公开(公告)号：US08810043B2

公开(公告)日：2014-08-19

申请号：US13195325

申请日：2011-08-01

申请人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

发明人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17107 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。

公开(公告)号：US20130228736A1

公开(公告)日：2013-09-05

申请号：US13599504

申请日：2012-08-30

申请人： Daisuke MATSUSHITA ,  Shosuke Fujii ,  Yoshifumi Nishi ,  Akira Takashima ,  Takayuki Ishikawa ,  Hidenori Miyagawa ,  Takashi Haimoto ,  Yusuke Arayashiki ,  Hideki Inokuma

发明人： Daisuke MATSUSHITA ,  Shosuke Fujii ,  Yoshifumi Nishi ,  Akira Takashima ,  Takayuki Ishikawa ,  Hidenori Miyagawa ,  Takashi Haimoto ,  Yusuke Arayashiki ,  Hideki Inokuma

IPC分类号： H01L45/00

CPC分类号： H01L45/1253 ,  H01L27/2481 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/1266 ,  H01L45/142 ,  H01L45/143 ,  H01L45/144 ,  H01L45/146 ,  H01L45/148

摘要： According to one embodiment, a memory device includes a first electrode, a second electrode, and a variable resistance film. The variable resistance film is connected between the first electrode and the second electrode. The first electrode includes a metal contained in a matrix made of a conductive material. A cohesive energy of the metal is lower than a cohesive energy of the conductive material. A concentration of the metal at a central portion of the first electrode in a width direction thereof is higher than concentrations of the metal in two end portions of the first electrode in the width direction.

摘要翻译： 根据一个实施例，存储器件包括第一电极，第二电极和可变电阻膜。 可变电阻膜连接在第一电极和第二电极之间。 第一电极包括由导电材料制成的基体中所含的金属。 金属的内聚能低于导电材料的内聚能。 第一电极的宽度方向的中央部的金属浓度高于第一电极的宽度方向的两端部的金属的浓度。

公开(公告)号：US08331137B2

公开(公告)日：2012-12-11

申请号：US13234796

申请日：2011-09-16

申请人： Akira Takashima ,  Reika Ichihara

发明人： Akira Takashima ,  Reika Ichihara

IPC分类号： G11C11/00

CPC分类号： G11C11/5685 ,  G11C13/0007 ,  G11C13/003 ,  G11C13/0069 ,  G11C13/0097 ,  G11C2013/0092 ,  G11C2213/33 ,  G11C2213/76

摘要： According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell includes a variable resistance element and a capacitor connected in series between first and second conductive lines, and a control circuit applying one of first and second voltage pulses to the memory cell. The capacitor is charged by a leading edge of one of the first and second voltage pulses, and discharged a trailing edge of one of the first and second voltage pulses. The control circuit makes waveforms of the trailing edges of the first and second voltage pulses be different, changes a resistance value of the variable resistance element from a first resistance value to a second resistance value by using the first voltage pulse, and changes the resistance value of the variable resistance element from the second resistance value to the first resistance value by using the second voltage pulse.

摘要翻译： 根据一个实施例，非易失性半导体存储器件包括存储单元，其包括可变电阻元件和串联连接在第一和第二导线之间的电容器，以及将第一和第二电压脉冲之一施加到存储单元的控制电路。 电容器由第一和第二电压脉冲之一的前沿充电，并且将第一和第二电压脉冲之一的后沿放电。 控制电路使得第一和第二电压脉冲的后沿的波形不同，通过使用第一电压脉冲将可变电阻元件的电阻值从第一电阻值改变为第二电阻值，并且改变电阻值 通过使用第二电压脉冲从第二电阻值到第一电阻值。

公开(公告)号：US07986016B2

公开(公告)日：2011-07-26

申请号：US12482054

申请日：2009-06-10

申请人： Yoshiki Kamata ,  Akira Takashima

发明人： Yoshiki Kamata ,  Akira Takashima

IPC分类号： H01L29/51 ,  H01L21/28

CPC分类号： H01L29/24 ,  H01L21/02381 ,  H01L21/02521 ,  H01L21/02532 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/2658 ,  H01L29/1054 ,  H01L29/517 ,  H01L29/785

摘要： According to an aspect of the present invention, there is provided a semiconductor device including: a substrate that includes a semiconductor region including Ge as a primary component; a compound layer that is formed above the semiconductor region, that includes Ge and that has a non-metallic characteristic; an insulator film that is formed above the compound layer; an electrode that is formed above the insulator film; and source/drain regions that is formed in the substrate so as to sandwich the electrode therebetween.

