公开(公告)号：US20170122333A1

公开(公告)日：2017-05-04

申请号：US15070538

申请日：2016-03-15

申请人： General Electric Company

发明人： Dennis Michael Gray ,  Todd Charles Curtis ,  Lyon Hong ,  Lawrence Bernard Kool

IPC分类号： F04D29/22 ,  C23C18/16 ,  E21B43/12 ,  C23C18/32 ,  F04D29/02 ,  F04D29/44

CPC分类号： F04D29/2294 ,  C23C18/1646 ,  C23C18/1662 ,  C23C18/1692 ,  C23C18/32 ,  E21B43/128 ,  F04B47/02 ,  F04B47/06 ,  F04D1/06 ,  F04D29/026 ,  F04D29/445 ,  F04D29/448 ,  F05D2300/506

摘要： A centrifugal pump component for an oil and gas well pump includes a substrate with an outer surface configured to contact oil and gas well fluid. The component further includes a coating formed on at least a portion of the outer surface. The coating includes a combination of hard particles and a metal matrix.

公开(公告)号：US09576693B2

公开(公告)日：2017-02-21

申请号：US14346025

申请日：2012-09-10

申请人： Yoshitaka Shibuya ,  Kazuhiko Fukamachi ,  Atsushi Kodama

发明人： Yoshitaka Shibuya ,  Kazuhiko Fukamachi ,  Atsushi Kodama

IPC分类号： B32B15/00 ,  H01B1/02 ,  B32B15/01 ,  C25D5/10 ,  C22C5/06 ,  C22C5/08 ,  C22C5/10 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C19/03 ,  C22C19/07 ,  C22C22/00 ,  C22C27/06 ,  C22C38/00 ,  C22C13/02 ,  H05K3/24 ,  C25D5/50 ,  C25D5/12 ,  C23C18/16 ,  H05K1/11 ,  H01R13/03 ,  C25D3/12 ,  C25D3/20 ,  C25D3/30 ,  C25D3/38 ,  C25D3/46 ,  C25D3/50 ,  C25D3/56 ,  C25D3/62 ,  C25D3/64

CPC分类号： H01B1/02 ,  B32B15/01 ,  B32B15/018 ,  C22C5/06 ,  C22C5/08 ,  C22C5/10 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  C22C19/03 ,  C22C19/07 ,  C22C22/00 ,  C22C27/06 ,  C22C38/00 ,  C23C18/1651 ,  C23C18/1692 ,  C25D3/12 ,  C25D3/20 ,  C25D3/30 ,  C25D3/38 ,  C25D3/46 ,  C25D3/50 ,  C25D3/567 ,  C25D3/62 ,  C25D3/64 ,  C25D5/10 ,  C25D5/12 ,  C25D5/505 ,  H01R13/03 ,  H05K1/117 ,  H05K1/118 ,  H05K3/244 ,  H05K2201/0341 ,  Y10T428/12681 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

摘要： There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 μm, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 μm.

摘要翻译： 提供了具有低插入性/提取性，低晶须成形性和高耐久性的电子部件用金属材料以及金属材料的制造方法。 用于电子部件的金属材料10具有基材11，构成基材11的表层的A层14，其由Sn，In或其合金形成，B层13构成中间层， 材料11和A层14，由Ag，Au，Pt，Pd，Ru，Rh，Os，Ir或其合金形成，其中表面层（A层）14的厚度为0.002〜0.2μm， 中间层（B层）13的厚度为0.001〜0.3μm。

公开(公告)号：US09564333B2

公开(公告)日：2017-02-07

申请号：US14766389

申请日：2014-02-21

申请人： ALCHIMER

发明人： Vincent Mevellec ,  Dominique Suhr

IPC分类号： H01L21/44 ,  H01L21/285 ,  H01L21/3205 ,  C23C18/18 ,  C23C18/16 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L21/28 ,  H01L21/288 ,  H01L31/0224

CPC分类号： H01L21/28518 ,  C23C18/1607 ,  C23C18/1639 ,  C23C18/1642 ,  C23C18/1692 ,  C23C18/1696 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L21/28052 ,  H01L21/288 ,  H01L21/32053 ,  H01L31/022425

摘要： A subject matter of the invention is a process for the formation of nickel silicide or of cobalt silicide, comprising the stages consisting in: exposing the surface of the silicon-comprising substrate with an aqueous solution comprising from 0.1 mM to 10 mM of gold ions and from 0.6 M to 3.0 M of fluorine ions for a duration of between 5 seconds and 5 minutes, depositing by an electroless route, on the activated substrate, a layer essentially composed of nickel or of cobalt, applying a rapid thermal annealing at a temperature of between 300° C. and 750° C., so as to form the nickel silicide or the cobalt silicide. The aqueous solution comprises a surface-active agent chosen from the compounds comprising at least one anionic or nonionic polar group and an alkyl chain comprising from 10 to 16 carbon atoms.This process essentially has applications in the manufacture of NAND memories and photovoltaic cells.

