公开(公告)号：US20050189622A1

公开(公告)日：2005-09-01

申请号：US11068830

申请日：2005-03-01

申请人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

发明人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

IPC分类号： B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC分类号： B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

公开(公告)号：US20050173805A1

公开(公告)日：2005-08-11

申请号：US10985119

申请日：2004-11-10

申请人： Philip Damberg ,  Belgacem Haba ,  David Tuckerman ,  Teck-Gyu Kang

发明人： Philip Damberg ,  Belgacem Haba ,  David Tuckerman ,  Teck-Gyu Kang

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

摘要： A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：US20130130067A2

公开(公告)日：2013-05-23

申请号：US12589323

申请日：2009-10-20

申请人： Geoffrey Deane ,  Bran Ferren ,  William Gates ,  W. Daniel Hillis ,  Roderick Hyde ,  Muriel Ishikawa ,  Edward Jung ,  Jordin Kare ,  Nathan Myhrvold ,  Clarence Tegreene ,  David Tuckerman ,  Thomas Weaver ,  Charles Whitmer ,  Lowell Wood, Jr. ,  Victoria Wood

发明人： Geoffrey Deane ,  Bran Ferren ,  William Gates ,  W. Daniel Hillis ,  Roderick Hyde ,  Muriel Ishikawa ,  Edward Jung ,  Jordin Kare ,  Nathan Myhrvold ,  Clarence Tegreene ,  David Tuckerman ,  Thomas Weaver ,  Charles Whitmer ,  Lowell Wood, Jr. ,  Victoria Wood

IPC分类号： H01M10/44 ,  H02J7/00 ,  H01M10/50 ,  H01M10/04 ,  H01M4/02 ,  H01M4/36

CPC分类号： H01M4/02 ,  H01M4/36 ,  H01M4/366 ,  H01M10/44 ,  H01M10/613 ,  H01M10/617 ,  H01M10/654 ,  H01M10/6567 ,  H01M2004/021 ,  Y10T29/49108

摘要： An electrochemical device (such as a battery) includes at least one electrode having a fluid surface, which may employ a surface energy effect to maintain a position of the fluid surface and/or to modulate flow within the fluid. Fluid-directing structures may also modulate flow or retain fluid in a predetermined pattern. An electrolyte within the device may also include an ion-transport fluid, for example infiltrated into a porous solid support.

摘要翻译： 电化学装置（例如电池）包括具有流体表面的至少一个电极，其可以采用表面能量效应来维持流体表面的位置和/或调节流体内的流动。 流体引导结构还可以以预定模式调节流动或保持流体。 装置内的电解质还可以包括离子输送流体，例如渗透到多孔固体支持物中。

公开(公告)号：US20070034777A1

公开(公告)日：2007-02-15

申请号：US11317207

申请日：2005-12-23

申请人： David Tuckerman ,  Kenneth Honer ,  Bruce McWilliams ,  Nicholas Colella ,  Charles Goudge

发明人： David Tuckerman ,  Kenneth Honer ,  Bruce McWilliams ,  Nicholas Colella ,  Charles Goudge

IPC分类号： H01L27/00 ,  H01L31/00

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L2924/0002 ,  H04N5/3415 ,  H04N9/045 ,  H04N9/09 ,  H01L2924/00

摘要： Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

摘要翻译： 提供了在检测器层中具有多个光电检测器的图像传感器。可选地，为背照式传感器架构提供光学透明基板。 光电检测器可以被布置成三个或更多个阵列。 通常，每个阵列是连续的并且与不同颜色和/或波长的光相关联。 此外，阵列可以是共面的，或者在替代方案中，以至少部分不重叠的方式位于与光接收表面增加的距离处。 还提供了图像传感器封装。

公开(公告)号：US20060220234A1

公开(公告)日：2006-10-05

申请号：US11322617

申请日：2005-12-30

申请人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

发明人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

IPC分类号： H01L23/34

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

公开(公告)号：US20060032670A1

公开(公告)日：2006-02-16

申请号：US10917978

申请日：2004-08-13

申请人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC分类号： H05K1/14

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20060001761A1

公开(公告)日：2006-01-05

申请号：US11014280

申请日：2004-12-15

申请人： Belgacem Haba ,  David Tuckerman

发明人： Belgacem Haba ,  David Tuckerman

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensor including a package with an element for both covering and protecting the sensor device and also filtering portions, e.g., infrared portions, of the incident light beam. The image sensor module includes a package to receive the image sensor integrated circuit chip, with the image sensor integrated circuit chip being bonded to the package, and an infrared filter overlaying the image sensor integrated circuit chip and likewise bonded to the package. This provides both a hermetic seal for the image sensor integrated circuit chip and filters or attenuates the incident infrared light.

摘要翻译： 固态图像传感器包括具有用于覆盖和保护传感器装置的元件的封装以及入射光束的过滤部分，例如红外部分。 图像传感器模块包括用于接收图像传感器集成电路芯片的封装，图像传感器集成电路芯片被结合到封装，以及覆盖图像传感器集成电路芯片的红外滤光片，并且同样粘合到封装。 这提供了用于图像传感器集成电路芯片的气密密封和滤波器或衰减入射的红外光。

公开(公告)号：US20050116326A1

公开(公告)日：2005-06-02

申请号：US10959465

申请日：2004-10-06

申请人： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David Tuckerman

发明人： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David Tuckerman

IPC分类号： H01L23/13 ,  H01L23/498 ,  H01L21/44 ,  H01L23/02 ,  H01L29/40

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/0233 ,  H01L2224/02377 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/49208 ,  H01L2924/00014 ,  H01L2924/00

摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

摘要翻译： 用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其他方式减小至少一些柱的高度从电介质元件突出的柱。

公开(公告)号：US20050087861A1

公开(公告)日：2005-04-28

申请号：US10949844

申请日：2004-09-24

申请人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

发明人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

摘要翻译： 提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有 面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。 至少一些单元连接电连接到芯片。 封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。 封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。