公开(公告)号：US07737513B2

公开(公告)日：2010-06-15

申请号：US11809213

申请日：2007-05-30

申请人： Belgacem Haba ,  Charles White ,  Michael J. Nystrom

发明人： Belgacem Haba ,  Charles White ,  Michael J. Nystrom

IPC分类号： H01L29/84 ,  H01L21/58

CPC分类号： H01L21/50 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/81 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides an integrated circuit chip assembly and a method of manufacturing the same. The assembly includes a package element having a top surface and an integrated circuit chip having a top surface, a bottom surface, edge surface between the top and bottom surfaces, and contacts exposed at the top surface. The package element is disposed below the chip with the top surface of the package element facing toward the bottom surface of the chip. At least one spacer element resides between the top surface of the package element and the bottom surface of the chip. According to one embodiment, the at least one spacer element may form a substantially closed cavity between the package element and the integrated circuit chip. According to another embodiment, first conductive features may extend from the contacts of the chip along the top surface, and at least some of said first conductive features extend along at least one of the edge surfaces of the chip.

摘要翻译： 本发明提供一种集成电路芯片组件及其制造方法。 组件包括具有顶表面的封装元件和集成电路芯片，其具有顶表面，底表面，顶表面和底表面之间的边缘表面以及暴露在顶表面处的触点。 封装元件设置在芯片的下方，封装元件的顶表面朝向芯片的底表面。 至少一个间隔元件位于封装元件的顶表面和芯片的底表面之间。 根据一个实施例，所述至少一个间隔元件可以在封装元件和集成电路芯片之间形成基本封闭的空腔。 根据另一个实施例，第一导电特征可以沿着顶表面从芯片的触点延伸，并且至少一些所述第一导电特征沿芯片的至少一个边缘表面延伸。

公开(公告)号：US07732912B2

公开(公告)日：2010-06-08

申请号：US11502941

申请日：2006-08-11

申请人： Philip Damberg

发明人： Philip Damberg

IPC分类号： H01L23/04

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic element package has one or more individual carrier units overlying a region or regions of the front or rear surface of the microelectronic element, leaving other regions of the microelectronic element surface uncovered. The carrier units can be made economically using only a small area of a dielectric film or other circuit panel material.

摘要翻译： 微电子元件封装具有覆盖微电子元件的前表面或后表面的区域或区域的一个或多个单独的载体单元，使得微电子元件表面的其它区域未被覆盖。 载体单元可以仅使用小面积的电介质膜或其他电路板材料经济地制成。

公开(公告)号：US20100116460A1

公开(公告)日：2010-05-13

申请号：US12615905

申请日：2009-11-10

申请人： Nels Jewell-Larsen ,  Kenneth A. Honer ,  Matt Schwiebert ,  Hongyu Ran ,  Piyush Savalia ,  Yan Zhang

发明人： Nels Jewell-Larsen ,  Kenneth A. Honer ,  Matt Schwiebert ,  Hongyu Ran ,  Piyush Savalia ,  Yan Zhang

IPC分类号： F24H9/02 ,  H02K44/02 ,  F28D15/00

CPC分类号： H02N11/006 ,  F04B19/006 ,  F28F2250/08 ,  G06F1/203

摘要： In thermal management systems that employ EHD devices to motivate flow of air through an enclosure, spatial distribution of a ventilation boundary may facilitate reductions in flow resistance by reducing average transit distance for cooling air from an inlet portion of the ventilation boundary to an outlet portion. Some thermal management systems described herein distribute a ventilation boundary over opposing surfaces, adjacent surfaces or even a single surface of an enclosure while providing a short, “U” shaped, “L” shaped or generally straight through flow path. In some cases, spatial distributions of the ventilation boundary facilitate or enable enclosure geometries for which conventional fan or blower ventilation would be impractical. In some cases, provision of multiple portions of the ventilation boundary may allow the thermal management system to tolerate blockage or occlusion of a subset of the inlet and/or outlet portions and, when at least some of such portions are non-contiguous spatially-distributed, tolerance to a single cause of blockage or occlusion is enhanced.

