公开(公告)号：US09190297B2

公开(公告)日：2015-11-17

申请号：US13208027

申请日：2011-08-11

申请人： DaeSik Choi ,  YeongIm Park ,  HyungMin Lee

发明人： DaeSik Choi ,  YeongIm Park ,  HyungMin Lee

IPC分类号： H01L21/50 ,  H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H01L25/16 ,  H01L23/31 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/01082 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate and first semiconductor die to the substrate. A plurality of vertically-oriented discrete electrical devices, such as a capacitor, inductor, resistor, diode, or transistor, is mounted over the substrate in proximity to the first semiconductor die. A first terminal of the discrete electrical devices is connected to the substrate. A plurality of bumps is formed over the substrate adjacent to the discrete electrical devices. An encapsulant is deposited over and between the first semiconductor die and substrate. A portion of the bumps and a second terminal of the discrete electrical devices is exposed from the encapsulant. An interconnect structure is formed over a surface of the substrate opposite the first semiconductor die. The semiconductor devices are stackable and electrically connected through the substrate, discrete electrical devices, and bumps. A heat spreader or second semiconductor die can be disposed between the stacked semiconductor devices.

摘要翻译： 半导体器件具有衬底和第一半导体管芯到衬底。 多个垂直取向的分立电气装置，例如电容器，电感器，电阻器，二极管或晶体管，安装在靠近第一半导体管芯的衬底上。 分立电气设备的第一端子连接到基板。 在与分立电气装置相邻的衬底上形成多个凸块。 密封剂沉积在第一半导体管芯和衬底之上和之间。 凸块的一部分和离散电气装置的第二端子从密封剂暴露出来。 在与第一半导体管芯相对的衬底的表面上形成互连结构。 半导体器件可堆叠并通过衬底电连接，分立的电子器件和凸块。 散热器或第二半导体管芯可以设置在堆叠的半导体器件之间。

公开(公告)号：US20110278707A1

公开(公告)日：2011-11-17

申请号：US12781751

申请日：2010-05-17

申请人： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

发明人： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

IPC分类号： H01L23/52 ,  H01L21/60

CPC分类号： H01L21/76802 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49517 ,  H01L23/49527 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16245 ,  H01L2224/21 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/185 ,  H05K3/4682 ,  H01L2224/82 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81805 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.

摘要翻译： 具有多个接触垫的预制多芯片引线框安装在临时载体上。 第一半导体管芯安装在引线框架的接触焊盘之间的载体上。 第二半导体管芯安装在引线框架的接触焊盘上并且在第一管芯上方。 密封剂沉积在引线框架和第一和第二裸片上。 载体被移除。 第一互连结构形成在引线框架和第一管芯以及密封剂的第一表面上。 通过密封剂和引线框架切割通道以分离接触垫。 可以通过密封剂形成多个导电通孔。 第二互连结构形成在密封剂的与密封剂的第一表面相对的第二表面上。 第二互连结构电连接到导电通孔。

公开(公告)号：US08357564B2

公开(公告)日：2013-01-22

申请号：US12781751

申请日：2010-05-17

申请人： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

发明人： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

IPC分类号： H01L21/44

CPC分类号： H01L21/76802 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49517 ,  H01L23/49527 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16245 ,  H01L2224/21 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/185 ,  H05K3/4682 ,  H01L2224/82 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81805 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.

公开(公告)号：US09391046B2

公开(公告)日：2016-07-12

申请号：US13112172

申请日：2011-05-20

申请人： Yeonglm Park ,  HeeJo Chi ,  HyungMin Lee

发明人： Yeonglm Park ,  HeeJo Chi ,  HyungMin Lee

IPC分类号： H01L21/00 ,  H01L29/40 ,  H01L25/065 ,  H01L23/31 ,  H01L23/36 ,  H01L23/48 ,  H01L23/552 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/481 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/0558 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14136 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/93 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate and plurality of first semiconductor die having conductive vias formed through the first semiconductor die mounted with an active surface oriented toward the substrate. An interconnect structure, such as bumps or conductive pillars, is formed over the substrate between the first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. The second semiconductor die is electrically connected through the interconnect structure to the substrate and through the conductive vias to the first semiconductor die. An underfill material is deposited between the first semiconductor die and substrate. Discrete electronic components can be mounted to the substrate. A heat spreader or shielding layer is mounted over the first and second semiconductor die and substrate. Alternatively, an encapsulant is formed over the die and substrate and conductive vias or bumps are formed in the encapsulant electrically connected to the first die.

摘要翻译： 半导体器件具有衬底和多个第一半导体管芯，其具有通过第一半导体管芯形成的导电通孔，所述导电通孔安装有朝向衬底的有源表面。 在第一半导体管芯之间的衬底上形成诸如凸起或导电柱的互连结构。 第二半导体管芯安装到第一半导体管芯。 第二半导体管芯通过互连结构电连接到衬底并且通过导电通孔连接到第一半导体管芯。 在第一半导体管芯和衬底之间沉积底部填充材料。 离散电子部件可以安装在基板上。 散热器或屏蔽层安装在第一和第二半导体管芯和衬底上。 或者，在管芯和衬底上形成密封剂，并且在电连接到第一管芯的密封剂中形成导电通孔或凸块。

