公开(公告)号：US09967966B2

公开(公告)日：2018-05-08

申请号：US15063119

申请日：2016-03-07

Applicant: SEW-EURODRIVE GMBH & CO. KG

Inventor： Harald Schaefer

IPC: G01K1/14 ,  G01K1/16 ,  G01K1/24 ,  H05K1/02 ,  H01L23/34 ,  H01L23/373 ,  H01L23/62 ,  H01L23/40 ,  H05K3/00

CPC classification number: H05K1/0203 ,  H01L23/34 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/62 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.

公开(公告)号：US20180120968A1

公开(公告)日：2018-05-03

申请号：US15795200

申请日：2017-10-26

Applicant: Jui-Jen Yueh ,  Chung-Wen Yen ,  Chao-Hsiang Wang

Inventor： Jui-Jen Yueh ,  Chung-Wen Yen ,  Chao-Hsiang Wang

IPC: G06F3/041 ,  H05K1/11 ,  H05K3/40

CPC classification number: G06F3/041 ,  G06F3/0416 ,  G06F2203/04103 ,  H05K1/0271 ,  H05K1/0281 ,  H05K1/115 ,  H05K1/116 ,  H05K3/245 ,  H05K3/4053 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: An electronic device is provided. The electronic device includes a substrate, a first contacting element, a second contacting element and a connecting element. The substrate has a first surface and a second surface. The substrate has a through hole located between the first surface and the second surface. At least a part of the connecting element is disposed in the through hole. The first contacting element is disposed on the first surface. The second contacting element is disposed on the second surface. The first contacting element electrically connects the second contacting element through the connecting element.

公开(公告)号：US09888583B2

公开(公告)日：2018-02-06

申请号：US14815413

申请日：2015-07-31

Applicant: MINEBEA CO., LTD.

Inventor： Dohaku Inamori ,  Takashi Kashino

IPC: H05K1/00 ,  H05K3/36 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/118 ,  H05K1/0393 ,  H05K1/113 ,  H05K1/116 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/1178

Abstract: There is provided a flexible printed circuit board. The flexible printed circuit board includes: a flexible insulation layer having a first surface and a second surface; a first land which is conductive and which is provided on the first surface of the flexible insulation layer; and a conductive member which is provided on the second surface of the flexible insulation layer. A recess is formed on the first land.

公开(公告)号：US09832878B2

公开(公告)日：2017-11-28

申请号：US14819579

申请日：2015-08-06

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu ,  Makoto Terui ,  Ryojiro Tominaga ,  Yuichi Nakamura

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/185 ,  H05K1/0224 ,  H05K3/305 ,  H05K3/429 ,  H05K3/4694 ,  H05K2201/09536 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/2072

Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.

公开(公告)号：US20170164473A1

公开(公告)日：2017-06-08

申请号：US15351814

申请日：2016-11-15

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tatsuaki DENDA ,  Osamu HOSHINO

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/49534 ,  H05K1/181 ,  H05K3/005 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/427 ,  H05K3/428 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10234 ,  H05K2201/10545 ,  H05K2203/0733

Abstract: A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.

公开(公告)号：US20160343915A1

公开(公告)日：2016-11-24

申请号：US15158139

申请日：2016-05-18

Applicant: NICHIA CORPORATION

Inventor： Ryosuke WAKAKI

IPC: H01L33/48 ,  H01L33/24 ,  H01L33/62

CPC classification number: H01L33/62 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.

Abstract translation: 半导体器件包括：具有第一表面和第二表面的焊盘的安装基板，包括设置在第一表面上的外部连接端子的侧面发光型发光器件，以及至少设置在第一表面上的接合部件 在第二表面上连接外部连接端子和焊盘。

公开(公告)号：US20160133553A1

公开(公告)日：2016-05-12

申请号：US14936053

申请日：2015-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Yeol PARK

IPC: H01L23/498 ,  H05K3/22 ,  H01L21/768 ,  H05K3/06

CPC classification number: H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2224/11 ,  H05K3/244 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/107

Abstract: A printed circuit board includes: an insulation layer including circuit patterns, the circuit patterns having a groove formed therein; a metal protection layer (disposed in the groove; a solder resist layer disposed on the insulation layer and having an opening exposing the circuit patterns; and a solder bump disposed on the opening.

Abstract translation: 印刷电路板包括：包括电路图案的绝缘层，其中形成有凹槽的电路图案; 金属保护层（设置在凹槽中;阻焊层设置在绝缘层上并具有露出电路图案的开口;以及设置在开口上的焊料凸块。

公开(公告)号：US09245829B2

公开(公告)日：2016-01-26

申请号：US13949206

申请日：2013-07-23

Applicant: OMRON Corporation

Inventor： Shintaro Hara ,  Shoichi Konagata ,  Yuzo Iwasaki ,  Tomonori Shiraishi

IPC: H01L23/48 ,  H01L23/492 ,  H01L23/00 ,  H05K1/11 ,  H01L23/13 ,  H05K3/34

CPC classification number: H01L23/492 ,  H01L23/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/13033 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10053 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/37099

Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.

Abstract translation: 本发明提供一种能够有效地防止由于回流焊接期间焊剂蒸发引起的爆炸而产生的焊球的散射以及熔融焊料向周围扩散的基板结构。 在基板上，通过焊膏安装半导体芯片。 基板设置有连续或不连续地包围焊膏的槽部。

公开(公告)号：US20160021780A1

公开(公告)日：2016-01-21

申请号：US14797304

申请日：2015-07-13

Applicant: Infineon Technologies AG

Inventor： Alexander Schwarz

IPC: H05K7/20 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K7/205 ,  H01L23/13 ,  H01L23/15 ,  H01L23/367 ,  H01L23/49838 ,  H01L2224/32225 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/09036 ,  H05K2201/09745

Abstract: A semiconductor module includes a carrier having a first carrier surface and a second carrier surface opposite the first carrier surface, a first semiconductor chip mounted over the first carrier surface and a heatsink coupled to the second carrier surface with a first heatsink surface facing the carrier. The second carrier surface or the first heatsink surface has at least one cavity in the form of one or more of dimples and trenches.

Abstract translation: 半导体模块包括具有第一载体表面和与第一载体表面相对的第二载体表面的载体，安装在第一载体表面上的第一半导体芯片和耦合到第二载体表面的散热器，其具有面向载体的第一散热器表面。 第二载体表面或第一散热表面具有凹坑和沟槽中的一个或多个形式的至少一个空腔。

公开(公告)号：US09233436B2

公开(公告)日：2016-01-12

申请号：US14017399

申请日：2013-09-04

Applicant: Daniel Wolde-Giorgis ,  Thomas Kalich

Inventor： Daniel Wolde-Giorgis ,  Thomas Kalich

IPC: B23K31/02 ,  B23K31/00 ,  B23K35/02 ,  H01L23/13 ,  H01L23/373 ,  H01L23/00 ,  H05K3/32 ,  H05K1/03

CPC classification number: B23K35/025 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/75315 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15156 ,  H01L2924/15747 ,  H05K1/0306 ,  H05K3/321 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/1131 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.