公开(公告)号：US08324512B2

公开(公告)日：2012-12-04

申请号：US13004325

申请日：2011-01-11

Applicant: Yukihiko Toyoda ,  Yoichiro Kawamura ,  Tomoyuki Ikeda

Inventor： Yukihiko Toyoda ,  Yoichiro Kawamura ,  Tomoyuki Ikeda

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/116 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.

Abstract translation: 一种多层印刷电路板，包括基板，在其上构建的多层结构，并且具有交替形式的导体电路和层间树脂绝缘层，以及一个或多个堆叠通孔结构，其包括彼此堆叠并且电连接到导体电路的通孔 通过绝缘层。 每个通孔包括形成在绝缘层的相应一个上的接合部分和填充的通孔结构部分，其中填充有绝缘层的相应一个绝缘层的开口的金属层使得通孔彼此堆叠 在通孔的填充通孔结构部分的正上方，通孔包括绝缘层的最外层中的最外层通孔，一个或多个通孔具有焊盘直径为 大于最外层通孔的陆部的陆部直径。

公开(公告)号：US20120301718A1

公开(公告)日：2012-11-29

申请号：US13575745

申请日：2011-01-27

Applicant: Katsunori Nishiura ,  Masahiro Toriida ,  Wataru Yamashita

Inventor： Katsunori Nishiura ,  Masahiro Toriida ,  Wataru Yamashita

IPC: B32B1/00 ,  B32B15/088 ,  H01B3/30 ,  B32B15/08 ,  B32B5/16 ,  B32B15/085 ,  B32B15/095

CPC classification number: B32B15/08 ,  B32B27/18 ,  B32B27/285 ,  B32B27/34 ,  B32B2264/0257 ,  B32B2371/00 ,  B32B2379/08 ,  C08G73/10 ,  C08G73/14 ,  C08J5/18 ,  C08J2379/08 ,  C08J2423/06 ,  C08L23/02 ,  C08L71/12 ,  C08L79/08 ,  H05K1/0237 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0212 ,  Y10T428/2942 ,  Y10T428/31605 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31696

Abstract: Provided is a metal-resin composite provided with a layer consisting of a heat-resistant resin composition having a low permittivity or a low dielectric loss tangent. The composite can exhibit a low thermal expansion coefficient and a reduced transmission loss of an electric signal. The composite comprises a metal and a resin layer (I). The resin layer (I) is made from a resin composition prepared by blending (A) a heat-resistant resin that exhibits a relative permittivity of 2.3 or more at a frequency of 1 MHz with (B) polyolefin particles having a mean particle diameter of 100 [mu]m or less. The resin composition has both a continuous phase of the heat-resistant resin (A) and a dispersed phase of the polyolefin particles (B), with the relative permittivity of the resin composition being lower than that of the heat-resistant resin (A).

Abstract translation: 提供一种金属 - 树脂复合材料，其具有由具有低介电常数或低介电损耗角正切的耐热树脂组合物构成的层。 复合材料可以表现出低的热膨胀系数和降低的电信号的传输损耗。 复合材料包括金属和树脂层（I）。 树脂层（I）由树脂组合物制成，该树脂组合物通过将（A）在1MHz的频率下显示出相对介电常数为2.3以上的耐热性树脂（A）与（B）平均粒径为 100微米或更小。 树脂组合物具有耐热性树脂（A）的连续相和聚烯烃粒子（B）的分散相，树脂组合物的相对介电常数低于耐热性树脂（A）的相对介电常数， 。

公开(公告)号：US08220147B2

公开(公告)日：2012-07-17

申请号：US12541568

申请日：2009-08-14

Applicant: Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

Inventor： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

IPC: H05K3/02 ,  H05K3/10 ,  H01K3/22 ,  H01K3/00

CPC classification number: H05K3/246 ,  G03G15/6585 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T428/12097 ,  Y10T428/12104 ,  Y10T428/12111 ,  Y10T428/24917 ,  H01L2924/00

Abstract: According to one mode of the present invention, metal-containing resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having a ratio of weight of absorbed moisture to weight of resin from 500 to 14500 ppm, and fine metal particles contained in said resin, is provided.

