公开(公告)号：US08415784B2

公开(公告)日：2013-04-09

申请号：US12789590

申请日：2010-05-28

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Ryuji Kimura

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Ryuji Kimura

IPC分类号： H01L23/52 ,  H01L21/768 ,  H01L23/48

CPC分类号： H05K13/0465 ,  H01B3/025 ,  H01B3/10 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1131 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/812 ,  H01L2224/8181 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/8384

摘要： An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor.

摘要翻译： 电子设备包括多个堆叠的基板。 每个基板包括半导体基板，柱状导体和环形绝缘体。 柱状导体沿半导体衬底的厚度方向延伸。 环状绝缘体包括主要由玻璃构成的无机绝缘层。 无机绝缘层填充设置在半导体衬底中以围绕柱状导体的环形槽。

公开(公告)号：US08079131B2

公开(公告)日：2011-12-20

申请号：US12394774

申请日：2009-02-27

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Ryuji Kimura

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Ryuji Kimura

IPC分类号： B23P25/00

CPC分类号： B22D19/00 ,  B81B2207/07 ,  B81C1/00095 ,  H01L21/486 ,  H01L21/76882 ,  H01L2924/0002 ,  H05K3/101 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/128 ,  Y10T29/4998 ,  Y10T29/49982 ,  Y10T29/49984 ,  Y10T29/49988 ,  Y10T29/49991 ,  Y10T29/49993 ,  H01L2924/00

摘要： The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.

摘要翻译： 本发明包括在存在于物体内部的微细空间内冷却熔融金属并使其在施加超过大气压的强制外力对其进行硬化的步骤。 在物体的外表面上的细长空间的一端开口。 强制外力由选自按压压力，注射压力和轧制压实中的至少一个构件提供，并且在从其开口的开口表面侧向熔融金属施加的另一端 一边的精细空间是封闭的。

公开(公告)号：US09685394B2

公开(公告)日：2017-06-20

申请号：US13106933

申请日：2011-05-13

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： H01L33/62 ,  H01L21/28 ,  H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/13 ,  H01L2224/16146 ,  H01L2224/81 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.

公开(公告)号：US08758900B2

公开(公告)日：2014-06-24

申请号：US12801195

申请日：2010-05-27

申请人： Shigenobu Sekine ,  Yurina Sekine

发明人： Shigenobu Sekine ,  Yurina Sekine

IPC分类号： B22F1/00 ,  C01B33/02 ,  B22F9/08

CPC分类号： B22F9/06 ,  B22F1/0085 ,  B22F9/002 ,  B22F9/08 ,  B22F9/082 ,  B22F2009/084 ,  B22F2009/0844 ,  B22F2998/00 ,  B22F2998/10 ,  B22F2999/00 ,  C01G1/00 ,  C01P2002/60 ,  C01P2002/90 ,  C01P2004/32 ,  Y10T428/12181 ,  Y10T428/2982 ,  B22F2201/11 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2201/03 ,  B22F2201/30 ,  B22F9/10 ,  B22F2202/13

摘要： The present invention provides nanometer-size spherical particles. Each of the particles is made of at least one selected from the group consisting of a metal, an alloy, and a metal compound. The particles include one or both of a polycrystalline region and a single-crystalline region. The particles have a particle size of less than 1 μm; and a sphericity of −10% to +10%.

摘要翻译： 本发明提供了纳米尺寸的球形颗粒。 每个颗粒由选自金属，合金和金属化合物的至少一种制成。 颗粒包括多晶区域和单晶区域中的一个或两个。 颗粒的粒径小于1μm; 和球形度为-10％至+ 10％。

公开(公告)号：US08377565B2

公开(公告)日：2013-02-19

申请号：US13084847

申请日：2011-04-12

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： B22F7/00 ,  B32B15/01

CPC分类号： H01L21/76898 ,  H01L21/76882 ,  H01L2924/0002 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12632 ,  H01L2924/00

摘要： A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer.

摘要翻译： 填充材料包括支撑基底构件和金属层，所述金属层包括第一金属层和第二金属层，并且设置在所述支撑基底构件的一侧，所述第一金属层是纳米金属颗粒的聚集体， 具有能够在低于熔点的温度下熔化的膜厚度，所述第二金属层是具有比所述第一金属层低的熔点的金属颗粒的聚集体。

公开(公告)号：US20110284912A1

公开(公告)日：2011-11-24

申请号：US13106933

申请日：2011-05-13

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： H01L33/62 ,  H01L21/28

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/13 ,  H01L2224/16146 ,  H01L2224/81 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.

摘要翻译： 电子设备包括半导体衬底，绝缘材料填充层和垂直导体。 半导体衬底具有沿其厚度方向延伸的垂直孔。 绝缘材料填充层是填充在用于覆盖其内周的垂直孔中的环状层，并且包括主要由玻璃和纳米复合陶瓷组成的有机绝缘材料或无机绝缘材料。 纳米复合陶瓷在室温下的电阻率大于1014＆OHgr·cm，相对介电常数为4〜9。垂直导体是填充在被绝缘材料填充层包围的区域中的凝固金属体。

公开(公告)号：US07781382B2

公开(公告)日：2010-08-24

申请号：US11606897

申请日：2006-12-01

申请人： Shigenobu Sekine ,  Yurina Sekine

发明人： Shigenobu Sekine ,  Yurina Sekine

IPC分类号： C10M125/26 ,  C10M103/04 ,  C10M125/20

CPC分类号： C10M103/00 ,  C10M103/04 ,  C10M103/06 ,  C10M111/04 ,  C10M2201/053 ,  C10M2201/0613 ,  C10M2201/0623 ,  C10M2201/1006 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2210/04 ,  C10N2220/08 ,  C10N2220/082 ,  C10N2230/06 ,  C10N2240/02 ,  C10N2250/08 ,  C10N2250/10 ,  C10N2250/18 ,  Y10S977/724 ,  Y10S977/731 ,  Y10S977/778

