公开(公告)号：US09269836B2

公开(公告)日：2016-02-23

申请号：US14531330

申请日：2014-11-03

Applicant: Heraeus Noblelight GmbH

Inventor： Michael Peil ,  Florin Oswald ,  Harald Maiweg

IPC: H01L31/0203 ,  H01L33/54 ,  F21K99/00 ,  H01L21/56 ,  H01L23/31 ,  H05K3/28 ,  H01L25/13 ,  H01L31/0232 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  F21Y101/02 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L31/0203 ,  F21K9/00 ,  F21K9/90 ,  F21Y2115/10 ,  H01L21/56 ,  H01L23/3121 ,  H01L25/0753 ,  H01L25/13 ,  H01L31/02322 ,  H01L31/02325 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2933/005 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.

Abstract translation: 提出了一种用于涂覆光电芯片组件模块的方法，该模块包括平坦衬底，所述平坦衬底填充有一个或多个具有至少一个主要光学布置和可选择的至少一个次级光学布置的光电子部件。 通过以下步骤，将由硅树脂制成的透明耐紫外线和耐温涂层涂覆在光电芯片模块上：（a）将液体硅胶浇铸到朝向顶部打开的模具中，并具有相应的外部尺寸 达到或超过衬底的外部尺寸; （b）将基板插入模具中，其中光电子部件完全浸入硅树脂中，并且基板的表面完全接触硅树脂或基板至少部分地以完全表面接触的方式浸入硅树脂中; （c）固化和交联硅氧烷与光电子部件和基底; 和（d）用固化的硅氧烷涂层从模具中除去基材。

公开(公告)号：US09252341B2

公开(公告)日：2016-02-02

申请号：US14617067

申请日：2015-02-09

Applicant: Heraeus Noblelight GmbH

Inventor： Michael Peil ,  Florin Oswald ,  Harald Maiweg

IPC: H01L33/54 ,  H01L31/0203 ,  H01L21/56 ,  H01L23/24 ,  H01L23/31 ,  H01L33/56 ,  H05K3/28 ,  H01L31/0232 ,  H01L27/144 ,  H01L27/15 ,  F21K99/00 ,  F21Y101/02 ,  H05K1/02

CPC classification number: H01L33/54 ,  F21K9/90 ,  F21Y2115/10 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3121 ,  H01L27/1446 ,  H01L27/15 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H05K1/0274 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/0175 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0126 ,  H01L2924/00

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract translation: 提供了一种用于涂覆光电芯片模块的方法，其包括具有一个或多个光电子部件的平坦基板，其具有由一个或多个硅氧烷构成的透明的耐紫外线和耐温涂层。 还提供了相应的光电芯片模块和具有多个光电芯片模块的系统。 该方法包括以下步骤：a）将待涂覆的基材预热至第一温度; b）在预热的基底上施加包围待涂覆的基底的表面积或部分区域的坝，所述坝由在第一温度下固化的第一可热固化的高反应性硅树脂制成; c）用液体第二硅胶填充由大坝封闭的基板的表面积或部分区域; 和d）固化第二硅氧烷。

公开(公告)号：US09224684B2

公开(公告)日：2015-12-29

申请号：US14167280

申请日：2014-01-29

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuyuki Kubota ,  Tomoharu Fujii

IPC: H05K1/16 ,  H01L23/50 ,  H05K1/02 ,  H05K3/46 ,  H01L23/58 ,  H01L25/10 ,  H05K1/18 ,  H05K3/10 ,  H05K3/42

CPC classification number: H01L23/50 ,  H01L23/58 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2924/15321 ,  H05K1/0271 ,  H05K1/16 ,  H05K1/185 ,  H05K3/108 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0218 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2203/1461 ,  H05K2203/1469

Abstract: There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.

Abstract translation: 提供了一个接线板。 布线板包括：第一绝缘层; 在所述第一绝缘层的一个表面上的二次电池; 形成在二次电池上的第二绝缘层; 覆盖所述第二绝缘层的第三绝缘层; 在所述第三绝缘层的一个表面上的第一布线层; 以及将第一布线层电连接到二次电池的电极的通孔。 第二绝缘层的刚性低于第一绝缘层和第三绝缘层的刚性。

公开(公告)号：US20150250051A1

公开(公告)日：2015-09-03

申请号：US14627099

申请日：2015-02-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hideki YUMOTO ,  Yoichi HARAYAMA

IPC: H05K1/03 ,  H05K1/11

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3489 ,  H05K2201/0162 ,  H05K2203/041 ,  H05K2203/1173 ,  H01L2924/00

Abstract: A wiring substrate includes an insulating layer and a pad exposed from the insulating layer. An outermost surface of the insulating layer is modified to have a hydrophobic property by being stamped with silicone.