摘要翻译： 该过程基本上在制造NAND存储器和光伏电池中具有应用。

公开(公告)号：US09506149B2

公开(公告)日：2016-11-29

申请号：US14645366

申请日：2015-03-11

申请人： NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

发明人： Owen J. Hildreth

IPC分类号： B05D5/12 ,  C23C18/16 ,  H01L21/3205 ,  H01Q17/00 ,  H01Q1/38 ,  H01L21/306 ,  H01L21/3063 ,  H01L21/3065 ,  B81C1/00

CPC分类号： C23C18/1657 ,  B81C1/0038 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/1675 ,  C23C18/1689 ,  C23C18/1692 ,  H01L21/306 ,  H01L21/30604 ,  H01L21/3063 ,  H01L21/3065 ,  H01L21/32051 ,  H01Q1/38 ,  H01Q17/00

摘要： A process for depositing a metal includes disposing a liquid deposition composition on a substrate, the liquid deposition composition including a metal cation; a reducing anion; anda solvent; evaporating the solvent; increasing a concentration of the reducing anion increases in the liquid deposition composition due to evaporating the solvent; performing an oxidation-reduction reaction between the metal cation and the reducing anion in response to increasing the concentration of the reducing anion when the reducing anion is present at a critical concentration; and forming a metal from the metal cation to deposit the metal on the substrate.

摘要翻译： 溶剂; 蒸发溶剂; 由于蒸发溶剂，增加了液体沉积组合物中还原性阴离子的浓度; 当还原阴离子存在于临界浓度时，响应于增加还原性阴离子的浓度，在金属阳离子和还原性阴离子之间进行氧化还原反应; 以及从金属阳离子形成金属以将金属沉积在基底上。

公开(公告)号：US09183991B2

公开(公告)日：2015-11-10

申请号：US14027321

申请日：2013-09-16

申请人： AVX Corporation

发明人： Jan Petrzilek ,  Martin Biler ,  Mitchell D. Weaver

IPC分类号： H01G9/04 ,  H01G9/08 ,  C25D7/00 ,  H01G9/052 ,  C25D3/50 ,  C25D11/04 ,  C25D11/26 ,  C23C18/44

CPC分类号： H01G9/08 ,  C23C18/1692 ,  C23C18/44 ,  C25D3/50 ,  C25D5/34 ,  C25D5/50 ,  C25D7/00 ,  C25D11/04 ,  C25D11/26 ,  C25D13/12 ,  H01G9/0029 ,  H01G9/052

摘要： A wet electrolytic capacitor that contains a casing within which is positioned an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a conductive coating disposed on a surface of a metal substrate. The casing contains a metal substrate coated with a conductive coating. The conductive coating contains a conductive polymer layer formed through anodic electrochemical polymerization (“electro-polymerization”) of a colloidal suspension on the surface of the metal substrate. The conductive coating also contains a precoat layer that is discontinuous in nature and contains a plurality of discrete projections of a conductive material that are deposited over the surface of the metal substrate in a spaced-apart fashion so that they form “island-like” structures.

摘要翻译： 提供一种湿电解电容器，其包含壳体，其内设有由阳极氧化的烧结多孔体和流体工作电解质形成的阳极。 壳体包含设置在金属基板的表面上的导电涂层。 壳体包含涂覆有导电涂层的金属基底。 导电涂层含有通过金属基底表面上的胶体悬浮液的阳极电化学聚合（“电聚合”）形成的导电聚合物层。 导电涂层还包含预涂层，其本质上是不连续的，并且包含导电材料的多个离散的突起，其以间隔的方式沉积在金属基底的表面上，使得它们形成“岛状”结构 。

公开(公告)号：US20150218703A1

公开(公告)日：2015-08-06

申请号：US14427754

申请日：2013-09-06

申请人： SANKEI GIKEN KOGYO CO., LTD.

