公开(公告)号：US5328521A

公开(公告)日：1994-07-12

申请号：US28482

申请日：1993-03-08

Applicant: Roupen L. Keusseyan

Inventor： Roupen L. Keusseyan

IPC: B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/26 ,  B23K35/268 ,  B23K2201/36 ,  B23K35/262 ,  H05K2201/0272 ,  H05K3/3463

Abstract: A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.

Abstract translation: 一种焊膏组合物，其包含（a）4-96重量％的细分散的共晶或假共晶金属合金或混合物的颗粒; （b）96​​-4％（重量）由（a）中的金属合金构成的金属添加剂的纯金属，其混合物或合金的熔点至少为30℃的细碎颗粒; 和（c）有机介质。 该浆料特别适用于将金属化部件表面安装在微电子封装中的金属化基板上。

公开(公告)号：US5180523A

公开(公告)日：1993-01-19

申请号：US436199

申请日：1989-11-14

Applicant: David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Weiu

Inventor： David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Weiu

IPC: C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shrinkage of the polymeric carrier upon curing.

Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积收缩结果确定粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

公开(公告)号：US4767471A

公开(公告)日：1988-08-30

申请号：US915218

申请日：1986-10-03

Applicant: Neil R. McLellan

Inventor： Neil R. McLellan

IPC: B23K35/22 ,  B23K1/015 ,  B23K35/26 ,  B23K35/36 ,  H05K3/34 ,  B23K35/34

CPC classification number: B23K35/36 ,  B23K35/26 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K3/3463

Abstract: A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

公开(公告)号：US12091567B2

公开(公告)日：2024-09-17

申请号：US17591264

申请日：2022-02-02

Applicant: Kuprion, Inc.

Inventor： Zhenggang Li ,  Yeng Ming Lam ,  Chee Lip Gan ,  Jaewon Kim ,  Alfred A. Zinn

IPC: C09D11/52 ,  B22F1/052 ,  B22F1/0545 ,  B22F1/102 ,  B41M5/00 ,  B41M7/00 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/38 ,  H01B1/02 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  B22F7/08 ,  B22F10/10 ,  B22F10/25 ,  B22F10/28 ,  B22F10/40 ,  B22F10/64

CPC classification number: C09D11/52 ,  B22F1/052 ,  B22F1/0545 ,  B22F1/102 ,  B41M5/0023 ,  B41M7/009 ,  B82Y40/00 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/38 ,  H01B1/026 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0016 ,  H05K1/097 ,  H05K3/1283 ,  B22F7/08 ,  B22F10/10 ,  B22F10/25 ,  B22F10/28 ,  B22F10/40 ,  B22F10/64 ,  B22F2998/10 ,  B22F2999/00 ,  B82Y30/00 ,  H05K2201/0245 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272 ,  B22F2999/00 ,  B22F1/054 ,  B22F1/0547 ,  B22F1/065 ,  B22F1/0551 ,  B22F2998/10 ,  B22F10/10 ,  B22F3/10 ,  B22F2999/00 ,  B22F1/065 ,  B22F1/054 ,  B22F1/0551 ,  B22F1/0547 ,  B22F2999/00 ,  B22F1/056 ,  B22F1/0547 ,  B22F1/065 ,  B22F1/0551 ,  B22F2999/00 ,  B22F1/065 ,  B22F1/056 ,  B22F1/0551 ,  B22F1/0547

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

公开(公告)号：US09914855B2

公开(公告)日：2018-03-13

申请号：US14620576

申请日：2015-02-12

Applicant: HENKEL AG & CO. KGAA

Inventor： Anja Henckens ,  Nabila Idrissi

IPC: C09J9/02 ,  C09J5/06 ,  C09J11/04 ,  H05K3/32 ,  C09J163/00 ,  B32B37/12 ,  B32B37/18 ,  C09J133/00 ,  C08K3/08 ,  C08K3/10 ,  H01R4/04 ,  H05K1/05 ,  H05K3/36

CPC classification number: C09J9/02 ,  B32B37/1284 ,  B32B37/18 ,  C08K3/08 ,  C08K3/10 ,  C09J5/06 ,  C09J11/04 ,  C09J133/00 ,  C09J163/00 ,  C09J2203/322 ,  C09J2400/163 ,  C09J2433/00 ,  H01R4/04 ,  H05K1/053 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention relates to curable compositions that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The curable compositions comprise a) one or more curable resins; b) composite particles, which comprise i) an electrically conductive core, and ii) an electrically conductive shell, comprising one or more shell materials each selected from the group consisting of metal carbides, metal sulfides, metal borides, metal silicides, and metal nitrides; and c) electrically conductive particles different from component b). The present invention further relates to a method of bonding a first substrate to a second substrate, wherein the substrates are bonded under heat and pressure using said curable composition.

公开(公告)号：US09796052B2

公开(公告)日：2017-10-24

申请号：US14389668

申请日：2012-03-30

Applicant: Teruo Komatsu ,  Ryo Matsubayashi

Inventor： Teruo Komatsu ,  Ryo Matsubayashi

IPC: B23K35/00 ,  B23K35/22 ,  B23K35/02 ,  H01B1/22 ,  B22F1/00 ,  H01B1/02 ,  H05K1/09 ,  B23K1/20 ,  B23K35/30 ,  B23K35/36 ,  B22F7/06

CPC classification number: B23K35/025 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B23K1/20 ,  B23K35/302 ,  B23K35/3612 ,  H01B1/026 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0272

Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

公开(公告)号：US20170181279A1

公开(公告)日：2017-06-22

申请号：US15325289

申请日：2015-07-10

Applicant: MATERIAL COCEPT, INC.

Inventor： Junichi KOIKE ,  Daisuke ANDO ,  Yuji SUTOU

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/09 ,  H01G2/06 ,  H01G4/008 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K3/10 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4007 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2203/086 ,  H05K2203/087

Abstract: To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.

公开(公告)号：US09670385B2

公开(公告)日：2017-06-06

申请号：US15116081

申请日：2015-02-13

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Akira Ishigami ,  Masaharu Aoki

IPC: H01L33/00 ,  C09J9/02 ,  H01L33/62 ,  C09J11/04 ,  H01L33/60 ,  C09J163/00 ,  C08K9/02 ,  C08K3/22 ,  H01L33/64

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

公开(公告)号：US09301403B2

公开(公告)日：2016-03-29

申请号：US14606305

申请日：2015-01-27

Applicant: Fuji Electric Co., Ltd. ,  Nihon Handa Co., Ltd.

Inventor： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

IPC: H05K3/34 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  C22C1/04 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

Abstract translation: 通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有大于共晶组合物（3.5重量％银）中的银量的给定银量，第二粉末合金的银量为共晶组合物中的银量 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。 这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。 它基于廉价的Sn-Ag-Cu焊料合金。 适用于符合温度梯度键合的高温侧无铅焊料。 还提供了一种焊接方法。

公开(公告)号：US09162324B2

公开(公告)日：2015-10-20

申请号：US12084793

申请日：2006-11-10

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

IPC: B23K35/362 ,  B23K35/26 ,  B23K35/02 ,  B23K35/30 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract translation: 本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性， 温度焊接。 焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。