公开(公告)号：US08710634B2

公开(公告)日：2014-04-29

申请号：US12410945

申请日：2009-03-25

申请人： HeeJo Chi ,  Jae Han Chung ,  Junwoo Myung ,  Yeonglm Park ,  HyungMin Lee

发明人： HeeJo Chi ,  Jae Han Chung ,  Junwoo Myung ,  Yeonglm Park ,  HyungMin Lee

IPC分类号： H01L23/552 ,  H01L23/28 ,  H01L21/44

CPC分类号： H01L23/49575 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an integrated circuit above and to the substrate; mounting an internal interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate and over the integrated circuit with the integral-interposer-structure connected to the internal interconnect; and encapsulating the internal interconnect and the integrated circuit with an encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法包括：提供具有衬底互连的衬底; 在基板上方安装集成电路并将其安装到基板上; 将内部互连件安装到所述基板互连件; 在所述基板上和所述集成电路上安装具有整体插入器结构的结构，所述整体插入器结构连接到所述内部互连件; 并用封装封装内部互连和集成电路。

公开(公告)号：US08426955B2

公开(公告)日：2013-04-23

申请号：US12484158

申请日：2009-06-12

申请人： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

发明人： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

IPC分类号： H01L23/28

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a stack board; connecting a device over the stack board; forming a stack encapsulant having a cavity and a pedestal over the device and having a shaped perimeter side from a pedestal surface of the pedestal to the stack board; and attaching a stack adhesive to a base package and the pedestal, the cavity and the shaped perimeter side providing a space for connections to the stack board.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供堆叠板; 通过堆叠板连接设备; 在所述装置上形成具有空腔和基座的堆叠密封剂，并且具有从所述基座的基座表面到所述堆叠板的成形周边侧; 并且将堆叠粘合剂附着到基底包装上，并且基座，空腔和成形的周边侧面提供用于连接到堆叠板的空间。

公开(公告)号：US20120326324A1

公开(公告)日：2012-12-27

申请号：US13166679

申请日：2011-06-22

申请人： HyungMin Lee ,  HeeJo Chi ,  YeongIm Park

发明人： HyungMin Lee ,  HeeJo Chi ,  YeongIm Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/96 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/96 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/014

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting an organic chip assembly on the base substrate, the organic chip assembly includes providing an assembly integrated circuit embedded in an organic cover, the organic cover having a through via, and the organic chip assembly having a vertical assembly side; forming a molded underfill encapsulating the vertical assembly side, and between the organic chip assembly and the base substrate; and removing a portion of the organic chip assembly and the molded underfill for forming a planarized assembly surface.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将有机芯片组件安装在基底基板上，有机芯片组件包括提供嵌入有机盖中的组装集成电路，有机盖具有通孔，有机芯片组件具有垂直组装侧; 形成封装垂直组装侧的模制底部填充物，以及有机芯片组件和基底衬底之间; 并移除有机芯片组件和模制的底部填充物的一部分以形成平坦化的组装表面。

公开(公告)号：US20110278721A1

公开(公告)日：2011-11-17

申请号：US13191386

申请日：2011-07-26

申请人： DaeSi Choi ,  JongHo Kim ,  HyungMin Lee

发明人： DaeSi Choi ,  JongHo Kim ,  HyungMin Lee

IPC分类号： H01L23/498

CPC分类号： H01L24/82 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29144 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/0097 ,  H01L2924/01014 ,  H01L2924/05432 ,  H01L2924/054 ,  H01L2924/0542 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable.

摘要翻译： 半导体器件包括具有通过晶片级衬底形成的多个第一导电通孔的晶片级衬底。 第一半导体管芯安装到晶片级衬底。 第一半导体管芯的第一表面包括朝向晶片级衬底的第一表面定向的接触焊盘。 第一密封剂沉积在第一半导体管芯上。 第二半导体管芯安装到晶片级衬底。 第二半导体管芯的第一表面包括朝向与晶片级衬底的第一表面相对的晶片级衬底的第二表面的接触焊盘。 第二密封剂沉积在第二半导体管芯上。 在多个第一导电通孔上形成多个凸点。 可以通过第一密封剂形成第二导电通孔并连接到第一导电通孔。 半导体封装是可堆叠的。

公开(公告)号：US08710668B2

公开(公告)日：2014-04-29

申请号：US13163150

申请日：2011-06-17

申请人： HyungMin Lee ,  HeeJo Chi ,  YeongIm Park

发明人： HyungMin Lee ,  HeeJo Chi ,  YeongIm Park

IPC分类号： H01L23/12

CPC分类号： H01L23/3135 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; molding a first encapsulation above the substrate; forming a via through the first encapsulation; mounting an integrated circuit above the substrate and between sides of the first encapsulation; and forming a second encapsulation covering the integrated circuit and the first encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基底上模制第一封装; 通过第一封装形成通孔; 在衬底上方和第一封装的侧面之间安装集成电路; 以及形成覆盖所述集成电路和所述第一封装的第二封装。

公开(公告)号：US08648469B2

公开(公告)日：2014-02-11

申请号：US13191386

申请日：2011-07-26

申请人： DaeSik Choi ,  JongHo Kim ,  HyungMin Lee

发明人： DaeSik Choi ,  JongHo Kim ,  HyungMin Lee

IPC分类号： H01L23/48

CPC分类号： H01L24/82 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29144 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/0097 ,  H01L2924/01014 ,  H01L2924/05432 ,  H01L2924/054 ,  H01L2924/0542 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable.

摘要翻译： 半导体器件包括具有通过晶片级衬底形成的多个第一导电通孔的晶片级衬底。 第一半导体管芯安装到晶片级衬底。 第一半导体管芯的第一表面包括朝向晶片级衬底的第一表面定向的接触焊盘。 第一密封剂沉积在第一半导体管芯上。 第二半导体管芯安装到晶片级衬底。 第二半导体管芯的第一表面包括朝向与晶片级衬底的第一表面相对的晶片级衬底的第二表面的接触焊盘。 第二密封剂沉积在第二半导体管芯上。 在多个第一导电通孔上形成多个凸点。 可以通过第一密封剂形成第二导电通孔并连接到第一导电通孔。 半导体封装是可堆叠的。