公开(公告)号：US07955411B2

公开(公告)日：2011-06-07

申请号：US11964827

申请日：2007-12-27

申请人： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

发明人： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC分类号： B32B5/16 ,  B22F1/02

CPC分类号： H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

摘要翻译： 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20090244868A1

公开(公告)日：2009-10-01

申请号：US12379644

申请日：2009-02-26

申请人： Toshiaki Morita ,  Yusuke Yasuda ,  Eiichi Ide

发明人： Toshiaki Morita ,  Yusuke Yasuda ,  Eiichi Ide

IPC分类号： H05K7/00 ,  H01B1/08 ,  H05K1/09 ,  H01L23/522

CPC分类号： H01L23/488 ,  C04B37/026 ,  C04B2237/06 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/368 ,  H01L23/047 ,  H01L23/24 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/09 ,  H05K3/321 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention is directed to enhancing the bonding reliability of a bonding portion between an Al electrode of a semiconductor device and a bonding material having metal particles as a main bonding agent. In the semiconductor device, a semiconductor element and an Al electrode are connected to each other with a bonding layer made of Ag or Cu interposed therebetween, and the bonding layer and the Al electrode are bonded to each other with an amorphous layer interposed therebetween. It is possible to obtain excellent bonding strength to the Al electrode by performing a bonding process in atmospheric air by using a bonding material including a metal oxide particle with an average diameter of 1 nm to 50 μm, an acetic acid- or formic acid-based compound, and a reducing agent made of an organic material.

摘要翻译： 本发明旨在提高半导体器件的Al电极和具有金属粒子的接合材料作为主要粘合剂的接合部分的接合可靠性。 在半导体器件中，半导体元件和Al电极通过其间插入有Ag或Cu的接合层彼此连接，并且接合层和Al电极通过非晶层彼此接合。 通过使用包含平均直径为1nm〜50μm的金属氧化物粒子的接合材料，以乙酸或甲酸为基准的粘合剂，通过在大气中进行接合处理，能够对Al电极获得优异的接合强度 化合物和由有机材料制成的还原剂。

公开(公告)号：US07589400B2

公开(公告)日：2009-09-15

申请号：US11206166

申请日：2005-08-18

申请人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

发明人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H02M7/003 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/16245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/0401

摘要： The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer.Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.

摘要翻译： 逆变器具有用于导通或切断电流的多个臂，并且每个臂具有开关装置和用于连接开关装置的第一和第二布线层。 每个臂的第一和第二布线层分别形成在绝缘基板上，并且开关装置的一个面固定到第一布线层，并且第二布线层和开关装置的另一个面通过层叠电连接 导体和层状导体具有第一和第二连接，并且所述层叠导体的第一连接固定到所述开关装置的另一面，并且所述层叠导体的第二连接固定到所述第二布线层。 由此，可以实现逆变器的大电流，并且可以提高逆变器或车辆驱动单元的组装能力。

公开(公告)号：US07579805B2

公开(公告)日：2009-08-25

申请号：US10587283

申请日：2004-01-26

申请人： Atsushi Saito ,  Katsuhiro Higuchi ,  Osamu Otsuka ,  Hidekazu Nishidai ,  Hiroshi Houzouji ,  Toshiaki Morita ,  Yoshimasa Takahashi ,  Toshiya Sato

发明人： Atsushi Saito ,  Katsuhiro Higuchi ,  Osamu Otsuka ,  Hidekazu Nishidai ,  Hiroshi Houzouji ,  Toshiaki Morita ,  Yoshimasa Takahashi ,  Toshiya Sato

IPC分类号： H02P27/04

CPC分类号： H02M7/003 ,  H05K7/20927

摘要： A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section and a radiator is provided. The semiconductor device is connected to the cooling system and is cooled. A variation width (ΔT1) of temperature controlled by the cooling system through the heating section and the radiator is smaller than a temperature variation (ΔT2) of the refrigerant caused by variations in operating conditions of the semiconductor device (ΔT1≦ΔT2).

摘要翻译： 可以延长安装部件的寿命的半导体器件。 提供一种用于通过加热部和散热器控制制冷剂的温度的冷却系统。 半导体器件连接到冷却系统并被冷却。 由冷却系统通过加热部和散热器控制的温度的变化宽度（DeltaT1）小于由半导体器件的工作条件变化（DeltaT1 <= DeltaT2）引起的制冷剂的温度变化（DeltaT2）。

公开(公告)号：US07449786B2

公开(公告)日：2008-11-11

申请号：US11357024

申请日：2006-02-21

申请人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

发明人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/351 ,  H01L2924/01046 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48744 ,  H01L2924/00015 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/00013 ,  H01L2924/01006

摘要： A semiconductor device with improved the adhesion between bonding pads and ball portions of gold wires is provided to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 μm and the diameter of the ball portion is smaller than 55 μm or the diameter of the wire portion of each gold wire is not larger than 25 μm.

