公开(公告)号：US20150371968A1

公开(公告)日：2015-12-24

申请号：US14837561

申请日：2015-08-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni ,  Ilyas Mohammed

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/5386 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/525 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to interconnect pads carried on the chips themselves or on a redistribution substrate. The interconnect pads desirably are arranged in a relatively narrow interconnect zone, such that the interconnect pads can be readily wire-bonded or otherwise connected to a package substrate.

Abstract translation: 芯片封装具有多个芯片，可以并排布置或以交错的台阶布置布置。 芯片的触点连接到芯片本身或再分布基板上承载的互连焊盘。 互连焊盘理想地布置在相对窄的互连区域中，使得互连焊盘可以容易地线接合或以其他方式连接到封装衬底。

公开(公告)号：US09167710B2

公开(公告)日：2015-10-20

申请号：US13961344

申请日：2013-08-07

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Belgacem Haba

IPC: H05K7/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H01L25/10

CPC classification number: H01L21/565 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18162 ,  H05K1/185 ,  H05K7/00 ,  Y10T29/49147 ,  H01L2924/00

Abstract: Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly includes a microelectronic element having edge surfaces bounding a front surface and contacts at the front surface; rigid metal posts disposed between at least one edge surface and a corresponding edge of the assembly, each metal post having a sidewall separating first and second end surfaces, the sidewalls have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation contacting at least the edge surfaces and the sidewalls; an insulation layer overlying the encapsulation; connection elements extending through the insulation layer, wherein at least some connection elements have cross sections smaller than those of the metal posts; a redistribution structure deposited on the insulation layer and electrically connecting first terminals with corresponding metal posts through the first connection elements, some metal posts electrically coupled with contacts of microelectronic element.

Abstract translation: 公开了微电子组件及其制造方法。 在一些实施例中，微电子组件包括微电子元件，其具有界定前表面的边缘表面并在前表面处接触; 刚性金属柱设置在组件的至少一个边缘表面和相应边缘之间，每个金属柱具有分隔第一和第二端面的侧壁，所述侧壁具有小于约1微米的均方根（rms）表面粗糙度; 至少所述边缘表面和所述侧壁的封装; 覆盖封装的绝缘层; 连接元件延伸穿过绝缘层，其中至少一些连接元件的横截面小于金属柱的横截面; 沉积在绝缘层上的再分布结构，并且通过第一连接元件将第一端子与相应的金属柱电连接，一些金属柱与微电子元件的触点电耦合。

公开(公告)号：US09111946B2

公开(公告)日：2015-08-18

申请号：US13722340

申请日：2012-12-20

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L21/00 ,  H01L21/56 ,  H01L21/50 ,  H01L21/304 ,  H01L21/78 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L21/56 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/50 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A first area of a first surface of an encapsulated component can be thinned, the component including: a semiconductor chip having an active surface opposite the first surface, and an encapsulant extending outwardly from edges of the semiconductor chip. An entire area of the active surface may be aligned with the first area. After the abrading, a second area of the encapsulated component beyond the first area may have a thickness greater than a thickness of the first area. The second area can be configured to fully support the abraded encapsulated component in a state of the encapsulated component being manipulated by handling equipment.

Abstract translation: 封装部件的第一表面的第一区域可以变薄，所述部件包括：具有与第一表面相对的有效表面的半导体芯片以及从半导体芯片的边缘向外延伸的密封剂。 有源表面的整个区域可以与第一区域对齐。 在研磨之后，超过第一区域的包封组分的第二区域可以具有大于第一区域的厚度的厚度。 第二区域可以被配置为在被处理设备操纵的封装部件的状态下完全支撑磨损的封装部件。

公开(公告)号：US20150044823A1

公开(公告)日：2015-02-12

申请号：US13962332

申请日：2013-08-08

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed

IPC: H01L21/768 ,  H01L21/56

CPC classification number: H01L21/768 ,  H01L21/4853 ,  H01L21/4885 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/78301 ,  H01L2924/19107

Abstract: A method of forming a wire bond having a free end includes joining an end of a metal wire to a conductive element at a surface of a first component, the end of the metal wire being proximate a surface of a bonding tool adjacent an aperture through which the metal wire extends. A predetermined length of the metal wire is drawn out from the aperture. The surface of the bonding tool is used to plastically deform a region of the metal wire between the surface of the bonding tool and a metal element at the surface of the first component. The bonding tool then applies tension to the metal wire to cause a first portion of the metal wire having the end joined to the conductive element to detach from a remaining portion of the metal wire at the plastically deformed region.

Abstract translation: 形成具有自由端的引线接合的方法包括将金属线的端部连接到第一部件的表面处的导电元件，金属线的端部靠近接合工具的邻近孔的表面，通过该接合工具 金属丝延伸。 金属线的预定长度从孔中被拉出。 接合工具的表面用于在接合工具的表面和第一部件的表面处的金属元件之间使金属丝的区域塑性变形。 然后，接合工具向金属线施加张力，使得具有接合到导电元件的端部的金属线的第一部分在塑性变形区域处与金属线的剩余部分分离。

公开(公告)号：US20150041208A1

公开(公告)日：2015-02-12

申请号：US13961217

申请日：2013-08-07

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Ilyas Mohammed ,  Belgacem Haba

IPC: H05K3/42 ,  H05K1/11 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K3/42 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K1/0296 ,  H05K1/11 ,  Y10T29/49204

Abstract: Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements.

