公开(公告)号：US20170103852A1

公开(公告)日：2017-04-13

申请号：US15286122

申请日：2016-10-05

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Masahiro MORI ,  Sunao MASUDA ,  Kayou KUSANO

IPC: H01G4/002 ,  H01G4/242 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/002 ,  H01C7/02 ,  H01C7/13 ,  H01G2/06 ,  H01G2/14 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/232 ,  H01G4/242 ,  H01G4/30 ,  H01G4/40 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2045

Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

公开(公告)号：US09564698B2

公开(公告)日：2017-02-07

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H05K7/12 ,  H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

公开(公告)号：US09508639B2

公开(公告)日：2016-11-29

申请号：US14819755

申请日：2015-08-06

Applicant: ROHM CO., LTD.

Inventor： Hirotoshi Usui

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L23/36 ,  H05K1/18 ,  H01L23/00 ,  H01L23/467

CPC classification number: H01L23/49861 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/467 ,  H01L23/49555 ,  H01L23/498 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10469 ,  H05K2201/10757 ,  H05K2201/10795 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract translation: 封装在衬底中的衬底包括具有能够接触外部的表面的裸露焊盘; 布置在与所述裸露焊盘的表面相对的表面上的半导体芯片; 用于模制半导体芯片的模塑树脂; 以及从模制树脂的侧表面延伸并具有加工形状的前端部的引线框架。 引线框架的前端部被切割成具有相对于封装的顶表面由引线框架的延伸的直线形成的锐角的切割角。

公开(公告)号：US20160262268A1

公开(公告)日：2016-09-08

申请号：US14639789

申请日：2015-03-05

Applicant: Invensas Corporation

Inventor： Reynaldo CO ,  Grant VILLAVICENCIO ,  Wael ZOHNI

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14

CPC classification number: H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Abstract translation: 在形成微电子器件的方法中，将基底装载到模压机中。 基板具有第一表面和第二表面。 第二表面放置在模压机的内下表面上。 衬底具有从第一表面延伸到模压机的内部上表面的多个引线接合线。 模具膜的上表面被分配到模压机的内部上表面。 模具薄膜的下表面被多根线接合线的尖端刺穿，使得多个线接合线的顶端在模具薄膜的下表面上延伸到模制薄膜中。 多个线接合线的尖端朝向模制薄膜的下表面压下以使尖端弯曲。

公开(公告)号：US20160118190A1

公开(公告)日：2016-04-28

申请号：US14667575

申请日：2015-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Seok Kyoon WOO ,  Kyoung Jin JUN ,  So Yeon SONG ,  Soon Ju LEE

IPC: H01G4/30 ,  H05K1/11 ,  H01G4/012 ,  H05K1/18 ,  H01G4/224 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having “⊂” and “⊃” shapes, and disposed on the mounting surface of the MLCC in a facing manner.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括：多层陶瓷电容器（MLCC），其包括在其安装表面上彼此间隔开设置的第一和第二外部电极; 以及第一和第二端子电极，其包括设置在第一和第二外部电极的下表面上的上部水平部分，下部水平部分设置成与上部水平部分向下间隔开，并且弯曲的垂直部分连接上部水平部分的一端和 下水平部分的一端具有“⊂”和“⊃”形状，并以面对的方式设置在MLCC的安装表面上。

公开(公告)号：US09293400B2

公开(公告)日：2016-03-22

申请号：US14590021

申请日：2015-01-06

Applicant: Infineon Technologies AG

Inventor： Sergey Ananiev

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H05K3/34

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.

公开(公告)号：US08902603B2

公开(公告)日：2014-12-02

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US08477005B2

公开(公告)日：2013-07-02

申请号：US13286220

申请日：2011-11-01

Applicant: Hsiang-Yi Tseng ,  Ching-Hsiang Tien ,  Yi-Lin Chen ,  Hsin-Wei Tsai ,  Chun-Song Ming

Inventor： Hsiang-Yi Tseng ,  Ching-Hsiang Tien ,  Yi-Lin Chen ,  Hsin-Wei Tsai ,  Chun-Song Ming

IPC: H01F27/29 ,  H01F27/06 ,  H01F27/30

CPC classification number: H05K1/182 ,  H01F27/292 ,  H01F2027/2819 ,  H05K3/306 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10424 ,  H05K2201/10757 ,  H05K2201/2036

Abstract: A transformer capable of maintaining its height is provided. The transformer is formed on a circuit board having a receiving hole. The transformer comprises a winding module, two magnetic core modules contacting and holding the winding module, a plurality of pins and at least one supporting means. The winding module comprises a winding baseboard and a winding pillar where a winding structure is formed thereon. The winding pillar is received in the receiving hole. Each of the pins comprises a first bent part separating the corresponding pin into a first portion connected to the winding baseboard and a second portion connected to the circuit board around the receiving hole. The supporting means is formed between the first portion of at least one of the pins and the circuit board to contact the first portion and the circuit board to maintain the distance between them.

Abstract translation: 提供能够保持其高度的变压器。 变压器形成在具有接收孔的电路板上。 该变压器包括一个绕组模块，两个磁芯模块，其接触和保持绕组模块，多个销和至少一个支撑装置。 绕组模块包括绕组基板和在其上形成绕组结构的绕组柱。 卷绕柱被容纳在接收孔中。 每个销包括将相应的销分成连接到绕组基板的第一部分的第一弯曲部分和连接到接收孔周围的电路板的第二部分。 支撑装置形成在至少一个销和电路板的第一部分之间以接触第一部分和电路板以保持它们之间的距离。

公开(公告)号：US08451617B2

公开(公告)日：2013-05-28

申请号：US12847276

申请日：2010-07-30

Applicant: Chun-Kong Chan ,  Chi Ching Chen

Inventor： Chun-Kong Chan ,  Chi Ching Chen

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/18 ,  H05K1/0231 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10757 ,  H05K2201/2018

Abstract: An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.

Abstract translation: 集成电路板包括桥接滤波电容器，旁路电容器，热敏电阻器和变阻器。 集成电路板还包括具有彼此平行并相邻布置的多个电解电容器的电解电容器组和用于分组电解电容器的安装框架。 本发明使用上述元件来减小垂直高度，水平宽度和占用面积。 因此，可以减小电路板的整体尺寸，使电子装置更小，特别是对于液晶电视和屏幕等薄型电子设备。

公开(公告)号：US08373428B2

公开(公告)日：2013-02-12

申请号：US12535070

申请日：2009-08-04

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: G01R31/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器被堆叠，使得可以调节空间变换器的取向，从而可以调节探针元件的尖端的取向而不改变探针卡的取向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。