Abstract translation: 布线基板包括绝缘层和从绝缘层暴露的焊盘。 绝缘层的最外表面通过用硅树脂冲压而被改性为具有疏水性。

公开(公告)号：US20150248949A1

公开(公告)日：2015-09-03

申请号：US14438345

申请日：2013-10-25

Applicant: ISIS INNOVATION LIMITED

Inventor： John Hagan Pryce Bayley ,  Kunwar Tanuj Sapra

IPC: H01B7/00 ,  H01B3/00 ,  H05K1/03 ,  H01B1/06 ,  B32B17/06 ,  B32B9/00

CPC classification number: H01B7/0027 ,  B32B9/00 ,  B32B17/06 ,  B32B2457/00 ,  C08J3/075 ,  C08J2305/12 ,  C12M1/34 ,  C12M1/3407 ,  C12M25/14 ,  G01N27/416 ,  G01N33/6872 ,  H01B1/06 ,  H01B3/00 ,  H01H1/0036 ,  H01H1/021 ,  H01L51/00 ,  H05K1/0306 ,  H05K1/0326 ,  H05K2201/0162 ,  Y10T156/10 ,  Y10T428/26 ,  Y10T428/31971

Abstract: The invention provides a hydrogel network comprising a plurality of hydrogel objects, wherein each of said hydrogel objects comprises: a hydrogel body, and an outer layer of amphipathic molecules, on at least part of the surface of the hydrogel body, wherein each of said hydrogel objects contacts another of said hydrogel objects to form an interface between the contacting hydrogel objects. A process for producing the hydrogel networks is also provided. The invention also provides an electrochemical circuit and hydrogel component for mechanical devices comprising a hydrogel network. Various uses of the hydrogel network are also described, including their use in synthetic biology and as components in electrochemical circuits and mechanical devices.

Abstract translation: 本发明提供一种水凝胶网络，其包括多个水凝胶体，其中每个所述水凝胶体包含：在水凝胶体的至少部分表面上的水凝胶体和两亲性分子的外层，其中每个所述水凝胶 物体接触另一个所述水凝胶物体以在接触的水凝胶物体之间形成界面。 还提供了一种生产水凝胶网络的方法。 本发明还提供了一种用于包括水凝胶网络的机械装置的电化学电路和水凝胶组分。 还描述了水凝胶网络的各种用途，包括其在合成生物学中的应用以及作为电化学电路和机械装置中的组分。

公开(公告)号：US09039427B2

公开(公告)日：2015-05-26

申请号：US13767009

申请日：2013-02-14

Applicant: Texas Instruments Incorporated

Inventor： Allan Jerome Daen Rapales ,  Floro Lopez Camenforte, III ,  John Paul Quianzon Kwo

IPC: H01R12/00 ,  H01G2/06 ,  H01G4/232 ,  H05K1/18 ,  H01G4/30

CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/046 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/43 ,  Y10T29/49135

Abstract: An interdigitated chip capacitor (“IDC”) assembly including an IDC having a semiconductor block with a top portion, a bottom portion opposite the top portion, a plurality of sidewall portions extending between the top and bottom portions, and a plurality of terminals located on the sidewall portions; and a substrate having a top portion with a plurality of generally flat, vertically extending, nonconductive abutment surfaces thereon, the sidewall portions of the IDC being abuttingly engaged with at least some of the plurality of abutment surfaces.

Abstract translation: 一种交错式片状电容器（“IDC”）组件，包括具有顶部的半导体块的IDC，与顶部相对的底部，在顶部和底部之间延伸的多个侧壁部分，以及位于 侧壁部分; 以及具有在其上具有多个大致平坦的，垂直延伸的非导电邻接表面的顶部的基底，所述IDC的侧壁部分与多个邻接表面中的至少一些邻接地接合。

公开(公告)号：US20150131238A1

公开(公告)日：2015-05-14

申请号：US14283953

申请日：2014-05-21

Applicant: Samsung Display Co., Ltd.

