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    System for encapsulating microelectronic devices
    11.
    发明授权
    System for encapsulating microelectronic devices 失效
    用于封装微电子器件的系统

    公开(公告)号：US5932254A

    公开(公告)日：1999-08-03

    申请号：US12079

    申请日：1998-01-22

    申请人： Craig Mitchell ,  Thomas H. Distefano

    发明人： Craig Mitchell ,  Thomas H. Distefano

    IPC分类号： H01L21/56 ,  B29C45/14

    CPC分类号： H01L21/565 ,  H01L2924/0002

    摘要： A fixture for encapsulating microelectronic devices includes a structure defining a device-receiving pocket and a well communicating with the pocket so that the passage and well define an interior space whereby the pocket is disposed above the well when the structure is in a first orientation and the well is disposed above the pocket when the structure is in a second orientation. The fixture also includes an element for sealing the interior space and a port for connecting the sealed interior space to an evacuation device.

    摘要翻译： 用于封装微电子器件的固定器包括限定器件接收凹部和与凹穴连通的阱的结构，使得通道和阱限定内部空间，由此当结构处于第一取向时口袋设置在阱上方，并且 当结构处于第二方向时，井被设置在口袋上方。 固定装置还包括用于密封内部空间的元件和用于将密封的内部空间连接到排气装置的端口。

    Encapsulant for microelectronic devices
    16.
    发明授权
    Encapsulant for microelectronic devices 失效
    微电子器件用密封剂

    公开(公告)号：US06255738B1

    公开(公告)日：2001-07-03

    申请号：US08940477

    申请日：1997-09-30

    申请人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

    发明人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

    IPC分类号： H01L2329

    CPC分类号： H01L23/4985 ,  H01L23/24 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.

    摘要翻译： 含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有 具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对 体积至少约90％。 优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在 填料分布的相对体积体积至少约95％。 还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。

    Socket for engaging bump leads on a microelectronic device and methods therefor
    17.
    发明授权
    Socket for engaging bump leads on a microelectronic device and methods therefor 失效
    用于接合微电子器件上的突起引线的插座及其方法

    公开(公告)号：US06202297B1

    公开(公告)日：2001-03-20

    申请号：US09079336

    申请日：1998-05-14

    申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

    发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

    IPC分类号： H05K330

    CPC分类号： H05K7/1084 ,  H01R12/714 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

    摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

    摘要翻译： 具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。 电介质基板具有从前表面向上延伸的多个柱。 柱可以以每组在其间限定间隙的柱组的排列布置。 大体层状接触从每个顶部延伸。 凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。 通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。