公开(公告)号：US06322736B1

公开(公告)日：2001-11-27

申请号：US09393032

申请日：1999-09-09

申请人： Zhenan Bao ,  John A. Rogers

发明人： Zhenan Bao ,  John A. Rogers

IPC分类号： B29C3338

CPC分类号： G03F7/0002 ,  B29C33/0061 ,  B29C33/405 ,  B29C33/42 ,  B29C39/24 ,  B82Y10/00 ,  B82Y40/00

摘要： An improved elastomeric mold for use in fabricating microstructures, the mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including an access opening or filling member that extends through the mold to the first surface and communicates with the recessed microchannel. The mold is used by placing it onto a substrate with the recessed microchannel facing the substrate. The access opening of the mold is filled with a liquid material which is capable of solidifying. The access opening continuously introduces the liquid material into the space defined between the microchannel and the substrate. After the liquid material solidifies, the mold is removed from the substrate thereby leaving a microstructure formed from the solidified liquid material on the substrate.

摘要翻译： 一种用于制造微结构的改进的弹性体模具，所述模具具有第一和第二表面，所述第一表面包括至少一个凹入的微通道，所述第二表面包括通过所述模具延伸到所述第一表面并与 嵌入式微通道。 通过将模具放置在具有凹陷的微通道面向衬底的衬底上而被使用。 模具的进入口填充有能够固化的液体材料。 进入开口将液体材料连续地引入到限定在微通道和基底之间的空间中。 在液体材料固化之后，将模具从基材上除去，从而在基板上留下由固化的液体材料形成的微结构。

公开(公告)号：US6016202A

公开(公告)日：2000-01-18

申请号：US885555

申请日：1997-06-30

申请人： Martin Fuchs ,  John A. Rogers ,  Matthew J. Banet

发明人： Martin Fuchs ,  John A. Rogers ,  Matthew J. Banet

IPC分类号： G01B11/06 ,  G01B21/08 ,  G01N21/00 ,  G01N21/17 ,  G01N21/41 ,  G01N21/47 ,  G01N21/63 ,  G01B9/02

CPC分类号： G01B11/0666 ,  G01B11/06 ,  G01B21/085 ,  G01N21/1717 ,  G01N21/636

摘要： The invention provides an apparatus for measuring a property of a sample (using, e.g., ISTS) that includes: 1) an excitation laser that generates an excitation laser beam; 2) an optical system aligned along an optical axis that separates the excitation laser beam into at least three sub-beams; 3) an imaging system aligned along the optical axis that collects the sub-beams and focuses them onto the sample to form an optical interference pattern that generates a time-dependent response in the sample; 4) a probe laser that generates a probe laser beam that diffracts off the time-dependent response to form a signal beam; 5) a detector that detects the signal beam and in response generates a radiation-induced electronic response; and 6) a processor that processes the radiation-induced electronic response to determine the property of the sample.

公开(公告)号：US5982482A

公开(公告)日：1999-11-09

申请号：US903901

申请日：1997-07-31

申请人： Keith A. Nelson ,  John A. Rogers

发明人： Keith A. Nelson ,  John A. Rogers

IPC分类号： G01N29/24 ,  G01N29/44 ,  G01N29/04

CPC分类号： G01N29/4427 ,  G01N29/2418 ,  G01N2291/011 ,  G01N2291/015 ,  G01N2291/0231 ,  G01N2291/2698

摘要： The invention features a method for detecting a subsurface defect in a thin film structure. The method includes: optically generating an acoustic wave in a first spatial region of the film; optically measuring a time-dependent reflection of the acoustic wave from subsurface features in the film to produce a time-dependent signal; and analyzing the signal to detect an existence of the defect. The optically measuring step can include measuring the diffraction of a probe beam from the reflected acoustic wave. The analyzing step can include comparing the measured signal to a reference signal for defect-free structure.