摘要翻译： 提供了提高接合焊盘和金线的球部之间的粘附性的半导体器件，以提高半导体器件的可靠性。 约1重量％ 用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。 在金线的电极和球部之间的接合部分中，抑制了Au和Al的相互扩散，以防止在PCT（压力锅试验）之后形成Au 4 Al。 因此，即使当电极焊盘的间距小于65μm并且球部的直径小于55μm或每个金线的线部分的直径不大于25μm时，也获得期望的接合强度 。

公开(公告)号：US07289869B2

公开(公告)日：2007-10-30

申请号：US10553755

申请日：2004-03-30

申请人： Toshiaki Morita

发明人： Toshiaki Morita

IPC分类号： G06F19/00

CPC分类号： D04B15/48 ,  D04B15/50

摘要： An object of the invention is to be capable of easily acquiring a fabric having a desired feeling using a stretch yarn. A knitting controller (20) controls a carriage (5), and the like, according to knitting data and control data stored in a memory (21). Data representing relationships between a gauge texture and a stitch loop length being obtained after knitting and the relationships between these gauge texture and stitch loop length and the length and tension of the stretch yarn (2) being fed at the time of knitting are collected previously and stored in the memory (21) in the form of table data. The knitting controller (20) sets control target values of the length and tension of the stretch yarn (2) for a yarn feed controller (23) such that a gauge texture and a stitch loop length being specified by an input unit (22) can be attained, with reference to the table data stored in the memory (21).

摘要翻译： 本发明的目的是能够使用弹力纱线容易地获得具有期望感觉的织物。 编织控制器（20）根据存储在存储器（21）中的编织数据和控制数据来控制滑架（5）等。 预先收集表示编织后得到的规格织构和针迹圈长度之间的关系的数据，以及这些织物编织线圈长度之间的关系以及在针织时被馈送的弹力纱线（2）的长度和张力， 以表数据的形式存储在存储器（21）中。 编织控制器（20）设定用于喂纱控制器（23）的拉伸纱线（2）的长度和张力的控制目标值，使得由输入单元（22）指定的规格结构和针迹圈长度可以 参考存储在存储器（21）中的表格数据。

公开(公告)号：US20070040250A1

公开(公告)日：2007-02-22

申请号：US11589895

申请日：2006-10-31

申请人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Toshiaki Morita ,  Kazuya Takahashi ,  Munehisa Kishimoto ,  Shigeru Ishii ,  Toshinori Hirashima ,  Yasushi Takahashi ,  Toshiyuki Hata ,  Hiroshi Sato ,  Keiichi Ookawa

发明人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Toshiaki Morita ,  Kazuya Takahashi ,  Munehisa Kishimoto ,  Shigeru Ishii ,  Toshinori Hirashima ,  Yasushi Takahashi ,  Toshiyuki Hata ,  Hiroshi Sato ,  Keiichi Ookawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49555 ,  H01L21/4814 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/97 ,  H01L29/7833 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/29011 ,  H01L2224/29015 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/73253 ,  H01L2224/75251 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K3/3426 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2224/29139 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2924/00012

摘要： A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

公开(公告)号：US20070011906A1

公开(公告)日：2007-01-18

申请号：US10569281

申请日：2004-08-24

申请人： Toshiaki Morita

发明人： Toshiaki Morita

IPC分类号： F26B13/06 ,  F26B13/10

CPC分类号： F26B21/024 ,  F26B3/283

摘要： A dryer apparatus for use in a woven and knitted fabric is constructed such that a first drying rack disposed at an upper step, and at least one step of a second drying rack disposed at a lower step thereof are provided in a frame. Each of the drying racks is formed of a drying surface having ventilation. A first drying device is disposed above the first drying rack, and a second drying device is disposed above the second rack. Each of the drying devices is formed of a drying irradiation surface for irradiating heat ray and/or heated air, and is constructed to be movable for reciprocation along the drying surface of the drying rack by means of a driving device. The drying device disposed above the second drying rack is constructed to be able to switch a direction of the drying irradiation surface from downside to upside and to be able to dry from both of an upper and a lower surface of the first drying rack.

摘要翻译： 一种用于织造和编织织物的干燥设备被构造成使得设置在上部台阶处的第一干燥架和设置在其下部的第二干燥架的至少一个台阶设置在框架中。 每个干燥架由具有通风的干燥表面形成。 第一干燥装置设置在第一干燥架上方，第二干燥装置设置在第二机架的上方。 每个干燥装置由用于照射热射线和/或加热空气的干燥照射表面形成，并且被构造成可通过驱动装置沿着干燥架的干燥表面往复运动。 设置在第二干燥架上方的干燥装置被构造成能够将干燥照射表面的方向从下侧切换到上侧，并且能够从第一干燥架的上表面和下表面两者干燥。

公开(公告)号：US20060138679A1

公开(公告)日：2006-06-29

申请号：US11357024

申请日：2006-02-21

申请人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

发明人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

IPC分类号： H01L23/52

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/351 ,  H01L2924/01046 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48744 ,  H01L2924/00015 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/00013 ,  H01L2924/01006

摘要： A semiconductor device with improved the adhesion between bonding pads and ball portions of gold wires is provided to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 μm and the diameter of the ball portion is smaller than 55 μm or the diameter of the wire portion of each gold wire is not larger than 25 μm.

摘要翻译： 提供了提高接合焊盘和金线的球部之间的粘附性的半导体器件，以提高半导体器件的可靠性。 约1重量％ 用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。 在金线的电极和球部之间的接合部分中，抑制了Au和Al的相互扩散，以防止在PCT（压力锅试验）之后形成Au 4 Al。 因此，即使当电极焊盘的间距小于65μm并且球部的直径小于55μm或每个金线的线部分的直径不大于25μm时，也获得期望的接合强度 。

公开(公告)号：US20060071860A1

公开(公告)日：2006-04-06

申请号：US11206166

申请日：2005-08-18

申请人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

发明人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

IPC分类号： H01Q1/38

CPC分类号： H02M7/003 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/16245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/0401

摘要： The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer. Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.