摘要： There is provided a lubricant composition which includes: a first particle having a spherical shape having a diameter of 1 to 300 nm, having a Mohs hardness of 5 or more, at an amount of 0.01 to 40 weight %; and a second particle, having a diameter of 500 nm to 50 μm, having a Brinell hardness of 17 HB or less, at an amount of 0.01 to 40 weight %. The lubricant composition can form a bearing structure when the lubricant composition is subjected to an extreme pressure. The second particles are deformed into a retainer for the first particle.

摘要翻译： 提供一种润滑剂组合物，其包含：具有0.01〜40重量％的Mohs硬度为5以上的直径为1〜300nm的球状的第1粒子， 和第二颗粒，其直径为500nm至50μm，布氏硬度为17HB或更低，其量为0.01至40重量％。 当润滑剂组合物经受极压时，润滑剂组合物可以形成轴承结构。 第二颗粒变形成用于第一颗粒的保持器。

公开(公告)号：US08766312B2

公开(公告)日：2014-07-01

申请号：US13276475

申请日：2011-10-19

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Kazutoshi Kamibayashi

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana ,  Kazutoshi Kamibayashi

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate.

摘要翻译： 发光装置包括发光元件和支撑基板。 发光元件具有绝缘层和穿过绝缘层的第一和第二垂直导体。 支撑基板具有基板部分和第一和第二贯通电极，并且设置在绝缘层上。 第一贯通电极通过基板部分，其一端连接到第一垂直导体的相对端，而第二贯穿电极通过基板部分，其一端连接到第二垂直导体的相对端。 第一和第二垂直导体的相对端从绝缘层的表面突出并且连接到支撑衬底内的第一和第二穿透电极的端部。

公开(公告)号：US08580581B2

公开(公告)日：2013-11-12

申请号：US12943447

申请日：2010-11-10

申请人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

发明人： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/0516 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/10135 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/16146 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method for manufacturing an electronic device, including a step of aligning and stacking a plurality of substrates, each of the plurality of substrates having a plurality of vertical conductors and magnetic films, the vertical conductors being directed along a thickness direction of the substrate and distributed in a row with respect to a substrate surface, the magnetic films being disposed in place on the substrate surface in a predetermined positional relationship with the vertical conductors, upon aligning the plurality of substrates, the electronic device manufacturing method including a step of applying an external magnetic field to produce a magnetic attractive force between the magnetic films of adjacent stacked substrates and align the vertical conductors by the magnetic attractive force.

摘要翻译： 一种电子装置的制造方法，其特征在于，包括：对准和堆叠多个基板的步骤，所述多个基板中的每一个具有多个垂直导体和磁性膜，所述垂直导体沿着所述基板的厚度方向引导并分布 相对于基板表面成一排地，在对准多个基板时，磁性膜以与垂直导体预定的位置关系被布置在基板表面上的适当位置，该电子设备制造方法包括施加外部 磁场，以在相邻堆叠的衬底的磁性膜之间产生磁吸引力，并通过磁吸引力对准垂直导体。

公开(公告)号：US08217403B1

公开(公告)日：2012-07-10

申请号：US13179073

申请日：2011-07-08

申请人： Shigenobu Sekine ,  Yurina Sekine

发明人： Shigenobu Sekine ,  Yurina Sekine

IPC分类号： H01L27/15

CPC分类号： H05K1/097 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L31/022425 ,  H01L31/0682 ,  H01L33/62 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81395 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8359 ,  H01L2224/83605 ,  H01L2224/83609 ,  H01L2224/83611 ,  H01L2224/83613 ,  H01L2224/83618 ,  H01L2224/83624 ,  H01L2224/83639 ,  H01L2224/83644 ,  H01L2224/83647 ,  H01L2224/83655 ,  H01L2224/8366 ,  H01L2224/83666 ,  H01L2224/83669 ,  H01L2224/83701 ,  H01L2224/83799 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H05K1/111 ,  H05K2201/0338 ,  H05K2201/099 ,  Y02E10/547 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/8159 ,  H01L2924/00014 ,  H01L2224/81799 ,  H01L2924/00012 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81644 ,  H01L2224/81669 ,  H01L2224/81666 ,  H01L2224/81624 ,  H01L2224/81618 ,  H01L2224/8166 ,  H01L2224/81655 ,  H01L2224/81611 ,  H01L2224/81609 ,  H01L2224/81613 ,  H01L2224/81605 ,  H01L2224/29075

摘要： An electronic device includes a substrate and an electronic component. The substrate has a metallized trace. The metallized trace has a metallized layer and an insulation layer. The metallized layer has a high melting point metal component and a low melting point metal component, the high melting point metal component and the low melting point metal component being diffusion bonded together. The insulation layer is formed simultaneously with the metallized layer to cover an outer surface of the metallized layer. The electronic component is electrically connected to the metallized layer.

摘要翻译： 电子设备包括基板和电子部件。 衬底具有金属化迹线。 金属化迹线具有金属化层和绝缘层。 金属化层具有高熔点金属成分和低熔点金属成分，高熔点金属成分和低熔点金属成分被扩散接合在一起。 绝缘层与金属化层同时形成以覆盖金属化层的外表面。 电子部件电连接到金属化层。