Inventor： Ja Eun LEE

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/028 ,  G09G3/001 ,  G09G2380/02 ,  H05K1/0262 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/057 ,  H05K2201/10128

Abstract: A flexible display device includes: a flexible display panel configured to display an image; a dielectric elastomer film disposed on a portion of the flexible display panel; a first electrode layer disposed on an upper portion of the dielectric elastomer film; and a second electrode layer disposed on a lower portion of the dielectric elastomer film, the first electrode layer includes a plurality of first electrodes, each of the plurality of first electrodes disposed apart from each other, the second electrode layer includes a plurality of second electrodes, each of the plurality of second electrodes disposed apart from each other.

Abstract translation: 柔性显示装置包括：被配置为显示图像的柔性显示面板; 布置在所述柔性显示面板的一部分上的介电弹性体膜; 设置在介电弹性体膜的上部的第一电极层; 所述第一电极层包括多个第一电极，所述多个第一电极中的每一个彼此分开设置，所述第二电极层包括多个第二电极，所述第二电极层包括多个第一电极， 所述多个第二电极中的每一个彼此分开设置。

公开(公告)号：US20150116234A1

公开(公告)日：2015-04-30

申请号：US14389073

申请日：2013-03-28

Applicant: DNP FINE CHEMICALS CO., LTD.

Inventor： Shintaro Nasu ,  Satoshi Shioda ,  Hiroshi Takeichi

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/03 ,  C08L83/04

CPC classification number: G06F3/041 ,  C08F230/08 ,  C08F283/12 ,  C08K5/34924 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0757 ,  H05K1/0274 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/287 ,  H05K2201/0108 ,  H05K2201/0162 ,  C08L83/04

Abstract: The present invention has a main purpose of providing a resin composition capable of forming a resin film excellent in hardness and heat resistance. To achieve the purpose described above, the present invention provides a resin composition, comprising: a developable polysiloxane containing a developable group and substantially no radically polymerizable group; a polymerizable polysiloxane containing a radically polymerizable group and substantially no developable group; and a polyfunctional monomer.

Abstract translation: 本发明的主要目的是提供能够形成硬度和耐热性优异的树脂膜的树脂组合物。 为了实现上述目的，本发明提供一种树脂组合物，其包含：显影性聚硅氧烷，其含有可显影基团且基本上不具有自由基聚合性基团; 含有自由基聚合性基团且基本上不显影性基团的聚合性聚硅氧烷; 和多官能单体。

公开(公告)号：US09012587B2

公开(公告)日：2015-04-21

申请号：US13861452

申请日：2013-04-12

Applicant: International Business Machines Corporation

Inventor： Robert David Allen ,  Phillip Joe Brock ,  Blake W. Davis ,  Qinghuang Lin ,  Robert Dennis Miller ,  Alshakim Nelson ,  Ratnam Sooriyakumaran

IPC: C08G77/20 ,  H01B3/30 ,  C09D183/04 ,  C09D183/14 ,  H01L21/02 ,  H01L21/312 ,  H01L21/768

CPC classification number: H05K1/0326 ,  C09D183/04 ,  C09D183/14 ,  H01B3/307 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/3122 ,  H01L21/76802 ,  H01L21/76808 ,  H01L21/76814 ,  H05K2201/0162

Abstract: Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers.

Abstract translation: 倍半硅氧烷聚合物，负色调可光图案化电介质配方中的倍半硅氧烷聚合物，使用含有倍半硅氧烷聚合物的负色调可光阴电介质配方形成结构的方法，以及由倍半硅氧烷聚合物制成的结构。

公开(公告)号：US20150047883A1

公开(公告)日：2015-02-19

申请号：US14381693

申请日：2013-02-28

Applicant: Cima Nano Tech Israel Ltd.

Inventor： Eyal Shapira ,  Dov Zamir

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H01B13/00

CPC classification number: H05K1/0274 ,  H01B13/0026 ,  H05K1/0213 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/0257

Abstract: A transparent, conductive article that includes a network of electrically conductive metal traces defining cells that are transparent to light on a self-supporting, elastomeric substrate, as well as a process for forming the article.

Abstract translation: 一种透明导电制品，其包括限定在自支撑弹性体基底上对光透明的细胞的导电金属迹线网络，以及用于形成制品的方法。