Ultra-thin near-hermetic package based on rainier
    7.
    发明申请
    Ultra-thin near-hermetic package based on rainier 有权
    超薄的近密封包装,基于更加细腻

    公开(公告)号:US20080277775A1

    公开(公告)日:2008-11-13

    申请号:US11803006

    申请日:2007-05-11

    摘要: A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.

    摘要翻译: 一种微电子封装,包括具有顶表面和底表面的电介质层,所述电介质层具有在底表面处露出的端子; 金属壁结合到电介质层并从电介质层的顶表面向上突出并围绕顶表面的区域; 金属盖结合到壁上并在顶表面的区域上延伸,使得盖,壁和介电层协作地限定封闭空间; 以及设置在所述空间内并电连接到所述端子的微电子元件。

    Micro pin grid array with pin motion isolation
    9.
    发明申请
    Micro pin grid array with pin motion isolation 失效
    微针栅格阵列,具有引脚运动隔离

    公开(公告)号:US20050173805A1

    公开(公告)日:2005-08-11

    申请号:US10985119

    申请日:2004-11-10

    摘要: A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

    摘要翻译: 微电子封装包括具有面和触点的微电子元件,覆盖并与微电子元件的第一面间隔开的柔性基板,以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连,并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中,封装包括设置在微电子元件的第一面和柔性基板之间的支撑层,例如顺应层。 在其他实施例中,支撑层包括至少一个与导电端子之一至少部分对准的开口。