摘要翻译： 根据本发明的一个方面，提供了一种半导体器件，包括：衬底，其包括以Ge为主要成分的半导体区域; 形成在半导体区域上方的包含Ge并且具有非金属特性的化合物层; 形成在化合物层上方的绝缘膜; 形成在绝缘膜上的电极; 以及形成在基板中以将电极夹在其间的源极/漏极区域。

公开(公告)号：US07884459B2

公开(公告)日：2011-02-08

申请号：US12210645

申请日：2008-09-15

申请人： Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

发明人： Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

IPC分类号： H01L23/02

CPC分类号： H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/13008 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

摘要翻译： 提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。 在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。 通过蚀刻形成孔，电极焊盘用作蚀刻停止层。 埋入电极形成在孔中。 该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

公开(公告)号：US07863695B2

公开(公告)日：2011-01-04

申请号：US12200599

申请日：2008-08-28

申请人： Masamichi Suzuki ,  Masato Koyama ,  Yoshinori Tsuchiya ,  Hirotaka Nishino ,  Reika Ichihara ,  Akira Takashima

发明人： Masamichi Suzuki ,  Masato Koyama ,  Yoshinori Tsuchiya ,  Hirotaka Nishino ,  Reika Ichihara ,  Akira Takashima

IPC分类号： H01L27/092 ,  H01L21/8238

CPC分类号： H01L21/823857 ,  H01L21/26506 ,  H01L21/31155 ,  H01L21/823842 ,  H01L29/517 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7842 ,  H01L29/7846 ,  H01L29/785

摘要： A complementary semiconductor device includes a semiconductor substrate, a first semiconductor region formed on a surface of the semiconductor substrate, a second semiconductor region formed on the surface of the semiconductor substrate apart from the first semiconductor region, an n-MIS transistor having a first gate insulating film including La and Al, formed on the first semiconductor region, and a first gate electrode formed on the gate insulating film, and a p-MIS transistor having a second gate insulating film including La and Al, formed on the second semiconductor region, and a second gate electrode formed on the gate insulating film, an atomic density ratio Al/La in the second gate insulating film being larger than an atomic density ratio Al/La in the first gate insulating film.

摘要翻译： 互补半导体器件包括半导体衬底，形成在半导体衬底的表面上的第一半导体区域，形成在半导体衬底的离开第一半导体区域的表面上的第二半导体区域，具有第一栅极的n-MIS晶体管 形成在第一半导体区域上的包括La和Al的绝缘膜和形成在栅极绝缘膜上的第一栅电极和形成在第二半导体区上的具有包括La和Al的第二栅极绝缘膜的p-MIS晶体管， 以及形成在所述栅极绝缘膜上的第二栅电极，所述第二栅极绝缘膜中的原子密度比Al / La大于所述第一栅极绝缘膜中的原子密度比Al / La。

公开(公告)号：US20090315659A1

公开(公告)日：2009-12-24

申请号：US12213749

申请日：2008-06-24

申请人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

发明人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

IPC分类号： H01F27/29 ,  H01F7/06

CPC分类号： H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F27/327 ,  H01F2027/065 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49174

摘要： A coil component having an easily discernible orientation, and a method of producing such a coil component that facilitates the injection of resin. A coil component includes a core with a winding portion, first and second flanges disposed on either end of the winding portion, and a winding accommodating region defined by the winding portion and the first and second flanges, terminal electrodes disposed on the second flange and a winding wound about the winding portion and connected to the terminal electrodes. An insulating resin is formed over the winding at the winding accommodating region. A marker made from a material the same as the insulating resin is provided at outer peripheral surface of the flanges.