摘要翻译： 本发明的特征在于一种用于检测薄膜结构中的地下缺陷的方法。 该方法包括：在胶片的第一空间区域中光学地产生声波; 光学地测量来自薄膜中的地下特征的声波的时间依赖性反射以产生时间相关信号; 并分析信号以检测缺陷的存在。 光学测量步骤可以包括测量来自反射声波的探测光束的衍射。 分析步骤可以包括将测量的信号与用于无缺陷结构的参考信号进行比较。

公开(公告)号：US5951881A

公开(公告)日：1999-09-14

申请号：US681235

申请日：1996-07-22

申请人： John A. Rogers ,  Rebecca J. Jackman ,  George M. Whitesides

发明人： John A. Rogers ,  Rebecca J. Jackman ,  George M. Whitesides

IPC分类号： B05D1/28 ,  G03F7/00 ,  G03F7/16 ,  G03F7/18 ,  G03F7/24 ,  H01F41/04 ,  H01L22/027

CPC分类号： G02B6/02142 ,  B05D1/283 ,  B82Y30/00 ,  B82Y40/00 ,  G02B6/02138 ,  G03F7/00 ,  G03F7/161 ,  G03F7/18 ,  G03F7/24 ,  H01F41/042 ,  G02B6/02152

摘要： Techniques for fabrication of small-scale metallic structures such as microinductors, microtransformers and stents are described. A chemically active agent such as a catalyst is applied from an applicator in a pattern to an exterior surface of an article, metal is deposited according to the pattern and optionally, removed from the substrate. Where the substrate is cylindrical, the pattern can serve as a stent. Alternatively, a pattern of a self-assembled monolayer can be printed on a surface, which pattern can dictate metal plating or etching resulting in a patterned metal structure that can be cylindrical. In another embodiment, a structure is patterned on a surface that serves as a phase-modulating pattern or amplitude-modulating pattern. The article subsequently is exposed to radiation that can induce a change in refractive index within the article, and the phase-modulating or amplitude-modulating pattern results in different indices of refraction being created in different portions of the article. By this technique, a grating can be written into a core of an optical fiber.

摘要翻译： 描述了微型电感器，微型变压器和支架等小型金属结构的制造技术。 将化学活性剂如催化剂从涂布器以图案施加到制品的外表面，根据图案沉积金属，并任选地从基材上除去金属。 在基底为圆柱形的情况下，图案可用作支架。 或者，自组装单层的图案可以印刷在表面上，该图案可以规定金属电镀或蚀刻，导致可以是圆柱形的图案化金属结构。 在另一个实施例中，在用作相位调制图案或幅度调制图案的表面上图案化结构。 该物品随后暴露于可引起制品内的折射率变化的辐射，并且相位调制或幅度调制图案导致在制品的不同部分产生不同的折射率。 通过这种技术，可以将光栅写入光纤的核心。

公开(公告)号：US5812261A

公开(公告)日：1998-09-22

申请号：US783046

申请日：1997-01-15

申请人： Keith A. Nelson ,  John A. Rogers ,  Matthew J. Banet ,  John Hanselman ,  Martin Fuchs

发明人： Keith A. Nelson ,  John A. Rogers ,  Matthew J. Banet ,  John Hanselman ,  Martin Fuchs

IPC分类号： B82B1/00 ,  G01B11/06 ,  G01N21/17 ,  G01N21/63 ,  G01N29/24 ,  G01N33/44 ,  G01J3/30

CPC分类号： G01N21/1702 ,  G01B11/0666 ,  G01N21/636 ,  G01N29/2418 ,  G01N29/449 ,  G01N2291/0423 ,  G01N33/44

摘要： A method for determining the thickness of a thin sample is described. The method includes the step of exciting time-dependent acoustic waveguide modes in the sample with an excitation radiation field. The acoustic waveguide modes are detected by diffracting probe radiation off a ripple morphology induced on the sample's surface by the acoustic waveguide modes. The diffracted probe radiation is then analyzed to measure phase velocities or frequencies of the acoustic waveguide modes. A thickness of the thin sample is determined by comparing the measured phase velocities or frequencies to the phase velocities or frequencies calculated from a mathematical model.

