公开(公告)号：EP1418645A1

公开(公告)日：2004-05-12

申请号：EP03021188.2

申请日：2003-09-25

Applicant: Valeo Schalter und Sensoren GmbH

Inventor： Biehlman, Bernd ,  Walz, Dirk ,  Künzler, Frank ,  Papinzer, Uwe

IPC: H01R12/04 ,  H01R12/18

CPC classification number: H01R12/526 ,  H01R12/7082 ,  H01R12/721 ,  H01R13/6658 ,  H01R29/00 ,  H01R31/06 ,  H05K1/142 ,  H05K1/145 ,  H05K3/368 ,  H05K2201/0397

Abstract: Die Erfindung betrifft ein Steckerelement, insbesondere zur Verbindung von Leiterbahnen wenigstens zweier elektrische und/oder elektronische Bauteile aufweisenden Platinen, und einen Platinenaufbau. Das erfindungsgemäße Steckerelement zeichnet sich dadurch aus, dass es als Steckerleiterplatte ausgebildet ist, die an wenigstens einer Seite einstückig mit der Steckerleiterplatte ausgebildete Kontaktzungen aufweist.

Abstract translation: 连接器元件（10）形成连接器印刷电路板，该连接器印刷电路板的一侧上具有与连接器印刷电路板一体形成的接触柱。 第一（22）和第二（24）电路板具有各种电气/电子部件（28）。 两个板彼此相配并且彼此平行。 对于具有电气和/或电子部件和连接器印刷电路板的印刷电路板结构，还包括独立权利要求。

公开(公告)号：EP1014764B1

公开(公告)日：2003-01-22

申请号：EP99309195.8

申请日：1999-11-18

Applicant: Lucas Industries Limited

Inventor： Strickley, David William

IPC: H05K1/02

CPC classification number: H05K3/4084 ,  H05K3/0061 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/0397 ,  H05K2201/09554

公开(公告)号：EP1187259A2

公开(公告)日：2002-03-13

申请号：EP01307481.0

申请日：2001-09-03

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuasa, Eriko ,  Kato, Shinshu

IPC: H01R9/24

CPC classification number: H05K1/0256 ,  H01H2085/208 ,  H01R9/2458 ,  H01R2201/26 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  Y10S439/949

Abstract: An electrical connection box for use in a vehicle has bus bars (10, 11) in a casing with upstanding connection tabs (10a, 11a) which are alongside and spaced from each other. Insulation resin embeds the tabs while leaving exposed projecting portions. A connector (20) attached to the casing has a housing (21) containing terminals (7, 8) respectively engaged with the projecting portions of the tabs. The resin material provides a recess (15) located between the tabs (10a, 11a) and the housing of said connector (20) has a partition wall (22) of insulating material which lies between the terminals (7, 8) and extends into the recess (15), to prevent leak current between the terminals.

Abstract translation: 一种用于车辆中的电连接盒，具有位于壳体中的汇流条（10,11），该汇流条具有直立的连接片（10a，11a），所述连接片沿着彼此并且彼此间隔开。 绝缘树脂嵌入接片，同时留下暴露的突出部分。 连接到壳体的连接器（20）具有包含分别与突片的突出部分接合的端子（7,8）的壳体（21）。 树脂材料提供位于凸片（10a，11a）之间的凹槽（15），并且所述连接器（20）的壳体具有位于端子（7,8）之间并延伸到绝缘材料的隔离材料的隔壁（22） （15），以防止端子之间的泄漏电流。

公开(公告)号：EP0870642A3

公开(公告)日：2000-03-15

申请号：EP98106225.0

申请日：1998-04-06

Applicant: Hermann Stahl GmbH

Inventor： Stahl, Hermann ,  Windt, Uwe

IPC: H05K3/32 ,  H01R4/06 ,  B60Q1/02

CPC classification number: H05K3/326 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/1084 ,  Y10S439/937

Abstract: Die Erfindung betrifft einen Träger zum mechanischen Halten und elektrischen Verbinden von Leuchtdioden. Der Träger (1) besteht aus einem elektrisch leitfähigen Blech (2, 3), auf dem die Anschlußfahnen (11) der Leuchtdioden (10) elektrisch leitend festgelegt sind. Zur Erzielung einer gut leitenden elektrischen Verbindung bei hoher mechanischer Stabilität ist vorgesehen, zumindest auf der Kontaktseite (17) des Trägers (1) noppenartige Haltezapfen (5) vorzusehen, die als Hohlnieten aus dem Blechmaterial des Trägers (1) ausgeprägt sind und eine Öffnung (12) in der Anschlußfahne (11) der Leuchtdioden (10) durchragen, wobei das mechanisch verformte Kopfende (7) des Haltezapfens (5) den Rand (13) der Öffnung (12) in der Anschlußfahne (11) übergreift.