Abstract translation: 根据本发明的一个方式，由含有50重量％以上的热固性树脂的树脂构成的含有氧化物的树脂粒子，其吸水重量与树脂重量比为500〜14500ppm，细金属 提供了包含在所述树脂中的颗粒。

公开(公告)号：US20120048606A1

公开(公告)日：2012-03-01

申请号：US12673443

申请日：2008-07-29

Applicant: Hiroyuki Izawa ,  Toshiaki Shirasaka ,  Shigeki Katogi ,  Sunao Kudou ,  Keiko Tomizawa

Inventor： Hiroyuki Izawa ,  Toshiaki Shirasaka ,  Shigeki Katogi ,  Sunao Kudou ,  Keiko Tomizawa

IPC: H05K1/02 ,  C08F230/08 ,  C09J133/10 ,  H01B1/12 ,  C08K5/521 ,  C09J175/04 ,  C09J179/08 ,  C08F220/18 ,  C09J163/00

CPC classification number: H05K3/323 ,  C08G77/442 ,  C08L83/00 ,  C09J133/04 ,  C09J183/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/19042 ,  H05K2201/0212 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer or complexes thereof, alkyl (meth)acrylate ester-silicone copolymer or complexes thereof and silicone-(meth)acrylic acid copolymer or complexes thereof.

Abstract translation: 本发明的粘合剂组合物含有（a）包含选自（甲基）丙烯酸烷基酯 - 丁二烯 - 苯乙烯共聚物或其络合物中的至少一种的有机细颗粒，（甲基）丙烯酸烷基酯 - 硅氧烷共聚物或其配合物 硅氧烷 - （甲基）丙烯酸共聚物或其复合物。

公开(公告)号：US20110120767A1

公开(公告)日：2011-05-26

申请号：US12674987

申请日：2008-05-20

Applicant: Daisuke Sato ,  Hiroki Ozeki ,  Tomoyuki Ishimatsu

Inventor： Daisuke Sato ,  Hiroki Ozeki ,  Tomoyuki Ishimatsu

IPC: H01B1/12 ,  H01R4/04 ,  H05K13/00

CPC classification number: H01R4/04 ,  C08G2650/56 ,  C08L47/00 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J163/00 ,  C09J171/00 ,  H01R12/62 ,  H01R13/03 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0212 ,  Y10T156/1089

Abstract: An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film (2) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate (1). A flexible printed circuit board (3) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board (3) are in contact with the anisotropic conductive film (2). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes.

Abstract translation: 公开了可以产生高连接可靠性的各向异性导电膜，以及使用各向异性导电膜制造连接组件的方法。 各向异性导电膜（2）由包含聚丁二烯颗粒，阳离子可聚合树脂和阳离子固化剂的绝缘粘合剂树脂和分散在绝缘粘合树脂中的导电颗粒组成，各向异性导电膜的熔体粘度最低为300 至1000Pa·s。 该各向异性导电膜与玻璃基板（1）的端子电极接触。 将柔性印刷电路板（3）放置在各向异性导电膜的顶部，使得柔性印刷电路板（3）的端子电极与各向异性导电膜（2）接触。 将加热工具推到柔性印刷电路板一侧上以电连接端子电极。

公开(公告)号：US20110102385A1

公开(公告)日：2011-05-05

申请号：US12758824

申请日：2010-04-13

Applicant: Suk-Won JUNG ,  Woongkwon KIM ,  Daecheol KIM ,  SungHoon YANG ,  Sang Youn HAN ,  Byeonghoon CHO ,  Ki-Hun JEONG ,  Kyung-Sook JEON ,  jung suk BANG

Inventor： Suk-Won JUNG ,  Woongkwon KIM ,  Daecheol KIM ,  SungHoon YANG ,  Sang Youn HAN ,  Byeonghoon CHO ,  Ki-Hun JEONG ,  Kyung-Sook JEON ,  jung suk BANG

IPC: G06F3/038 ,  B05D5/12 ,  B05D3/14 ,  H05K1/02

CPC classification number: G02F1/13452 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/10136 ,  H05K2201/10674

Abstract: An anisotropic conductive film includes a first thin film layer including concave portions, conductive balls arranged in the concave portions, insulating balls disposed on and between the conductive balls and each having a diameter smaller than the conductive balls, and a second thin film layer disposed covering the insulating balls. A display apparatus includes a pad part and a driving chip, which are electrically connected by the anisotropic conductive film.

Abstract translation: 各向异性导电膜包括：第一薄膜层，包括凹部，布置在凹部中的导电球，设置在导电球之间和之间的绝缘球，每个具有小于导电球的直径;以及第二薄膜层， 绝缘球。 显示装置包括通过各向异性导电膜电连接的焊盘部分和驱动芯片。

公开(公告)号：US20110088935A1

公开(公告)日：2011-04-21

申请号：US12975421

申请日：2010-12-22

Applicant: Tomoyuki ISHIMATSU ,  Hiroki Ozeki ,  Hiroshi Hamachi

Inventor： Tomoyuki ISHIMATSU ,  Hiroki Ozeki ,  Hiroshi Hamachi

IPC: H05K1/09 ,  B32B37/00 ,  C09J163/00 ,  C09J133/08 ,  H01B1/02

CPC classification number: H05K3/323 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/4913 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/31663