发明人： Toshio Okabe ,  Shuji Yamamoto ,  Daisuke Sato

IPC分类号： C23C18/16 ,  C25D7/00

CPC分类号： C23C18/1653 ,  B32B3/266 ,  B32B7/12 ,  B32B15/08 ,  B32B33/00 ,  B32B38/0004 ,  B32B2307/406 ,  B32B2307/714 ,  B32B2605/08 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/1692 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/48 ,  C25D3/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/50 ,  C25D5/505 ,  C25D7/00

摘要： A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

摘要翻译： 一种制造光亮面产品的方法包括以下步骤：在形成在基板上的底涂层上形成第一金属膜，在其上形成第二金属膜的步骤，使第一金属膜与第一金属膜之间的接合强度 包含第一金属膜和第二膜的多层金属膜的每个膜都高于基底涂层和第一金属层之间的接合强度，使多层金属膜与裂缝一体地且不连续地分段的步骤 以形成岛状金属膜，其包含具有岛状结构的精细多层金属区域的集合; 以及形成半透明面涂层以覆盖岛状金属膜的细多层金属区域并进入裂纹以与底涂层接触的步骤。

公开(公告)号：US09080234B2

公开(公告)日：2015-07-14

申请号：US13612363

申请日：2012-09-12

申请人： Satyajit Vishnu Shukla ,  Krishna Gopakumar Warrier ,  Baiju Vijayan Kizhakkekilikoodayil ,  Thachan Shijitha

发明人： Satyajit Vishnu Shukla ,  Krishna Gopakumar Warrier ,  Baiju Vijayan Kizhakkekilikoodayil ,  Thachan Shijitha

IPC分类号： C23C18/18 ,  C04B18/08 ,  C04B20/12 ,  C23C18/12 ,  C23C18/16 ,  C23C18/40 ,  C23C18/44

CPC分类号： C23C18/1868 ,  C04B18/082 ,  C04B20/12 ,  C23C18/1216 ,  C23C18/1245 ,  C23C18/1254 ,  C23C18/1295 ,  C23C18/1601 ,  C23C18/1642 ,  C23C18/1651 ,  C23C18/1658 ,  C23C18/1692 ,  C23C18/1851 ,  C23C18/1879 ,  C23C18/1889 ,  C23C18/405 ,  C23C18/44 ,  Y02W30/92 ,  C04B18/08 ,  C04B20/04 ,  C04B20/1066 ,  C04B20/1062

摘要： Processes for the surface-modification of flyash and industrial applications thereof are described in this invention, which involve surface-sensitization, surface-activation, and subsequent Cu or Ag coating of as-received flyash particles in a conventional electroless bath. These new surface-modification processes offer efficient and cost-effective alternatives to conventional processes which modify the surface of flyash particles with a costlier Sn—Pd catalyst-system. Flyash processed with the inventive processes is also suitable for a greater number of industrial applications relative to that processed with the costlier Sn—Pd catalyst-system. The as-received flyash particles, processed via the inventive surface-modification processes, find industrial applications as conductive fillers for manufacturing conducting polymers, paints, adhesives, sealers, and resins used for EMI shielding of electronic devices, in lead-based composites used in the automobile industries, and as a catalyst to purify industrial waste-water by decomposing longer chains of organic molecules into smaller ones.

摘要翻译： 在本发明中描述了用于飞灰及其工业应用的表面改性的方法，其涉及在常规无电镀浴中的表面致敏，表面活化和随后的所接收的飞灰颗粒的Cu或Ag涂层。 这些新的表面改性方法为常规方法提供了有效和成本有效的替代方案，其用更昂贵的Sn-Pd催化剂体系改性飞灰颗粒的表面。 使用本发明方法处理的飞灰也适用于相对于用较昂贵的Sn-Pd催化剂体系加工的工业应用的更多数量的工业应用。 通过本发明的表面改性方法处理的原样接收的飞灰颗粒在工业应用中作为用于制造用于电子器件的EMI屏蔽的导电聚合物，油漆，粘合剂，密封剂和树脂的导电填料，用于铅基复合材料 汽车工业，通过将有机分子长链分解成更小的催化剂来净化工业废水。

