Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity
    213.
    发明申请
    Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity 审中-公开
    具有选择性电气和热连接性的耐热金属芯片印刷电路板

    公开(公告)号:US20100071936A1

    公开(公告)日:2010-03-25

    申请号:US12594196

    申请日:2008-04-04

    Applicant: Kia Kuang Tan

    Inventor: Kia Kuang Tan

    Abstract: Methods for controlling thermal conductivity paths in a metal core circuit board, as well as methods to provide selective electrical isolation, are described. In one embodiment, grooves are formed in an aluminum substrate surrounding areas where electrical components are to be mounted on the substrate. The grooves are oxidized along with the opposing surface of the substrate to create a vertical oxide ring around the area for electrical and lateral thermal isolation. This also allows the substrate to be made relatively thick for mechanical strength. Other features include forming copper around oxidized sides of the substrate for connection between top and bottom copper layers; plating up copper to be co-planar with a raised dielectric layer; forming indentions in the substrate for containing a dielectric so the dielectric is co-planar with the remaining surface; forming copper vias through the substrate; and planarizing the substrate surface so that conductors and dielectric layers are co-planar.

    Abstract translation: 描述了用于控制金属芯电路板中的导热路径的方法以及提供选择性电隔离的方法。 在一个实施例中,在铝基板中形成凹槽,围绕要在基板上安装电气部件的区域。 凹槽与衬底的相对表面一起被氧化以在该区域周围形成垂直氧化环,用于电和横向热隔离。 这也使得基板的机械强度相对较厚。 其他特征包括在基底的氧化侧面周围形成铜,以在顶部和底部铜层之间连接; 电镀铜与凸起的电介质层共面; 在用于容纳电介质的基板中形成凹陷,使得电介质与剩余的表面共面; 通过基底形成铜通孔; 并平坦化衬底表面,使得导体和电介质层是共面的。

    Multilayer printed wiring board with filled viahole structure
    218.
    发明授权
    Multilayer printed wiring board with filled viahole structure 有权
    多层印刷线路板,带有通孔结构

    公开(公告)号:US07622183B2

    公开(公告)日:2009-11-24

    申请号:US11385904

    申请日:2006-03-22

    Abstract: The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

    Abstract translation: 本发明提供了一种多层印刷线路板,其具有有利地用于在其上形成精细电路图案的填充通孔结构,并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成,层间绝缘树脂层各自形成有各自填充有镀层的孔,以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦,并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半,小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙,并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂,氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

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