摘要翻译： 在采用EHD装置来激励空气流过外壳的热管理系统中，通风边界的空间分布可以通过减少从通风边界的入口部分到出口部分的冷却空气的平均运输距离来促进流动阻力的降低。 本文所述的一些热管理系统在相对表面，相邻表面或甚至单个外壳的表面上分配通气边界，同时提供短的“U”形“L”形或大致直的流动路径。 在某些情况下，通风边界的空间分布有助于或实现常规风扇或鼓风机通风不切实际的外壳几何形状。 在一些情况下，提供通风边界的多个部分可以允许热管理系统容忍入口和/或出口部分的子集的阻塞或闭塞，并且当这些部分中的至少一些是不连续的空间分布 对单一阻塞或闭塞原因的耐受性得到提高。

公开(公告)号：US07696439B2

公开(公告)日：2010-04-13

申请号：US11801336

申请日：2007-05-09

申请人： David Light

发明人： David Light

IPC分类号： H01B7/18 ,  H05K1/00

CPC分类号： H05K3/062 ,  H05K3/202 ,  H05K2201/0361 ,  H05K2203/0384 ,  Y10T29/49224

摘要： A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl3), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.

摘要翻译： 根据本发明的一个方面提供了层状金属结构。 该结构可以用于例如制造导电互连一个或多个微电子元件的导电互连元件。 层状结构包括例如可以包括铜或铝中的一种或多种的第一和第二金属层。 中间层可以包括例如在第一和第二金属层之间的铬，铬耐腐蚀剂可以选择性地将第一和第二金属层图案化成中间层。 在这种情况下，可以使用诸如氯化铜，氯化铁（FeCl 3），过氧化硫组合物或过硫酸盐组合物的蚀刻剂来图案化第一和第二金属层。

公开(公告)号：US20100013108A1

公开(公告)日：2010-01-21

申请号：US12551807

申请日：2009-09-01

申请人： David Gibson ,  Andy Stavros

发明人： David Gibson ,  Andy Stavros

IPC分类号： H01L23/50

CPC分类号： H01L25/10 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1437 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10515 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

摘要翻译： 微电子组件包括彼此叠置以形成具有垂直方向的至少一个堆叠的单元。 每个单元包括一个或多个微电子器件，并且具有顶表面和底表面。 顶部单元端子在顶部表面露出，底部单元端子暴露在底部表面。 顶部和底部单元端子设置在一组有序列位置。 除了在最高有序列位置的顶部单元端子之外，组件的每个顶部单元端子在下一个更高排序的列位置处连接到同一单元的相应底部单元端子。 除了堆叠中最低单元的底部单元端子之外，组件的每个底部单元端子连接到堆叠中的下一个下部单元的相应上部单元端子处于相同的列位置。

公开(公告)号：US20100009554A1

公开(公告)日：2010-01-14

申请号：US12459864

申请日：2009-07-08

申请人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

发明人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

IPC分类号： H01R12/00 ,  H01B13/00

CPC分类号： B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

摘要翻译： 微电子互连元件可以包括与第一金属线交错的多个第一金属线和多个第二金属线。 第一和第二金属线中的每一个具有在相同参考平面内延伸的表面。 第一金属线具有高于参考平面并远离其的表面，并且第二金属线具有低于参考平面并远离其的表面。 电介质层可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：US07554206B2

公开(公告)日：2009-06-30

申请号：US11607372

申请日：2006-12-01

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

摘要翻译： 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖所述微电子元件的第一面的柔性基板以及从所述柔性基板延伸并远离所述第一面突出的多个导电柱 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US20090146303A1

公开(公告)日：2009-06-11

申请号：US12286102

申请日：2008-09-26

申请人： Jinsu Kwon

发明人： Jinsu Kwon

IPC分类号： H01L23/488 ,  H01L21/50

CPC分类号： H01L24/14 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3178 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1147 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1412 ,  H01L2224/16 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81894 ,  H01L2224/831 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/2064 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A packaged microelectronic assembly includes a microelectronic element having a front surface and a plurality of first solid metal posts extending away from the front surface. Each of the first posts has a width in a direction of the front surface and a height extending from the front surface, wherein the height is at least half of the width. There is also a substrate having a top surface and a plurality of second solid metal posts extending from the top surface and joined to the first solid metal posts.

摘要翻译： 封装的微电子组件包括具有前表面的微电子元件和远离前表面延伸的多个第一固体金属柱。 每个第一柱具有在前表面的方向上的宽度和从前表面延伸的高度，其中高度至少为宽度的一半。 还有一种具有顶表面的基底和从顶表面延伸并连接到第一固体金属柱的多个第二固体金属柱。

公开(公告)号：US07528008B2

公开(公告)日：2009-05-05

申请号：US11602034

申请日：2006-11-20

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

摘要： A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

公开(公告)号：US20090065907A1

公开(公告)日：2009-03-12

申请号：US12221204

申请日：2008-07-31

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/538 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

摘要翻译： 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸通过半导体元件401并通过触点403的通孔410.电介质层411可以使通孔410线化。导电层412可覆盖通孔内的电介质层411 导电层412可以将触点403与单元触点导电地互连。