: C09J171/00 ,  B32B7/12 ,  B32B27/36 ,  B32B2457/08 ,  C08G2650/56 ,  C08L61/06 ,  C08L71/00 ,  C08L79/00 ,  C09J7/25 ,  C09J7/29 ,  C09J179/04 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2463/00 ,  C09J2467/006 ,  C09J2479/00 ,  C09J2479/086 ,  H01L21/48 ,  H01L23/145 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/029 ,  Y10T428/24942 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/31678 ,  H01L2924/00

Abstract: One or more embodiments contained herein disclose an adhesive layer for printed circuit board (PCB) applications. The improved adhesive film layer may comprise a benzoxazine resin and a phenoxy resin. According to some embodiments, the improved adhesive film layer may be coated onto a polyester release sheet.

Abstract translation: 本文包含的一个或多个实施方案公开了用于印刷电路板（PCB）应用的粘合剂层。 改进的粘合剂膜层可以包含苯并恶嗪树脂和苯氧基树脂。 根据一些实施例，改进的粘合剂膜层可以涂覆在聚酯剥离片上。