公开(公告)号：US09743522B2

公开(公告)日：2017-08-22

申请号：US13627989

申请日：2012-09-26

Applicant: Apple Inc.

Inventor： Xingqun Li ,  Carlos Ribas ,  Dennis R. Pyper ,  James H. Foster ,  Joseph R. Fisher, Jr. ,  Scott P. Mullins ,  Sean A. Mayo ,  Wyeman Chen

IPC: H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/181 ,  H01L2224/16235 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4614 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  Y10T29/49146

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

公开(公告)号：US20150359099A1

公开(公告)日：2015-12-10

申请号：US14296449

申请日：2014-06-04

Applicant: Apple Inc.

Inventor： Shankar Pennathur ,  Dennis R. Pyper ,  Amir Salehi

IPC: H05K1/18 ,  H05K3/36 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在电子设备中的系统级封装模块和其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚以在模块和其它部件之间形成互连路径。

公开(公告)号：US10455738B2

公开(公告)日：2019-10-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  Vu Thanh Vo ,  Amir Salehi ,  Dennis R. Pyper ,  Alex J. Crumlin ,  Corey S. Provencher ,  Derek J. Walters ,  Michael V. Yeh

IPC: H05K5/02 ,  H04B1/03 ,  H05K7/20 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H05K9/00 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：US20180310407A1

公开(公告)日：2018-10-25

申请号：US16016610

申请日：2018-06-24

Applicant: Apple Inc.

Inventor： Dennis R. Pyper ,  Venkataram R. Raju ,  Yazan Z. Alnahhas

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/144 ,  H05K1/183 ,  H05K3/368 ,  H05K2201/10416

Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

公开(公告)号：US20170164084A1

公开(公告)日：2017-06-08

申请号：US15151445

申请日：2016-05-10

Applicant: Apple Inc.

Inventor： Nikolas T. Vitt ,  Neal D. Evans ,  Jesse A. Lippert ,  Ruchir M. Dave ,  Christopher Wilk ,  Brad G. Boozer ,  Dennis R. Pyper ,  Daniel K. Boothe

IPC: H04R1/08 ,  H04R1/22

CPC classification number: H04R1/086 ,  H04R1/08 ,  H04R1/222 ,  H04R2499/11

Abstract: An electronic device having a microphone behind a water resistant, air-impermeable membrane is disclosed. Embodiments include a trapped volume of air between the membrane and the microphone. A barometric equalization element may define an acoustic leak path, e.g., a tortuous leak path, between the trapped volume of air and an encased space within a casing of the electronic device. Other embodiments are also described and claimed.

公开(公告)号：US20160270213A1

公开(公告)日：2016-09-15

申请号：US15041033

申请日：2016-02-11

Applicant: APPLE INC.

Inventor： Amir Salehi ,  Vu T. Vo ,  Wyeman Chen ,  Chang Liu ,  Dennis R. Pyper ,  Steven Patrick Cardinali ,  Lan Hoang ,  Siddharth Nangia ,  Meng Chi Lee ,  Takayoshi Katahira

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/284 ,  B33Y80/00 ,  H05K1/0224 ,  H05K2201/0141 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2201/10969 ,  H05K2201/2036

Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Abstract translation: 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。

公开(公告)号：US09226435B2

公开(公告)日：2015-12-29

申请号：US14171623

申请日：2014-02-03

Applicant: Apple Inc.

Inventor： Joseph Fisher, Jr. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

IPC: H05K5/00 ,  H05K9/00 ,  H05K3/28 ,  H01L23/552

CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/15192 ,  H05K3/284 ,  H05K9/0092 ,  H05K2201/0715 ,  H05K2201/09509 ,  H01L2924/00

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰，可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

公开(公告)号：US08809859B2

公开(公告)日：2014-08-19

申请号：US14162577

申请日：2014-01-23

Applicant: Apple Inc.

Inventor： Shawn X. Arnold ,  Dennis R. Pyper

IPC: H01L23/58 ,  H01L27/15 ,  H01L23/04 ,  H01L21/00 ,  H05K1/00 ,  H01L23/48 ,  H01L29/84 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L22/10 ,  H01L23/48 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/58 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/82 ,  H01L29/84 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2224/82138 ,  H05K1/00 ,  H05K1/0268 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/10674 ,  H05K2203/063

Abstract: Methods and devices for embedding semiconductors in printed circuit boards (PCBs) are provided. In one example, a method of manufacturing a PCB having a die assembly embedded therein includes removing a release film from an adhesive layer of the die assembly. The method also includes disposing the die assembly on a first layer of the PCB such that the adhesive layer contacts the first layer of the PCB. The method includes disposing a second layer of the PCB over the first layer such that the die assembly is within an intermediate portion between the first layer and the second layer. The method also includes filling the intermediate portion with resin and subjecting the PCB to a press cycle to cure the resin.

Abstract translation: 提供了在印刷电路板（PCB）中嵌入半导体的方法和装置。 在一个示例中，制造具有嵌入其中的模具组件的PCB的方法包括从模具组件的粘合剂层去除脱模膜。 该方法还包括将模具组件设置在PCB的第一层上，使得粘合剂层接触PCB的第一层。 该方法包括在第一层上布置PCB的第二层，使得模具组件位于第一层和第二层之间的中间部分内。 该方法还包括用树脂填充中间部分，并对PCB进行加压循环以固化树脂。

公开(公告)号：US20130114228A1

公开(公告)日：2013-05-09

申请号：US13631156

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Nicholas G. Merz ,  Hong Wang ,  Michael M. Nikkhoo ,  Dennis R. Pyper ,  Christopher Matthew Werner

IPC: H05K9/00 ,  H05K3/30 ,  H05K7/06

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。

公开(公告)号：US12040262B2

公开(公告)日：2024-07-16

申请号：US17381931

申请日：2021-07-21

Applicant: Apple Inc.

Inventor： Dennis R. Pyper ,  Leilei Zhang ,  Lan H. Hoang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/58 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49822 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49894 ,  H01L23/58 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4985 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.