公开(公告)号：US09883592B2

公开(公告)日：2018-01-30

申请号：US14846084

申请日：2015-09-04

申请人： IBIDEN CO., LTD.

发明人： Toshiki Furutani ,  Yukinobu Mikado ,  Toyotaka Shimabe ,  Shinobu Kato

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/10 ,  H05K3/30 ,  H05K1/11 ,  H01L23/00 ,  H05K3/46

CPC分类号： H05K1/186 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15153 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/116 ,  H05K1/185 ,  H05K3/10 ,  H05K3/30 ,  H05K3/306 ,  H05K3/4697 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49146

摘要： A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm.

公开(公告)号：US09844151B2

公开(公告)日：2017-12-12

申请号：US14492424

申请日：2014-09-22

申请人： IBIDEN CO., LTD.

发明人： Teruyuki Ishihara ,  Michimasa Takahashi

IPC分类号： H05K3/36 ,  H05K3/00

CPC分类号： H05K3/368 ,  H05K3/0097 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/1484 ,  Y10T29/49126

摘要： A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

公开(公告)号：US20170303396A1

公开(公告)日：2017-10-19

申请号：US15487560

申请日：2017-04-14

申请人： IBIDEN CO., LTD.

发明人： Hiroyuki Nishioka ,  Shinsuke Ishikawa

IPC分类号： H05K1/11 ,  H05K3/28 ,  H05K3/00 ,  H05K1/03 ,  G03F7/40 ,  G03F7/038 ,  G03F7/031 ,  G03F7/16 ,  G03F7/09 ,  G03F7/039 ,  G03F7/20 ,  G03F7/32

CPC分类号： H05K1/113 ,  G03F7/028 ,  G03F7/031 ,  G03F7/038 ,  G03F7/039 ,  G03F7/094 ,  G03F7/095 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/32 ,  G03F7/40 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/112 ,  H05K3/0055 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0195 ,  H05K2201/0269 ,  H05K2203/0776

摘要： A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.

公开(公告)号：US20170303394A1

公开(公告)日：2017-10-19

申请号：US15487652

申请日：2017-04-14

申请人： IBIDEN CO., LTD.

发明人： Hiroyuki NISHIOKA ,  Katsuya Takagi ,  Hiroaki Uno ,  Satoru Katada

IPC分类号： H05K1/09 ,  B32B37/14 ,  H05K3/46 ,  B32B7/02 ,  B32B15/20 ,  H05K1/03

CPC分类号： H05K1/09 ,  B32B7/02 ,  B32B15/20 ,  B32B37/14 ,  B32B37/144 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/538 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/032 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/4644

摘要： A printed wiring board includes a laminated base material including a surface conductor layer, a conductor layer, an interlayer insulating layer interposed between the surface conductor layer and the conductor layer, and an internal bonding layer interposed between the interlayer insulating layer and the surface conductor layer and/or conductor layer, and a solder resist layer laminated on a surface of the laminated base material such that the solder resist layer is covering the surface conductor layer. The internal bonding layer has a surface in contact with the interlayer insulating layer such that the surface of the internal bonding layer has arithmetic average roughness Ra in a range of 100 nm or more and 300 nm or less, and the surface conductor layer has a surface on a solder resist layer side such that the surface of the surface conductor layer has arithmetic average roughness Ra of less than 100 nm.

公开(公告)号：US09793219B2

公开(公告)日：2017-10-17

申请号：US15040129

申请日：2016-02-10

申请人： IBIDEN CO., LTD.

发明人： Keisuke Shimizu

IPC分类号： H01L21/66 ,  H01L21/00 ,  H01L29/40 ,  H01L23/52 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/8203 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15313

摘要： A wiring board includes a base substrate, a semiconductor element embedded in the substrate and having active and non-active surfaces such that the semiconductor has a terminal on the active surface, a first build-up layer including an insulating layer and first conductor pads such that the first conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate, and a second build-up layer including an insulating layer and second conductor pads such that the second conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate. The insulating layer in the first build-up includes resin material and reinforcing material, the insulating layer in the second build-up includes resin material and reinforcing material, and the first conductor pads is embedded in the insulating layer in the first build-up.

公开(公告)号：US20170265299A1

公开(公告)日：2017-09-14

申请号：US15452775

申请日：2017-03-08

申请人： IBIDEN CO., LTD.

发明人： Katsutoshi KITAGAWA

IPC分类号： H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  H05K1/02

CPC分类号： H05K1/111 ,  H05K1/028 ,  H05K1/118 ,  H05K3/0011 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y02P70/611

摘要： A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.

公开(公告)号：US20170256470A1

公开(公告)日：2017-09-07

申请号：US15451473

申请日：2017-03-07

申请人： IBIDEN CO., LTD.

