公开(公告)号：US09765289B2

公开(公告)日：2017-09-19

申请号：US13598272

申请日：2012-08-29

申请人： Hui-Jung Tsai ,  Hung-Jui Kuo ,  Chung-Shi Liu

发明人： Hui-Jung Tsai ,  Hung-Jui Kuo ,  Chung-Shi Liu

IPC分类号： B08B3/00 ,  C11D11/00 ,  H01L21/67 ,  H01L21/02 ,  C11D7/06 ,  C11D7/32 ,  H01L23/00

CPC分类号： C11D11/0047 ,  C11D7/06 ,  C11D7/3218 ,  H01L21/02071 ,  H01L21/67051 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/13005 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13172 ,  H01L2224/13184 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/206 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05552

摘要： Methods and chemical solvents used for cleaning residues on metal contacts during a semiconductor device packaging process are disclosed. A chemical solvent for cleaning a residue formed on a metal contact may comprise a reactive inorganic component and a reactive organic component. The method may comprise spraying a semiconductor device with a chemical solvent at a first pressure, and spraying the semiconductor device with the chemical solvent at a second pressure less than the first pressure.

公开(公告)号：US09576830B2

公开(公告)日：2017-02-21

申请号：US13475790

申请日：2012-05-18

申请人： Hui-Min Huang ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

发明人： Hui-Min Huang ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L21/687 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67288 ,  H01L21/6838

摘要： A method for adjusting the warpage of a wafer, includes providing a wafer having a center portion and edge portions and providing a holding table having a holding area thereon for holding the wafer. The wafer is placed onto the holding table with the center portion higher than the edge portions and thereafter pressed onto the holding area such that the wafer is attracted to and held onto the holding table by self-suction force. The wafer is heated at a predetermined temperature and for a predetermined time in accordance with an amount of warpage of the wafer in order to achieve a substantially flat wafer or a predetermined wafer level.

摘要翻译： 一种用于调整晶片翘曲的方法，包括提供具有中心部分和边缘部分的晶片，并提供其上具有用于保持晶片的保持区域的保持台。 将晶片放置在保持台上，其中心部分高​​于边缘部分，然后按压到保持区域上，使得晶片通过自吸力被吸引并保持在保持台上。 根据晶片的翘曲量将晶片在预定温度下加热预定时间，以便实现基本上平坦的晶片或预定的晶片级。

公开(公告)号：US09219030B2

公开(公告)日：2015-12-22

申请号：US13526073

申请日：2012-06-18

申请人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chung-Shi Liu ,  Meng-Tse Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chung-Shi Liu ,  Meng-Tse Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC分类号： H01L23/498 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56 ,  H01L25/10 ,  H01L23/31 ,  H01L25/03 ,  H01L25/00

CPC分类号： H01L24/05 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/22 ,  B23K35/262 ,  B23K35/3613 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/498 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/06181 ,  H01L2224/08113 ,  H01L2224/1184 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1355 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13666 ,  H01L2224/1412 ,  H01L2224/14181 ,  H01L2224/16104 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/206 ,  H01L2224/05552 ,  H01L2924/00012

摘要： The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small.

摘要翻译： 形成封装封装（PoP）结构的机构的所述实施例包括将具有非焊料金属球的连接器与包装衬底结合。 非焊接金属球可以包括焊料涂层。 具有非焊接金属球的连接器可以基本保持连接器的形状并控制上部和下部封装之间的结合结构的高度。 具有非焊接金属球的连接器也不太可能导致连接器之间的桥接或接合连接器的断开（或冷接头）。 结果，可以将具有非焊接金属球的连接器的间距保持较小。

公开(公告)号：US09123763B2

公开(公告)日：2015-09-01

申请号：US13271952

申请日：2011-10-12

申请人： Chen-Hua Yu ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Ming-Da Cheng ,  Chih-Wei Lin

发明人： Chen-Hua Yu ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Ming-Da Cheng ,  Chih-Wei Lin

IPC分类号： H01L23/48 ,  H01L21/683 ,  H01L23/538 ,  H01L21/56 ,  H01L25/10 ,  H01L21/36 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H05K1/18 ,  H01L23/498

CPC分类号： H01L25/50 ,  H01L21/31051 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76819 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/185 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/48

摘要： A package-on-package (PoP) structure comprises a first package and a second package. The first package comprises a first die, a second die, and a core material. The core material has a first surface and a second surface. A first redistribution layer (RDL) is on the first surface, and a second RDL is on the second surface. The first die is disposed in the core material between the first surface and the second surface. The second die is coupled to one of the first RDL and the second RDL. The second package comprises a third die and an interposer. The interposer has a first side and a second side. The third die is coupled to the second side of the interposer. The first package is coupled to the second package by first electrical connectors coupled to the second side of the interposer and the first RDL.