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract translation: 本发明的目的在于提供能够降低应力同时保持高硬度的导电性粒子（即使在连接工序中被破碎的状态下也难以产生裂纹），并且能够确保不仅对于ITO基板的充分的导电性， 而且对于IZO基板，设置有导电颗粒的各向异性导电膜，设置有各向异性导电膜的接合结构以及使用各向异性导电膜的接合方法。 本发明的导电粒子包括聚合物细颗粒和形成在聚合物细颗粒的表面上的导电层，其中导电层的最外表面壳是镍 - 钯合金层。

公开(公告)号：US20100330364A1

公开(公告)日：2010-12-30

申请号：US12874945

申请日：2010-09-02

Applicant: Motohiro ARIFUKU ,  Itsuo WATANABE ,  Kouji MOTOMURA ,  Kouji KOBAYASHI ,  Yasushi GOTOH ,  Tohru FUJINAWA

Inventor： Motohiro ARIFUKU ,  Itsuo WATANABE ,  Kouji MOTOMURA ,  Kouji KOBAYASHI ,  Yasushi GOTOH ,  Tohru FUJINAWA

IPC: C09J7/02

CPC classification number: H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

公开(公告)号：US20100310828A1

公开(公告)日：2010-12-09

申请号：US12743054

申请日：2008-11-13

Applicant: Susumu Sakio ,  Hideo Takei ,  Kazuya Saito ,  Kazuhiro Watanabe ,  Shinsuke Iguchi ,  Hiroyuki Yamakawa ,  Kyuzou Nakamura ,  Yu-hsin Lin ,  Huang-choung Chang ,  Tung-jung Wu

Inventor： Susumu Sakio ,  Hideo Takei ,  Kazuya Saito ,  Kazuhiro Watanabe ,  Shinsuke Iguchi ,  Hiroyuki Yamakawa ,  Kyuzou Nakamura ,  Yu-hsin Lin ,  Huang-choung Chang ,  Tung-jung Wu

IPC: B32B3/30 ,  C23F1/00 ,  H01L33/00 ,  H01L31/18

CPC classification number: H05K3/381 ,  H01L31/02363 ,  H01L33/24 ,  H05K2201/0212 ,  H05K2203/095 ,  Y02E10/50 ,  Y10T428/24479

Abstract: [Object]To provide a substrate processing method capable of forming a concavo-convex structure on a substrate surface while reducing the number of processes.[Solving Means] In a substrate processing method according to the present invention, particles are dispersed on a surface of a substrate, and a concavo-convex structure is formed on the surface of the substrate by etching the surface of the substrate with the particles as a mask and the mask is simultaneously removed by the etching. According to this method, a process of removing the mask from the substrate surface after the concavo-convex structure is formed becomes unnecessary. Accordingly, since the number of processes necessary to form the concavo-convex structure on the substrate surface is largely reduced, it becomes possible to greatly improve productivity.

Abstract translation: 本发明提供能够在减少工序数的基板面上形成凹凸结构的基板加工方法。 具体实施方式在本发明的基板处理方法中，将粒子分散在基板的表面上，通过用该粒子刻蚀基板的表面，在基板的表面上形成凹凸结构 通过蚀刻同时去除掩模和掩模。 根据该方法，不需要在形成凹凸结构之后从基板表面除去掩模的工序。 因此，由于在基板表面上形成凹凸结构所需的工艺数量大大降低，因此可以大大提高生产率。

公开(公告)号：US20100276186A1

公开(公告)日：2010-11-04

申请号：US12438133

申请日：2007-07-30

Applicant: Hirofumi Sasaki ,  Atsushi Ito ,  Takashi Nishioka ,  Hirofumi Goto

Inventor： Hirofumi Sasaki ,  Atsushi Ito ,  Takashi Nishioka ,  Hirofumi Goto

IPC: H05K1/00 ,  G03F7/004

CPC classification number: H01L21/02118 ,  G03F7/0233 ,  G03F7/0388 ,  H01L21/02282 ,  H01L21/312 ,  H05K3/0023 ,  H05K3/287 ,  H05K3/4676 ,  H05K2201/0212

Abstract: A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.

Abstract translation: 一种能够形成层间绝缘膜或平坦化膜或表面保护膜的感光绝缘树脂组合物或用于高分辨率，粘附性，热冲击，电绝缘性，图案化性能等性能优异的高密度安装基板的绝缘膜， 伸长; 其硬化产物; 以及配备有硬化产品的电路板。 提供一种包含碱溶性树脂的正性感光绝缘树脂组合物; 具有醌二叠氮基的化合物; 和20〜90摩尔％成分衍生自羟基化和/或羧化单体的颗粒状共聚物的交联树脂颗粒。