公开(公告)号：US20140055968A1

公开(公告)日：2014-02-27

申请号：US14069054

申请日：2013-10-31

Applicant: Kong-Chen Chen

Inventor： Kong-Chen Chen

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/64 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/181 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/086 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.

Abstract translation: 呈现电子设备用于集成电路部件的第一焊盘触点和基本上位于目标平台的第一平面中的目标触点之间的电连接。 电子设备包括基本上平行于第一平面的第一表面和基本上平行于第一平面的第一表面下方的第二表面。 第一表面包括第一接触区域，被配置为当电子设备连接在第一焊盘触点和目标触点之间时连接到第一焊盘触点。 第二表面包括被配置为当电子设备连接在第一焊盘触点和目标触点之间时连接到目标触点的第二触点区域。 电子设备还包括连接在第一和第二接触区域之间的多个电动无源元件。

公开(公告)号：US08642462B2

公开(公告)日：2014-02-04

申请号：US12100380

申请日：2008-04-09

Applicant: Terry Lee Sterrett ,  Richard J. Harries

Inventor： Terry Lee Sterrett ,  Richard J. Harries

IPC: H01L21/44

CPC classification number: H01L24/14 ,  B29C39/026 ,  B29C70/58 ,  B29C70/882 ,  B29L2031/3406 ,  C08J5/10 ,  C08L101/12 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K3/321 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/05099

Abstract: Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.

Abstract translation: 公开了用于增加互连凸块的互连区域的方法和设计。 互连凸块可以形成在衬底上，使得互连凸块延伸超过接触焊盘到衬底上。 可以在更大的接触焊盘上形成互连凸块，凸块具有大的直径。

公开(公告)号：US08593825B2

公开(公告)日：2013-11-26

申请号：US12631649

申请日：2009-12-04

Applicant: Kong-Chen Chen

Inventor： Kong-Chen Chen

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H01L23/64 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/181 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/086 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract translation: 公开了用于构造垂直配置的无源电子部件的制造技术。 电动无源部件构造成基本上垂直于包括第一平面的靶平台的结构，以提供更大的电极接触面积和更小的物理尺寸。 被构造为基本上垂直于与目标平台相关的平面的被动部件可以直接连接到集成电路或基板的焊盘触点，或者可以嵌入封装中以减少被动部件的面积开销，同时提高 被动元件在其应用中。

公开(公告)号：US20130203274A1

公开(公告)日：2013-08-08

申请号：US13762710

申请日：2013-02-08

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Guenther Kraft ,  Eric Heneka ,  Armin Ganz ,  Juergen Schroeder ,  Tilo Trumpp

IPC: H01R12/52

CPC classification number: H01R12/52 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1572 ,  Y02P70/611

Abstract: A circuit board system, a circuit board arrangement and a method for producing a circuit board arrangement are disclosed. The system comprises a first circuit board and a second circuit board, each having a top side and a bottom side; at least one first electronic component mounted on the bottom side of the second circuit board. The first circuit board has, on its top side, a plurality of electrically conductive first contact elements. The second circuit board has, on its bottom side, a plurality of electrically conductive second contact elements. Further, a recess is formed in the first circuit board. The second circuit board is mountable on the first circuit board such that the bottom side of the second circuit board faces towards the top side of the first circuit board, that the at least one first electronic component is arranged at least partly in the recess; and that each of the first contact elements matches one of the second contact elements.

Abstract translation: 公开了一种电路板系统，电路板装置和用于制造电路板装置的方法。 该系统包括第一电路板和第二电路板，每个具有顶侧和底侧; 安装在第二电路板的底侧上的至少一个第一电子部件。 第一电路板在其顶侧上具有多个导电的第一接触元件。 第二电路板在其底侧具有多个导电的第二接触元件。 此外，在第一电路板中形成凹部。 第二电路板可安装在第一电路板上，使得第二电路板的底侧朝向第一电路板的顶侧，至少一个第一电子部件至少部分地设置在凹部中; 并且每个第一接触元件匹配第二接触元件中的一个。

公开(公告)号：US08500984B2

公开(公告)日：2013-08-06

申请号：US12490470

申请日：2009-06-24

Applicant: Yoshimi Egawa ,  Harufumi Kobayashi

Inventor： Yoshimi Egawa ,  Harufumi Kobayashi

IPC: C25D5/02 ,  H05K3/02 ,  H01K3/10

CPC classification number: H05K3/242 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/111 ,  H05K1/114 ,  H05K3/06 ,  H05K3/42 ,  H05K2201/09254 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1572 ,  H05K2203/175 ,  Y10T29/49156 ,  Y10T29/49162 ,  H01L2924/00014

Abstract: A method for manufacturing a printed circuit board having an insulative board and a plurality of electroconductive pads arranged in a grid shape on the insulative board, the method including a step for forming an electroconductive film on the insulative board; a step for forming a pattern on the electroconductive film so as to form the electroconductive pads, a lead wire connected to at least one of the electroconductive pads, and inter-pad wiring for electrically connecting each of the electroconductive pads not connected to the lead wire to any of the electroconductive pads connected to the lead wire, the inter-pad wiring being disposed between mutually adjacent electroconductive pads; a step for plating each of the electroconductive pads by immersing the insulative board in a plating bath and energizing each of the electroconductive pads through the lead wire; and a step for removing the inter-pad wiring.