摘要翻译： 封装封装（PoP）结构包括第一封装和第二封装。 第一包装包括第一模具，第二模具和芯材料。 芯材料具有第一表面和第二表面。 第一再分配层（RDL）位于第一表面上，第二RDL位于第二表面上。 第一模具设置在第一表面和第二表面之间的芯材料中。 第二管芯耦合到第一RDL和第二RDL之一。 第二包装包括第三管芯和插入件。 插入器具有第一侧和第二侧。 第三裸片耦合到插入器的第二侧。 第一封装通过耦合到插入件的第二侧和第一RDL的第一电连接器耦合到第二封装。

公开(公告)号：US09082776B2

公开(公告)日：2015-07-14

申请号：US13594544

申请日：2012-08-24

申请人： Wen-Hsiung Lu ,  Ming-Da Cheng ,  Yi-Wen Wu ,  Yu-Peng Tsai ,  Chia-Wei Tu ,  Chung-Shi Liu

发明人： Wen-Hsiung Lu ,  Ming-Da Cheng ,  Yi-Wen Wu ,  Yu-Peng Tsai ,  Chia-Wei Tu ,  Chung-Shi Liu

IPC分类号： H01L23/52 ,  H01L21/44 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/56 ,  H01L21/566 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05541 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10126 ,  H01L2224/11831 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/206 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region.

摘要翻译： 半导体封装包括半导体衬底，覆盖半导体衬底的接触焊盘，覆盖接触焊盘的互连层，形成在接触焊盘和互连层之间的钝化层，覆盖在互连层上的凸起以及覆盖在该互连层上的保护层 互连层和钝化层并覆盖凸块的下部。 保护层包括弯曲表面区域。

公开(公告)号：US09030022B2

公开(公告)日：2015-05-12

申请号：US13280157

申请日：2011-10-24

申请人： Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

发明人： Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/50 ,  H01L21/31105 ,  H01L21/565 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

摘要翻译： 一种器件包括在顶表面上具有导电特征的封装元件和模塑在第一封装元件的顶表面上的聚合物区域。 多个开口从聚合物区域的顶表面延伸到聚合物区域中，其中每个导电特征通过多个开口中的一个露出。 多个开口包括具有第一水平尺寸的第一开口和具有不同于第一水平尺寸的第二水平尺寸的第二开口。

公开(公告)号：US08981559B2

公开(公告)日：2015-03-17

申请号：US13532402

申请日：2012-06-25

申请人： Chun-Lei Hsu ,  Chung-Shi Liu ,  De-Yuan Lu ,  Ming-Che Ho ,  Yu-Feng Chen

发明人： Chun-Lei Hsu ,  Chung-Shi Liu ,  De-Yuan Lu ,  Ming-Che Ho ,  Yu-Feng Chen

IPC分类号： H01L23/48 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15323 ,  H01L2924/15331 ,  H01L2924/15333 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/18161 ,  H01L2924/3651

摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.

摘要翻译： 封装封装（PoP）器件和封装半导体管芯的方法被公开。 在一个实施例中，PoP器件包括第一封装管芯和耦合到第一封装管芯的第二封装管芯。 金属柱连接到第一封装的模具。 金属支柱具有靠近第一封装模具的第一部分和设置在第一部分上的第二部分。 每个金属支柱都联接到靠近第二包装模具的焊接接头。

公开(公告)号：US08951037B2

公开(公告)日：2015-02-10

申请号：US13411293

申请日：2012-03-02

申请人： Bor-Ping Jang ,  Yeong-Jyh Lin ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Yeong-Jyh Lin ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B29C45/22

CPC分类号： H01L25/50 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/34 ,  B29C2045/0027 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

摘要： A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.

摘要翻译： 模具包括顶部和具有环形的边缘环。 边缘环是底部并连接到顶部的边缘。 边缘环包括通风口。 边缘环进一步环绕模具顶部下方的内部空间。 多个注射口连接到模具的内部空间。 多个注射口基本上对齐于与模具顶部的中心交叉的直线。 多个注射口具有不同的尺寸。

公开(公告)号：US08846448B2

公开(公告)日：2014-09-30

申请号：US13571665

申请日：2012-08-10

申请人： Meng-Tse Chen ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Tsai-Tsung Tsai ,  Ai-Tee Ang ,  Ming-Da Cheng ,  Chung-Shi Liu

发明人： Meng-Tse Chen ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Tsai-Tsung Tsai ,  Ai-Tee Ang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L21/00 ,  H01L21/67

CPC分类号： H01L21/67288 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05B6/6447 ,  H05B6/80 ,  H01L2924/0001

摘要： The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure.

摘要翻译： 本公开涉及一种减少封装封装半导体结构内的翘曲的工具布置和方法，同时最小化耦合封装的电绝缘粘合剂内的空隙形成。 压力发生器和可变频率微波源耦合到封装封装的封装半导体结构的处理室。 封装的封装半导体结构由可变频率，可变温度和可变持续时间的可变频率微波源同时加热，并通过压力发生器暴露于高压。 这种用于微波加热和升高压力的组合限制了引入的翘曲量，同时防止在封装封装半导体结构的衬底的电绝缘粘合剂中形成空隙。

公开(公告)号：US08664040B2

公开(公告)日：2014-03-04

申请号：US13331061

申请日：2011-12-20

申请人： Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/31 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

摘要： A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.

摘要翻译： 一种方法包括对包装进行蚀刻步骤。 该包装包括包装部件，在包装部件的顶表面上的连接器，结合到包装部件的顶表面的管芯，以及模制在包装部件的顶表面上的模制材料。 成型材料覆盖连接器，其中通过蚀刻步骤去除覆盖连接器的成型材料的一部分，并且连接器被暴露。