公开(公告)号：EP0600051B1

公开(公告)日：1999-05-12

申请号：EP93909754.9

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/42 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4635 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The initial intention in the semi-finished product of the invention is to provide a functional separation between the requirement for mechanical strength and the previously concomitant requirement, for completing a circuit, in order to bring the pure circuit connection, especially for signals, 'closer' to the electrical and technical properties of chips. To do this, the layout miniaturisation is optimised without regard for the mechanical strength of the substrate. Instead of a printed circuit board (MCM), a semi-finished product which can be developed into a printed circuit board is made. The semi-finished product of the invention consists of an extremely thin film (8) with a plurality of extremely small holes (14) made simultaneously by an etching process. The hole diameters can be reduced by almost an order of magnitude (down to 20 νm), facilitating, for instance, definite sub-100 νm technology. Such a semi-finished product (19) does not act as a mechanical support but is designed only for signal conduction. The semi-finished product (19) which carries the densely packed wiring pattern, is bonded to a not densely packed power supply plane (22) acting as the service plane and the printed circuit board thus made is finally secured to a mechanical support (20).

公开(公告)号：EP0897653A1

公开(公告)日：1999-02-24

申请号：EP97918276.0

申请日：1997-05-01

Applicant: FORD MOTOR COMPANY LIMITED ,  FORD-WERKE AKTIENGESELLSCHAFT

Inventor： GLOVATSKY, Andrew Zachary ,  TODD, Michael, George ,  MCMILLAN, Richard, Keith, II

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/0207 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/0253 ,  H05K3/4092 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/10689

Abstract: A circuit board is disclosed comprising a substantially non-conductive substrate (12) and first and second rigid sheets (14, 16). The first sheet (14) forms a grid pattern substantially encapsulated by the substrate (12), and a portion (20) of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet (16) is also substantially encapsulated by the substrate (12) and has a portion which extends beyond the boundary of the substrate (12) to form a second interconnection terminal. The second sheet (16) acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate (12).

公开(公告)号：EP0779772A4

公开(公告)日：1998-07-29

申请号：EP95932236

申请日：1995-09-26

Applicant: SEIKO EPSON CORP

Inventor： UCHIYAMA KENJI

IPC: G02F1/13 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02

CPC classification number: G02F1/13452 ,  H01L23/49805 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0032 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K3/403 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/055 ,  H05K2201/10136 ,  H05K2201/10977 ,  H01L2224/0401

Abstract: A notch portion (12) is formed by partly scraping the substrate material along a crease that has been set in advance in the insulating substrate (11), a first portion (14) and a second portion (15) that are divided along the crease are folded and are integrally joined together by using an adhesive or by welding. A conducting pattern (17) is formed on the surface of the insulating substrate (11) at the notch portion between the first portion and the second portion spanning across the crease, and wiring patterns are formed on both surfaces of the printed wiring board (20) being directly conducting to each other without the need to forming a through hole. Use of this printed wiring board makes it possible to realize various electronic devices such as liquid crystal display device, electronic printer, etc., as well as portable information devices in small sizes, reduced weight, decreased thicknesses and at reduced costs.

公开(公告)号：EP0792463A4

公开(公告)日：1998-06-24

申请号：EP95940718

申请日：1995-11-15

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/06 ,  B23K1/00 ,  B23K20/00 ,  B32B15/08 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/52 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 °C, and can be completed in less than 60 minutes.

Abstract translation: 本发明提供一种在从半导体晶片分离之前测试半导体器件（702,704）的方法。 所述方法包括以下步骤：将驻留在半导体晶片上的至少一个半导体器件（702,704）上的多个弹性接触结构（708）直接固定到多个第一端子上，每个所述弹性接触结构 具有尖端并从半导体器件的表面延伸; 将具有多个第二端子（712）的衬底（710）推向半导体器件的表面以实现弹性接触结构的相应的第二端子和尖端之间的多个电连接; 并向衬底的第二端提供信号以锻炼半导体器件。

公开(公告)号：EP0716563A3

公开(公告)日：1997-12-10

申请号：EP95118994.3

申请日：1995-12-01

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kern, Josef

IPC: H05K3/32

CPC classification number: H05K3/326 ,  H05K3/202 ,  H05K3/306 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/0397

Abstract: Zur Kontaktierung von Anschlußdrähten (4, 5) eines Bauelementes (3) in Löchern (6) einer Blech-Platine (1) wird der Lochrand durch ringförmige Einkerbungen (7) nach innen verformt, so daß jeweils eine Quetschverbindung (8) mit dem Anschlußdraht (4, 5) entsteht. Dadurch wird eine form- und kraftschlüssige Verbindung ohne die Anwendung von Löt- und Flußmitteln erreicht.

公开(公告)号：EP0795200A4

公开(公告)日：1997-11-12

申请号：EP95939966

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 弹性接触结构从支撑基板的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑基板的底表面上。 互连元件（110）被用作弹性接触结构并被设置在支撑基板上。 在支撑基板顶上的弹性接触结构中选定的弹性接触结构经由支撑基板连接到支撑基板的底表面上的对应的接触结构。 在旨在接收LGA型半导体封装（304）的实施例中，利用大致垂直于支撑衬底的顶表面的接触力在半导体封装的弹性接触结构和外部连接点之间形成压力接触（ 302）。 在旨在接收BGA型半导体封装（404）的实施例中，利用大致平行于支撑衬底的顶表面的接触力在半导体封装的弹性接触结构和外部连接点之间形成压力接触（ 402）。