Abstract:
A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of the substrate, forming a patterned build-up layer on the substrate, and etching away a metal plating forming metal protrusions.
Abstract:
Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).
Abstract:
Methods for controlling thermal conductivity paths in a metal core circuit board, as well as methods to provide selective electrical isolation, are described. In one embodiment, grooves are formed in an aluminum substrate surrounding areas where electrical components are to be mounted on the substrate. The grooves are oxidized along with the opposing surface of the substrate to create a vertical oxide ring around the area for electrical and lateral thermal isolation. This also allows the substrate to be made relatively thick for mechanical strength. Other features include forming copper around oxidized sides of the substrate for connection between top and bottom copper layers; plating up copper to be co-planar with a raised dielectric layer; forming indentions in the substrate for containing a dielectric so the dielectric is co-planar with the remaining surface; forming copper vias through the substrate; and planarizing the substrate surface so that conductors and dielectric layers are co-planar.
Abstract:
An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.
Abstract:
A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
Abstract:
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
Abstract:
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
Abstract:
The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
Abstract:
An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a packaging board. The wiring pattern of the packaging board is formed on an insulating substrate and includes a wiring region, an electrode region (pad electrode) connected with a semiconductor device, and a boundary region provided between the wiring region and the electrode region. A gold plating layer is provided on the surface of the electrode region of the wiring pattern. The top surface of the boundary region of the wiring pattern is so formed as to be dented from the top surface of the wiring region of the wiring pattern, and there is provided a stepped portion in the boundary region. A solder resist is formed in such a manner as to cover part of the gold plating layer and the wiring pattern corresponding to the boundary region and the wiring region, and the solder resist has a predetermined opening through which to connect to the semiconductor device. A conductive member is connected to the gold plating layer in the electrode region, and a molded resin layer seals the entire semiconductor module.
Abstract:
Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.