公开(公告)号：US09044715B2

公开(公告)日：2015-06-02

申请号：US12197218

申请日：2008-08-22

申请人： J. Douglas Way ,  Paul Thoen ,  Sabina K. Gade

发明人： J. Douglas Way ,  Paul Thoen ,  Sabina K. Gade

IPC分类号： B01D71/02 ,  B01D67/00 ,  C01B3/50 ,  C23C18/18 ,  C23C18/38 ,  C23C18/44 ,  C23C18/16

CPC分类号： B01D71/022 ,  B01D67/0069 ,  B01D2325/20 ,  C01B3/505 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/1657 ,  C23C18/1692 ,  C23C18/1841 ,  C23C18/38 ,  C23C18/44

摘要： The invention provides support-free palladium membranes and methods of making these membranes. Single-gas testing of the unsupported foils produced hydrogen permeabilities equivalent to thicker membranes produced by cold-rolling. Defect-free films as thin as 7.2 microns can be fabricated, with ideal H2/N2 selectivities as high as 40,000. Homogeneous membrane compositions may also be produced using these methods.

摘要翻译： 本发明提供无载体钯膜和制备这些膜的方法。 未支撑的箔的单气体测试产生相当于通过冷轧生产的较厚膜的氢渗透性。 可以制造薄至7.2微米的无缺陷薄膜，理想的H2 / N2选择性高达40,000。 也可以使用这些方法制备均相膜组合物。

公开(公告)号：US08908274B2

公开(公告)日：2014-12-09

申请号：US13023454

申请日：2011-02-08

申请人： Takayuki Teshima ,  Shinan Wang ,  Yutaka Setomoto ,  Takashi Nakamura

发明人： Takayuki Teshima ,  Shinan Wang ,  Yutaka Setomoto ,  Takashi Nakamura

IPC分类号： G02B5/18 ,  C23C18/16 ,  C23C18/18 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  G21K1/06 ,  C25D7/12 ,  C25D5/02

CPC分类号： G21K1/06 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1851 ,  C23C18/1868 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/123 ,  G02B5/1838 ,  G02B5/1857 ,  G02B5/1866 ,  G21K2207/005 ,  Y10T428/12396

摘要： A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold.

摘要翻译： 微结构制造方法包括：制备在其前侧具有多个精细结构的模具，其导电性被施加到所述多个精细结构之间的底部; 通过电镀底部在多个精细结构之间形成第一镀层; 并且形成比所述多个微细结构之间的所述第一镀层上的第一镀层大的应力的第二镀层，其中所述第二镀层的应力用于弯曲所述模具的背面。

公开(公告)号：US20140329018A1

公开(公告)日：2014-11-06

申请号：US14233349

申请日：2011-07-19

申请人： Peter G. Berrang

发明人： Peter G. Berrang

IPC分类号： C08J9/00 ,  C23C18/32

CPC分类号： C08J9/0085 ,  C08J2205/05 ,  C23C18/1641 ,  C23C18/1644 ,  C23C18/1657 ,  C23C18/1692 ,  C23C18/32 ,  Y10T428/249921

摘要： A reticulated foam structure comprising a plurality of closely-spaced fibers extending across and between the cells. A reticulated polymer foam structure is enhanced by fibers of metal, metal alloys, metal oxides, carbon or glass that are chopped or milled and introduced into the foam structure during foam formation or by entrainment of fibers into the foam. The resulting structure is used as a template to create a high porosity reticulated foam structure of a non-polymer material by coating the non-polymer onto the fiber-enhanced structure and removing the polymer by heating or pyrolizing. The design has utility for applications such as filtration, implants, heat transfer and electrodes, which require structures with low cost, high porosity, small effective pore sizes and large contact surface area.

摘要翻译： 一种网状泡沫结构，其包括在细胞之间延伸并延伸的多个紧密间隔的纤维。 网状聚合物泡沫结构通过金属，金属合金，金属氧化物，碳或玻璃的纤维增强，所述金属，金属合金，金属氧化物，碳或玻璃在泡沫形成期间或通过将纤维夹带到泡沫中而被切碎或研磨并引入泡沫结构中。 将所得结构用作模板，通过将非聚合物涂覆在纤维增强结构上并通过加热或热解除去聚合物来形成非聚合物材料的高孔隙度网状泡沫结构。 该设计可用于诸如过滤，植入物，热传递和电极之类的应用，其需要具有低成本，高孔隙率，小的有效孔径和大的接触表面积的结构。