METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE
    2.
    发明申请
    METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE 有权
    用于密封的压电材料,压电元件的密封密封方法和压电元件

    公开(公告)号:US20120212106A1

    公开(公告)日:2012-08-23

    申请号:US13453580

    申请日:2012-04-23

    IPC分类号: H01L41/053

    摘要: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 μm to 1.0 μm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

    摘要翻译: 本发明是一种用于密封的金属膏,其包含金属粉末和有机溶剂,其特征在于,金属粉末是选自金粉末,银粉末,铂粉末和钯粉末中的一种或多种金属粉末,其具有 纯度为99.9重量%以上,平均粒径为0.1〜1.0微米,金属粉末的含量为85〜93重量%,有机溶剂的比例为5〜15 重量%。 作为使用这种金属膏的密封方法,有一种施加和干燥金属糊料的方法,在80〜300℃下烧结,形成金属粉末烧结体,然后在加热的同时加压基材和帽部件 金属粉末烧结体。

    METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE
    8.
    发明申请
    METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE 有权
    用于密封的压电材料,压电元件的密封密封方法和压电元件

    公开(公告)号:US20090309459A1

    公开(公告)日:2009-12-17

    申请号:US12373311

    申请日:2008-03-18

    摘要: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 μm to 1.0 μm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

    摘要翻译: 本发明是一种用于密封的金属膏,其包含金属粉末和有机溶剂,其特征在于,金属粉末是选自金粉末,银粉末,铂粉末和钯粉末中的一种或多种金属粉末,其具有 纯度为99.9重量%以上,平均粒径为0.1〜1.0微米,金属粉末的含量为85〜93重量%,有机溶剂的比例为5〜15 重量%。 该金属糊料优选含有根据本申请方法的添加剂,如表面活性剂。 作为使用这种金属膏的密封方法,有一种施加和干燥金属糊料的方法,在80〜300℃下烧结,形成金属粉末烧结体,然后在加热的同时加压基材和帽部件 金属粉末烧结体。