Abstract translation: 组合物及其制备方法在本文中公开。 在一个实施例中，形成部件的方法包括在具有第一和第二相对面对的表面的支撑元件的第一表面处形成金属锚定元件，所述支撑元件具有在第一和第二表面之间沿第一方向延伸的厚度，其中 每个锚固元件具有面向下的突出表面; 然后形成具有靠近第一表面的第一端的柱和设置在相应的第一端上方并在第一表面之上的第二端，其中每个柱的横向延伸部分接触相应锚固元件的伸出表面的至少第一区域，以及 从其向下延伸，并且锚固元件的伸出表面抵抗在锚固元件上方的位置处施加到柱的轴向和剪切力。

公开(公告)号：US08883563B1

公开(公告)日：2014-11-11

申请号：US14230521

申请日：2014-03-31

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L21/00 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns. A method may include arranging extremities of first connectors or second connectors in a temporary layer before forming the partial encapsulation.

Abstract translation: 微电子组件或封装可以包括第一和第二支撑元件以及在支撑元件的向内表面之间的微电子元件。 第一连接器和第二连接器，例如焊球，金属柱，螺柱凸起等从相应的支撑元件向内表面并且彼此对齐并且彼此电连接。 第一连接器，第二连接器或两者可以在电耦合相应的第一和第二连接器对的列之前被部分封装。 方法可以包括在形成部分封装之前在临时层中布置第一连接器或第二连接器的末端。

公开(公告)号：US08816383B2

公开(公告)日：2014-08-26

申请号：US13732275

申请日：2012-12-31

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Liang Wang

IPC: H01L29/22 ,  H01L33/00 ,  H01L27/15 ,  H01L29/227 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L33/06 ,  H01L33/42

CPC classification number: H01L33/62 ,  H01L33/06 ,  H01L33/382 ,  H01L33/42 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H01L33/644 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: High performance light emitting diode with vias. In accordance with a first embodiment of the present invention, an article of manufacture includes a light emitting diode. The light emitting diode includes a plurality of filled vias configured to connect a doped region on one side of the light emitting diode to a plurality of contacts on the other side of the light emitting diode. The filled vias may comprise less that 10% of a surface area of the light emitting diode.

Abstract translation: 具有通孔的高性能发光二极管。 根据本发明的第一实施例，制品包括发光二极管。 发光二极管包括多个填充的通孔，其被配置为将发光二极管的一侧上的掺杂区域连接到发光二极管的另一侧上的多个触点。 填充的通孔可以包含少于发光二极管表面积的10％。

公开(公告)号：US20140212996A1

公开(公告)日：2014-07-31

申请号：US14243994

申请日：2014-04-03

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L25/11

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metalized vias and traces formed in contact with the second chip contacts.

Abstract translation: 微电子封装可以包括第一微电子单元，其包括具有第一芯片触点的半导体芯片，与半导体芯片的边缘接触的密封剂以及暴露在密封剂的表面处并与第一芯片触点电连接的第一单元触点。 封装可以包括第二微电子单元，其包括在其表面具有第二芯片触点的半导体芯片，以及与第二单元的芯片的边缘接触并且具有远离边缘延伸的表面的密封剂。 芯片的表面和第二单元的密封剂的表面限定了第二单元的面。 表面处的封装端子可以通过与第一单元触点电连接的接合线与第一单元触点电连接，并且第二芯片通过金属化通孔和与第二芯片触点接触形成的迹线接触。

公开(公告)号：US20140175440A1

公开(公告)日：2014-06-26

申请号：US13725923

申请日：2012-12-21

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Liang Wang

IPC: H01L33/18

CPC classification number: H01L33/0012 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/16 ,  H01L33/18 ,  H01L33/36 ,  H01L33/486 ,  H01L2933/0016 ,  H01L2933/0033 ,  H05B33/14 ,  H05B33/22

Abstract: Non-crystalline inorganic light emitting diode. In accordance with a first embodiment of the present invention, an article of manufacture includes a light emitting diode. The light emitting diode includes a non-crystalline inorganic light emission layer and first and second semiconducting non-crystalline inorganic charge transport layers surrounding the light emission layer. The light emission layer may be amorphous. The charge transport layers may be configured to inject one type of charge carrier and block the other type of charge carrier.

Abstract translation: 非结晶无机发光二极管。 根据本发明的第一实施例，制品包括发光二极管。 发光二极管包括非结晶无机发光层和围绕发光层的第一和第二半导体非结晶无机电荷输送层。 发光层可以是无定形的。 电荷输送层可以被配置为注入一种类型的电荷载体并阻挡另一种类型的电荷载体。

公开(公告)号：US20140141568A1

公开(公告)日：2014-05-22

申请号：US14163145

申请日：2014-01-24

Applicant: Invensas Corporation

Inventor： Kazuo Sakuma ,  Ilyas Mohammed ,  Philip Damberg

IPC: H01L21/56

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/331 ,  H01L2224/33505 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8185 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package can include a substrate having a first surface and a plurality of substrate contacts at the first surface and a microelectronic element having a front surface and contacts arranged within a contact-bearing region of the front surface. The contacts of the microelectronic element can face the substrate contacts and can be joined thereto. An underfill can be disposed between the substrate first surface and the contact-bearing region of the front surface of the microelectronic element. The underfill can reinforce the joints between the contacts and the substrate contacts. A joining material can bond the substrate first surface with the front surface of the microelectronic element. The joining material can have a Young's modulus less than 75% of a Young's modulus of the underfill.

Abstract translation: 微电子封装可以包括在第一表面具有第一表面和多个基板触点的基板和具有前表面的微电子元件和布置在前表面的接触区域内的触点。 微电子元件的触点可以面对基板触点并且可以与其接合。 可以在基板第一表面和微电子元件的前表面的接触区域之间设置底部填充物。 底部填充物可以加强触点和基板触点之间的接合。 接合材料可以将基板第一表面与微电子元件的前表面接合。 接合材料的杨氏模量可以小于底部填充物的杨氏模量的75％。