Abstract translation: 一种用于制造印刷电路板的方法，所述印刷电路板具有绝缘板和在所述绝缘板上排列成格子状的多个导电焊盘，所述方法包括在所述绝缘板上形成导电膜的步骤; 用于在导电膜上形成图形以形成导电焊盘的步骤，连接到至少一个导电焊盘的引线和用于电连接未连接到引线的每个导电焊盘的衬垫布线 连接到引线的任何导电焊盘，衬垫布线设置在相互相邻的导电焊盘之间; 通过将绝缘板浸入电镀槽中并对每个导电焊盘进行电镀，并通过引线激励每个导电焊盘; 以及去除垫间布线的步骤。

公开(公告)号：US20130087371A1

公开(公告)日：2013-04-11

申请号：US13270268

申请日：2011-10-11

Applicant: Georg Meyer-Berg

Inventor： Georg Meyer-Berg

IPC: H05K1/09 ,  H01R9/00 ,  H05K1/11

CPC classification number: H01L24/03 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/03332 ,  H01L2224/03442 ,  H01L2224/03515 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0529 ,  H01L2224/053 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0579 ,  H01L2224/058 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/3512 ,  H05K3/3436 ,  H05K2201/10719 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01026 ,  H01L2924/0105 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A surface mount packaging connector includes an elastic conductor, an interconnect pad, and a conductive layer. The elastic conductor has a top surface. The interconnect pad is electrically coupled to the elastic conductor. The top surface of the elastic conductor is arranged away from the interconnect pad. The conductive layer is on the top surface of the elastic conductor. The conductive layer provides an increased electrically conductive surface area and may also be a solderable surface.

Abstract translation: 表面贴装封装连接器包括弹性导体，互连焊盘和导电层。 弹性导体具有顶面。 互连焊盘电耦合到弹性导体。 弹性导体的顶表面远离互连垫布置。 导电层位于弹性导体的顶表面上。 导电层提供增加的导电表面积并且还可以是可焊接表面。

公开(公告)号：US20120127674A1

公开(公告)日：2012-05-24

申请号：US13362742

申请日：2012-01-31

Applicant: Thomas H. Kinsley

Inventor： Thomas H. Kinsley

IPC: H05K7/00

CPC classification number: H01L25/0657 ,  H01L24/72 ,  H01L25/0652 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/325 ,  H05K2201/10598 ,  H05K2201/10719 ,  H01L2924/00

Abstract: Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such semiconductor device assemblies. Fasteners for securing together such elements include an elongated portion, a first end piece, and a second end piece. Methods of securing together a plurality of semiconductor devices include inserting an elongated portion of a fastener through an aperture in a first semiconductor device and an aperture in at least one additional semiconductor device. Circuit boards include a plurality of apertures disposed in an array corresponding to an array of apertures in a semiconductor device assembly. Each aperture is sized and configured to receive a fastener for maintaining an assembled relationship between the semiconductor device assembly and the circuit board.

Abstract translation: 半导体器件组件包括诸如电子部件的元件和通过紧固件固定在一起的基板，该紧固件包括连续延伸穿过两个或更多个这样的元件中的孔的细长部分。 计算机系统包括这样的半导体器件组件。 用于将这些元件固定在一起的紧固件包括细长部分，第一端部件和第二端部件。 将多个半导体器件固定在一起的方法包括通过第一半导体器件中的孔和至少一个附加半导体器件中的孔插入紧固件的细长部分。 电路板包括与半导体器件组件中的孔阵列对应设置的多个孔。 每个孔的尺寸和构造被设计成接收用于维持半导体器件组件和电路板之间的组装关系的紧固件。

公开(公告)号：US08174106B2

公开(公告)日：2012-05-08

申请号：US11511815

申请日：2006-08-29

Applicant: Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

Inventor： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

IPC: H01L23/02

CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

公开(公告)号：US08066517B2

公开(公告)日：2011-11-29

申请号：US12931518

申请日：2011-02-03

Applicant: James V. Russell

Inventor： James V. Russell

IPC: H01R9/09

CPC classification number: H01R13/2414 ,  H01R4/58 ,  H01R13/03 ,  H05K3/245 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/10719

Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.

公开(公告)号：US08039944B2

公开(公告)日：2011-10-18

申请号：US12222255

申请日：2008-08-06

Applicant: Ted Ju

Inventor： Ted Ju

IPC: H01L23/48

CPC classification number: H05K7/1069 ,  H01R12/7076 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10598 ,  H05K2201/10719 ,  H05K2201/10946 ,  H05K2203/0271 ,  H05K2203/167

Abstract: An electrical connection device and assembly method thereof includes a substrate with a plurality of contacting portions arranged on a surface thereof; a chip module having a plurality of terminals inclining in one direction and compressed and contacted with the contacting portions correspondingly; at least one restricting structure which restricts the chip module to move a distance relative to the substrate depending on the compression deformation of the terminals when the terminals are contacted with the contacting portions; and at least one elastic element just producing deformation when the chip module moves the distance. When the terminals are compressed and contacted with the contacting portions, the restricting structure restricts the chip module to move the distance depending on the compression deformation of the terminals, so that the elastic element just produces deformation, which make the chip module only move in the direction opposite to the deformation direction of the terminals.

Abstract translation: 一种电连接装置及其组装方法，包括：具有布置在其表面上的多个接触部分的基板; 芯片模块，其具有多个端子，其一个方向倾斜并且相应地与所述接触部分压缩和接触; 至少一个限制结构，其限制当所述端子与所述接触部分接触时，所述芯片模块相对于所述基板相对于所述端子的压缩变形而相对于所述基板移动一定距离; 并且至少一个弹性元件刚好在芯片模块移动距离时产生变形。 当端子被压缩并与接触部分接触时，限制结构限制芯片模块根据端子的压缩变形移动距离，使得弹性元件刚刚产生变形，这使得芯片模块仅在 方向与端子的变形方向相反。