发明人： Hajime SAKAMOTO ,  Keisuke SHIMIZU

IPC分类号： H01L23/16 ,  H01L21/54 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/31

CPC分类号： H01L23/16 ,  H01L21/4857 ,  H01L21/54 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1432 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/18162

摘要： A wiring substrate includes insulating layers including a first insulating layer such that the first insulating layer is positioned at one end of the insulating layers in lamination direction and has an accommodating portion through the first insulating layer, conductive layers laminated on the insulating layers and including a first conductive layer formed on one end side of the first insulating layer in the lamination direction and a second conductive layer formed on the opposite side, and a semiconductor element accommodated in the accommodating portion of the first insulating layer. The insulating layers include the first insulating layer including reinforcing material and a second insulating layer laminated on the first insulating layer such that the second insulating layer is covering the second conductive layer and the semiconductor element and filling gap formed between the first insulating layer and semiconductor element in the accommodating portion and does not contain reinforcing material.

公开(公告)号：US20170223816A1

公开(公告)日：2017-08-03

申请号：US15421618

申请日：2017-02-01

申请人： IBIDEN CO., LTD.

发明人： Takahisa HIRASAWA ,  Kiyotaka TSUKADA

IPC分类号： H05K1/02 ,  H05K3/32 ,  H05K1/14 ,  H05K1/09

CPC分类号： H05K1/147 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4046 ,  H05K2201/10242

摘要： A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal block including a welding base material and positioned such that the metal block is penetrating through the flexible insulating layer and the conductor layer.

公开(公告)号：US20170173574A1

公开(公告)日：2017-06-22

申请号：US15451415

申请日：2017-03-07

申请人： IBIDEN CO., LTD.

发明人： Shunpei ENOSHITA ,  Satoshi SHINOHARA

IPC分类号： B01J35/04 ,  B01J27/224 ,  B28B3/20 ,  B28B3/26 ,  B01D46/24 ,  B01D53/94

CPC分类号： B01J35/04 ,  B01D46/247 ,  B01D46/2474 ,  B01D53/94 ,  B01D2046/2481 ,  B01D2046/2488 ,  B01D2255/1021 ,  B01D2255/1023 ,  B01D2255/1025 ,  B01D2255/2022 ,  B01D2255/2027 ,  B01D2255/2042 ,  B01J27/224 ,  B28B3/20 ,  B28B3/269 ,  B28B2003/203 ,  C04B35/565 ,  C04B38/0006 ,  C04B2111/00793 ,  C04B2111/0081 ,  C04B2235/3826 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5472 ,  F01N3/0222 ,  F01N2330/32 ,  F01N2330/34 ,  Y02T10/20 ,  C04B38/085 ,  C04B38/0655

摘要： Provided is a honeycomb fired body in which the pressure loss in the initial state where PM has not accumulated is sufficiently low, the strength is sufficiently high, and the heat capacity is not small. The honeycomb fired body of the present invention is a honeycomb fired body including a plurality of cells in each of which one end is plugged and which serve as channels of exhaust gas, and porous cell partition walls that define the cells, wherein the honeycomb fired body is formed of SiC, the plurality of cells include peripheral cells located at an outermost peripheral region of the honeycomb fired body and inner cells located more inward than the peripheral cells, all the inner cells have the same cross-sectional shape that is a rectangle in a plane perpendicular to the longitudinal direction thereof, each peripheral cell is defined by the cell partition walls and an outer wall forming a periphery of the honeycomb fired body, the cell partition walls in contact with the outer wall each have a thick wall region where the wall thickness gradually increases toward the outer wall, the cross-sectional shape of the peripheral cells in a plane perpendicular to the longitudinal direction thereof is a shape formed by reducing the rectangular cross-sectional shape of the inner cells to obtain a reduced rectangle and chamfering or rounding two corners of the reduced rectangle, the cross-sectional area of each peripheral cell in a plane perpendicular to the longitudinal direction thereof is 60 to 80% of the cross-sectional area of each inner cell in a plane perpendicular to the longitudinal direction thereof, the cell partition walls include inter-peripheral-cell cell partition walls each located between the peripheral cells and inter-inner-cell cell partition walls each located between the inner cells, and the minimum thickness of the inter-peripheral-cell cell partition walls is greater than the thickness of the inter-inner-cell cell partition walls.

公开(公告)号：US20170171974A1

公开(公告)日：2017-06-15

申请号：US15375297

申请日：2016-12-12

申请人： IBIDEN CO., LTD.

发明人： MICHIMASA TAKAHASHI ,  KATSUTOSHI KITAGAWA

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/46 ,  H05K3/42 ,  H05K3/00 ,  H05K3/40

CPC分类号： H05K1/115 ,  H05K1/0206 ,  H05K3/4007 ,  H05K3/42 ,  H05K2203/0733

摘要： A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.