公开(公告)号：US09161448B2

公开(公告)日：2015-10-13

申请号：US13352876

申请日：2012-01-18

申请人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

发明人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

IPC分类号： H01L21/00 ,  H05K1/18 ,  H01L21/683 ,  H01L21/768 ,  H01L23/48 ,  H01L27/12 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/048 ,  H05K13/04 ,  H01L23/544 ,  H01L23/00 ,  H01S5/022

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/7806 ,  H01L23/481 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/799 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L24/98 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/043 ,  H01L31/048 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/9512 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/49124 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

摘要翻译： 打印可转移部件的方法包括在目标基板上按压包括至少一个可转移半导体部件的印模，使得至少一个可转印部件和目标基板的表面接触导电共晶层的相对表面。 在压印目标基板上的印模时，将至少一个可转印部件暴露于电磁辐射，该电磁辐射被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。

公开(公告)号：US08754396B2

公开(公告)日：2014-06-17

申请号：US13441618

申请日：2012-04-06

申请人： John A. Rogers ,  Dahl-Young Khang ,  Yugang Sun ,  Etienne Menard

发明人： John A. Rogers ,  Dahl-Young Khang ,  Yugang Sun ,  Etienne Menard

IPC分类号： H01L29/72

CPC分类号： H01L23/5387 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02422 ,  H01L21/02521 ,  H01L21/02532 ,  H01L21/02546 ,  H01L21/02628 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/564 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L27/1266 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/151 ,  H01L29/158 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2221/68368 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/80894 ,  H01L2224/8385 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/0277 ,  H05K1/0283 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

摘要翻译： 本发明提供了拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的可拉伸和可选择的可印刷的半导体和电子电路。 本发明的可拉伸半导体和电子电路除了具有可拉伸性以外，对于一些应用而言是优选的，因此能够沿着一个或多个轴显着伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路可以适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US08394706B2

公开(公告)日：2013-03-12

申请号：US13270954

申请日：2011-10-11

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US08080280B1

公开(公告)日：2011-12-20

申请号：US11872749

申请日：2007-10-16

申请人： Robert K. Grubbs ,  Gregory R. Bogart ,  John A. Rogers

发明人： Robert K. Grubbs ,  Gregory R. Bogart ,  John A. Rogers

IPC分类号： C23C16/00

CPC分类号： C23C16/46 ,  C23C16/45525

摘要： Methods are described for making nanostructures that are mechanically, chemically and thermally stable at desired elevated temperatures, from nanostructure templates having a stability temperature that is less than the desired elevated temperature. The methods comprise depositing by atomic layer deposition (ALD) structural layers that are stable at the desired elevated temperatures, onto a template employing a graded temperature deposition scheme. At least one structural layer is deposited at an initial temperature that is less than or equal to the stability temperature of the template, and subsequent depositions made at incrementally increased deposition temperatures until the desired elevated temperature stability is achieved. Nanostructure templates include three dimensional (3D) polymeric templates having features on the order of 100 nm fabricated by proximity field nanopatterning (PnP) methods.

摘要翻译： 描述了用于制备在所需高温下机械，化学和热稳定的纳米结构的方法，所述纳米结构具有的稳定性温度低于所需升高的温度。 所述方法包括通过使用渐变温度沉积方案的模板将在期望的高温下稳定的原子层沉积（ALD）结构层沉积到模板上。 至少一个结构层在小于或等于模板的稳定温度的初始温度下沉积，随后在逐渐增加的沉积温度下进行沉积，直至实现所需的高温稳定性。 纳米结构模板包括通过接近场纳米图案（PnP）方法制造的具有大约100nm的特征的三维（3D）聚合物模板。

公开(公告)号：US07982296B2

公开(公告)日：2011-07-19

申请号：US12564566

申请日：2009-09-22

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L23/02

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。