摘要翻译： 具有容易识别的取向的线圈部件，以及制造有助于树脂注入的这种线圈部件的方法。 线圈部件包括具有绕组部分的芯部，布置在绕组部分的任一端上的第一和第二凸缘以及由绕组部分和第一和第二凸缘限定的绕组容纳区域，设置在第二凸缘上的端子电极和 缠绕在绕组部分上并连接到端子电极。 在卷绕容纳区域的绕组上形成绝缘树脂。 由与绝缘树脂相同的材料制成的标记设置在凸缘的外周面上。

公开(公告)号：US20060226529A1

公开(公告)日：2006-10-12

申请号：US11448863

申请日：2006-06-08

申请人： Yoshiharu Kato ,  Satoru Kawamoto ,  Fumihiko Taniguchi ,  Tetsuya Hiraoka ,  Akira Takashima

发明人： Yoshiharu Kato ,  Satoru Kawamoto ,  Fumihiko Taniguchi ,  Tetsuya Hiraoka ,  Akira Takashima

IPC分类号： H01L23/02

CPC分类号： H01L22/22 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/8513 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.

公开(公告)号：US20060214217A1

公开(公告)日：2006-09-28

申请号：US11224049

申请日：2005-09-13

申请人： Hiroshi Watanabe ,  Atsuhiro Kinoshita ,  Akira Takashima ,  Daisuke Hagishima

发明人： Hiroshi Watanabe ,  Atsuhiro Kinoshita ,  Akira Takashima ,  Daisuke Hagishima

IPC分类号： H01L29/788

CPC分类号： H01L29/7881 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324

摘要： A nonvolatile semiconductor storage device includes a semiconductor substrate; a plurality of isolation regions formed in the semiconductor substrate; an element-forming region formed between adjacent isolation regions; a first gate insulating film provided on the element-forming region; a floating gate electrode which is provided on the first gate insulating film and in which a width of a lower hem facing the element-forming region is narrower than a width of the element-forming region in a section taken in a direction perpendicular to a direction in which the isolation regions extend; a second gate insulating film provided on the floating gate electrode; and a control gate electrode provided on the second gate insulating film.

公开(公告)号：US06960827B2

公开(公告)日：2005-11-01

申请号：US10817808

申请日：2004-04-06

申请人： Takao Nishimura ,  Tadashi Uno ,  Hiroshi Onodera ,  Akira Takashima

发明人： Takao Nishimura ,  Tadashi Uno ,  Hiroshi Onodera ,  Akira Takashima

IPC分类号： H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/11 ,  H01L23/34

CPC分类号： H01L25/03 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A stacked-type semiconductor device has a reduced overall height and an improved reliability in the mechanical strength of the stacked structure. The semiconductor device also has an improved heat release characteristic. A first interposer has a surface on which first electrode pads are formed and a first semiconductor element is mounted with a circuit forming surface facing the first interposer. A second interposer has a surface on which second electrode pads are formed and a second semiconductor element is mounted with a circuit forming surface facing the second interposer. External connection terminals are provided on a surface of the second interposer opposite to the surface on which the second semiconductor element is mounted. The first and second interposers are electrically connected to each other by conductive members provided therebetween. A back surface of the first semiconductor element and a back surface of the second semiconductor element are fixed to each other by an adhesive.

摘要翻译： 叠层型半导体器件具有降低的整体高度和提高层叠结构的机械强度的可靠性。 该半导体器件还具有改善的放热特性。 第一插入件具有其上形成有第一电极焊盘的表面，并且第一半导体元件安装有面向第一插入件的电路形成表面。 第二插入件具有其上形成有第二电极焊盘的表面，并且第二半导体元件安装有面向第二插入件的电路形成表面。 外部连接端子设置在与安装有第二半导体元件的表面相对的第二插入件的表面上。 第一和第二插入件通过设置在它们之间的导电构件彼此电连接。 第一半导体元件的背面和第二半导体元件的背面通过粘合剂彼此固定。